Chinese semiconductor thread II

[tokenanalyst]

The latest progress of the silicon carbide project in Chongqing​

It is reported that the project mainly constructs production plants and factory facilities for silicon and silicon carbide components, which are consumables for integrated circuit core equipment. It is expected to achieve a silicon component production capacity of 170,000 pieces/year and a silicon carbide component production capacity of 80,000 pieces/year.​

 

[gotodistance]

China achieves new progress in building High Energy Photon Source​

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There's not much reaction to this huge news.

The HEPS project is expected to be ready for operation by the end of 2025

SSMB-EUV

 

[ansy1968]

There's not much reaction to this huge news.

The HEPS project is expected to be ready for operation by the end of 2025

SSMB-EUV

The expected Chinese EUV will use a LPP laser speculated at 400kw next year, SSMB will be one of many option together with FEL in the future maybe in 2028 as it is a new technology, going from a proof of concept to commercial use may take at least 3 years to materialized.

 

[tphuang]

The first batch of process equipment for Hua Hong Wuxi Phase II 12-inch production line was successfully moved in​

On August 22, the first batch of process equipment moving-in ceremony was held for the 12-inch production line of the second phase project of Hua Hong Wuxi Integrated Circuit R&D and Manufacturing Base.
It is understood that on April 20 this year, the main plant of FAB9 of Huahong Manufacturing (Wuxi) Project was fully capped. This project is the second phase of Huahong Wuxi Integrated Circuit R&D and Manufacturing Base, with a total investment of US$6.7 billion. It will build a 12-inch specialty process production line with a process level of 65/55-40nm and a monthly production capacity of 83,000 pieces.
Currently, Hua Hong Semiconductor has built three 8-inch wafer fabs in Jinqiao and Zhangjiang, Shanghai, with a monthly production capacity of about 180,000 wafers. In addition, a 12-inch wafer fab with a monthly production capacity of 94,500 wafers ("Hua Hong Wuxi Phase I") has been built in Wuxi High-tech Industrial Development Zone. This is not only the world's leading 12-inch specialty process production line, but also the world's first 12-inch power device foundry production line. Currently, the construction of Hua Hong Wuxi Phase II 12-inch chip production line is being promoted.
At present, the global 12-inch wafer production construction has become a major trend. While Hua Hong Semiconductor is constantly improving its technical strength, it is also constantly expanding its 12-inch production capacity, striving to maintain its global leading position in the field of 12-inch specialty processes. According to the financial report released by Hua Hong on August 8, the sales revenue from 8-inch wafers and 12-inch wafers in the second quarter was US$245.5 million and US$233.0 million respectively, of which the sales revenue of 12-inch wafers increased from 42.8% in the same period last year to 48.7%.

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wow, this happened faster than expected. I was expecting it to take longer before equipments get moved into Fab 9. They really need this. the older nodes they were producing have too much competition. They have 100% utilization and can't make any money.

 

[Wahid145]

wow, this happened faster than expected. I was expecting it to take longer before equipments get moved into Fab 9. They really need this. the older nodes they were producing have too much competition. They have 100% utilization and can't make any money.

@curiouscat could you please have this article in pastebin? Wanna see what Digitimes write about the production capacity of the two fabs

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[tokenanalyst]

Bi-Directional and Operand-Controllable In-Memory Computing for Boolean Logic and Search Operations with Row and Column Directional SRAM (RC-SRAM)​

Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences.
University of Chinese Academy of Sciences.
​

Abstract​

The von Neumann architecture is no longer sufficient for handling large-scale data. In-memory computing has emerged as the potent method for breaking through the memory bottleneck. A new 10T SRAM bitcell with row and column control lines called RC-SRAM is proposed in this article. The architecture based on RC-SRAM can achieve bi-directional and operand-controllable logic-in-memory and search operations through different signal configurations, which can comprehensively respond to various occasions and needs. Moreover, we propose threshold-controlled logic gates for sensing, which effectively reduces the circuit area and improves accuracy. We validate the RC-SRAM with a 28 nm CMOS technology, and the results show that the circuits are not only full featured and flexible for customization but also have a significant increase in the working frequency. At VDD = 0.9 V and T = 25 °C, the bi-directional search frequency is up to 775 MHz and 567 MHz, and the speeds for row and column Boolean logic reach 759 MHz and 683 MHz.​

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[gelgoog]

On August 22, the first batch of process equipment moving-in ceremony was held for the 12-inch production line of the second phase project of Hua Hong Wuxi Integrated Circuit R&D and Manufacturing Base.​

Once all these fab expansions are over SMIC will have similar capacity to TSMC in 7nm and higher. Hua Hong will have similar capacity to UMC in 28nm and higher. Nexchip will have similar capacity to Powerchip.

So basically China will replicate whatever fabrication Taiwan has, except SMIC won't be able to do the EUV fabrication at 5nm and lower done at TSMC, Hua Hong does not have a 14nm FinFET process, Nexchip still needs a 28nm process.

 

[tphuang]

Once all these fab expansions are over SMIC will have similar capacity to TSMC in 7nm and higher. Hua Hong will have similar capacity to UMC in 28nm and higher. Nexchip will have similar capacity to Powerchip.

So basically China will replicate whatever fabrication Taiwan has, except SMIC won't be able to do the EUV fabrication at 5nm and lower done at TSMC, Hua Hong does not have a 14nm FinFET process, Nexchip still needs a 28nm process.

I think nexchip does have a 28nm process. See below for this expansion plans. This is wafers per year.

 

[gelgoog]

Nexchip has a 28nm process in its roadmap and is supposedly working on it. But still not in production.
Hua Hong's HLMC subsidiary also used to have a FinFET process in its roadmap many years ago but then it seemingly dropped out of sight.

 

[escobar]

Chinese Imports of Chip Gear Hit Record $26 Billion This Year

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