thanks for the details. i completely missed HLMC.. what about Finfet process ?? they were planning in 2020. completed R&D too but stopped due to sanctions..
Last edited:
Chinese semiconductor thread II
- Thread starter vincent
- Start date
From what I know, first off, SMIC’s annual report mentioned that SMSC is a consolidated subsidiary of SMIC. Even though they own less than 50%, they have control, so it’s consolidated. SMIC hasn’t hidden SMSC’s revenue, and their overall revenue has been growing fast year-over-year. But, the growth rate could have been higher if it weren’t for the ongoing price drops in the 55nm and lower-end processes over the past couple of years (heard that SMIC’s customers take on the yield losses for their advanced processes). And second, HLMC has managed to develop its N7 node, but the production volume is still quite small.
Referring to the highlighted section in SMIC's 2021 annual report (since which SMIC has stopped disclosing specific details for each facility in subsequent reports), it states, "In view of the fact that SMIC has the right to appoint the majority of the directors of SMSC and those directors have the full discretion to veto certain major matters deliberated at the board meetings of SMSC, SMSC is considered a subsidiary of the Company."
China Micro Corporation (AMEC): It is expected that the cumulative new orders this year will reach 11-13 billion yuan
On August 23, China Micro Corporation issued an announcement stating that the company focuses on high-end semiconductors and pan-semiconductor equipment, insists on innovation and breakthroughs, and its performance continues to grow rapidly, with orders, revenue, and product deliveries all reaching historical highs.
In the first half of 2024, AMEC achieved a year-on-year revenue growth of 36.46% to 3.448 billion yuan; new orders of 4.7 billion yuan, a year-on-year increase of about 40.3%. The company's newly developed thin-film LPCVD equipment in the past two years received new orders of 168 million yuan in the first half of the year, and new products have begun to start volume production. The company's equipment products continue to make breakthroughs in advanced packaging and other fields, and continue to receive customer orders.
AMEC said that the company currently has sufficient orders and expects the cumulative new orders in the first three quarters of 2024 to exceed 7.5 billion yuan, a year-on-year increase of more than 50%; the company expects the cumulative new orders in 2024 to reach 11-13 billion yuan. The company expects the number of units shipped in 2024 to increase by more than 200% year-on-year, laying a good foundation for revenue recognition this year.
Jingsheng Electromechanical Thinning Machine Achieves Stable Processing of 12-inch 30μm Ultra-thin Wafers
Recently, the new WGP12T thinning and polishing equipment developed by the Polishing Equipment Research Institute of Jingsheng Electromechanical R&D Center has successfully achieved stable processing of 12-inch 30μm ultra-thin wafers. The successful breakthrough of this technology marks another important step for Jingsheng Electromechanical in the field of semiconductor equipment manufacturing, providing strong support for the technological progress and independent control of China's semiconductor industry.
Ultra-thin wafers have become one of the key materials for the development of the current semiconductor industry due to their high integration, low power consumption and excellent performance. As semiconductor processes enter the 2.5D/3D era, the thickness of wafers is getting thinner and thinner, which places extremely high demands on equipment accuracy and process control. Jingsheng Electromechanical R&D team quickly responded to market demand and quickly carried out a series of technical optimizations and process improvements on WGP12T, so that the wafers can be thinned and polished to a thickness of less than 30μm on the equipment, ensuring the surface flatness and roughness of the wafers, while successfully solving the problems of deformation, cracks, contamination, etc. that occur during the thinning process of ultra-thin wafers, truly realizing the efficient and stable processing technology of 30μm ultra-thin wafers, and once again adding new chips to the company in the competition in the global semiconductor equipment market.
Ultra-thin wafers have become one of the key materials for the development of the current semiconductor industry due to their high integration, low power consumption and excellent performance. As semiconductor processes enter the 2.5D/3D era, the thickness of wafers is getting thinner and thinner, which places extremely high demands on equipment accuracy and process control. Jingsheng Electromechanical R&D team quickly responded to market demand and quickly carried out a series of technical optimizations and process improvements on WGP12T, so that the wafers can be thinned and polished to a thickness of less than 30μm on the equipment, ensuring the surface flatness and roughness of the wafers, while successfully solving the problems of deformation, cracks, contamination, etc. that occur during the thinning process of ultra-thin wafers, truly realizing the efficient and stable processing technology of 30μm ultra-thin wafers, and once again adding new chips to the company in the competition in the global semiconductor equipment market.
Jingsheng Electromechanical: 2024Q2 Profits Under Pressure, Semiconductor Equipment Layout Continues to Improve
Event: The company released its 2024 semi-annual report. In the first half of 2024, the company achieved revenue of 10.147 billion yuan, a year-on-year increase of 20.71%, net profit attributable to the parent company of 2.096 billion yuan, a year-on-year decrease of 4.97%, and net profit attributable to the parent company of 2.094 billion yuan, a year-on-year increase of 1.02%.
Revenue continued to grow, and Q2 profit was under pressure. 2024Q2 single-quarter revenue was 5.638 billion yuan, a year-on-year increase of 17.29%, net profit attributable to the parent company of 1.027 billion yuan, a year-on-year decrease of 22.19%, and net profit attributable to the parent company of 992 million yuan, a year-on-year decrease of 17.20%. The Q2 profit side was under pressure. The
The layout of semiconductor equipment continues to improve.
Silicon wafer equipment: On the silicon wafer side, we have successfully developed a 12-inch dry-in and dry-out edge polishing machine and a 12-inch double-sided.
Tinning machine, and have successively entered the customer verification stage. (2) Advanced process field: We have developed 8-12-inch decompression silicon epitaxial equipment, LPCVD and ALD equipment, and developed a number of 12-inch wafer thinning equipment for advanced packaging.
Power semiconductor related equipment: We have developed 8-12-inch atmospheric pressure silicon epitaxial equipment, as well as 6-8-inch silicon carbide crystal growth equipment, slicing equipment, thinning equipment, polishing equipment, epitaxial equipment, etc., and gradually realized the domestic substitution of silicon carbide epitaxial equipment.
this is the big deal. You have to get new order in order to keep investing in R&D and production. This is a feedback loop.
HLMC will be bought back by Huahong in the near future, they mentioned it in one of the earning calls. They are going to build a new fab for Finfet stuff I think.
But it is more likely that Huawei will get its Finfet fab going before HLMC
Domestic High Density Plasma growing in China.
The installed capacity of Tuojing HDPCVD reaction chambers has exceeded 70, and the number of mass-produced machines is far ahead in China
Since the end of 2021, Tuojing launched the first HDPCVD in China to the client. It has now been upgraded to a new hexagonal platform. The product performance has reached the industry-leading level, and the efficiency per square meter is the best in the industry. With its R&D strength and advanced design concepts, it has won praise and trust from customers, and its market share has continued to rise. Since the first unit was verified, customers have continued to increase their purchases of HDPCVD equipment. As of now, the cumulative installed capacity of reaction chambers has exceeded 70, and it is expected to exceed 100 by the end of 2024.
TuoJing's HDPCVD equipment Hesper product adopts a hexagonal platform (TS-300S) and can be equipped with 5 reaction chambers, achieving high production capacity, high operating rate, easy maintenance and excellent film filling ability. It also has functions such as wafer residual adsorption force monitoring system, stable electrostatic adsorption force and automatic temperature control mode. Hesper is mainly used for various channel dielectric filling such as STI, ILD, IMD and Passivation.
