Chinese semiconductor thread II

OptimusLion

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Chengdu Neuron receives 100,000-piece order for automotive-grade TSN Ethernet switch chip

According to Anhui Luxin, Chengdu Neuron , an investment project of Luxin Wanneng Fund, recently signed a cooperation agreement with Beijing National New Energy Vehicle Technology Innovation Center. The automotive-grade TSN Ethernet switching chip received an order of 100,000 pieces and will be used in batches in vehicle gateways and other fields.

It is reported that Chengdu Neuron's automotive-grade Ethernet switch chip was successfully taped out in 2021 and has passed the automotive-grade ISO 26262 functional safety certification, with a functional safety level of ASIL-B, and passed the AEC-Q100 reliability certification, with a reliability level of Grade 2, becoming the first domestic automotive-grade Ethernet switch chip included in the Ministry of Industry and Information Technology's list of domestic automotive chips. Chengdu Neuron's automotive-grade Ethernet switch chip has been verified by mainstream manufacturers and has sufficient production capacity and stable supply capabilities.

According to Zhongxia Capital, in February 2024, Neuron Information Technology (Chengdu) Co., Ltd. completed a new round of exclusive investment of 100 million yuan by FAW Equity Investment (Tianjin) Co., Ltd., a subsidiary of FAW Group with a fund management scale of 30 billion yuan. Neuron Information Technology (Chengdu) Co., Ltd. was established in 2016 and is committed to the design and development of industrial network chips, building a 100% autonomous and controllable full IP industrial network, realizing the unification of industrial network protocols, and realizing the real-time integration of OT/IT services. (Proofread by Zhang Lin)
 

OptimusLion

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The top five chip equipment manufacturers are showing off: they cannot do without the Chinese market, with 43% of their revenue coming from China

In the chip industry, although design, manufacturing, packaging and testing are important, above these three key links are EDA/IP, semiconductor equipment, and semiconductor materials.

These three items are the most upstream industries in the chip industry. Without these three items, no matter who you are, you cannot design or manufacture chips. Without EDA/IP, you cannot design them; without equipment and materials, you cannot manufacture them.

These three items are mainly controlled by the United States, Japan and Europe, and they basically follow the lead of the United States.

Therefore, in recent years, the United States has suppressed China's semiconductor industry mainly by restricting semiconductor equipment. After all, once the equipment from the United States, Japan, and Europe is not allowed to be sold to China, China will not be able to manufacture chips because China's own equipment is not up to the task for the time being.

However, the US restrictions on these semiconductor equipment manufacturers selling equipment to China have also had a huge impact on these manufacturers.

Because a large part of these manufacturers' revenue comes from China, especially in recent years, the global chip industry has been in recession, and only China has been expanding production on a large scale, and demand has increased significantly, resulting in nearly half of their revenue coming from China.

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In the first half of 2024, the top five semiconductor equipment manufacturers in the world continued to announce data on their revenue sources, which was equivalent to a complete showdown: that is, they are currently inseparable from the Chinese market, and about 44% of their revenue comes from China.

The meaning is very clear, which is to tell the United States that if they do not sell equipment to China, they will suffer heavy losses and cannot bear it.

The five major chip equipment manufacturers are ASML of the Netherlands, Applied Materials of the United States, Lam Research, Tokyo Electron of Japan, and KLA-Tencor of the United States.

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The revenue of these five major equipment manufacturers in the first and second quarters of 2024, compared with the first quarter of 2023, is shown in the figure above. It can be seen that except for ASML, all of them are growing in 2024 compared with 2023.

Let’s first look at ASML. In the first and second quarters of 2024, mainland China contributed 49% of its revenue in both quarters, which is close to half.

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Let’s look at Applied Materials in the United States. In the first quarter, mainland China contributed 43% of its revenue, and in the second quarter it contributed 32%. Mainland China has always been its largest customer.

Next, let’s look at Lam Research. In the first quarter, mainland China contributed 42% of its revenue, which fell to 39% in the second quarter. Mainland China has always been its largest customer.

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Let’s take a look at Japan’s Tokyo Electron. In the first quarter, mainland China accounted for 47.4% of its revenue, and in the second quarter it was 49.9%, which means that mainland China accounted for half of its revenue.

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Data from American company CoreLogic shows that in the second quarter of 2024, mainland China accounted for 44% of its revenue, far ahead of other countries and regions, and China was its largest customer.

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Based on these five major manufacturers, it can be calculated that in the first half of 2024, the revenue contributed by mainland China accounted for about 43% of these five major manufacturers. China supports half of these five major chip equipment.

Therefore, for these five major chip equipment manufacturers, if they do not sell equipment to China, the losses will be really heavy. These five major manufacturers continue to publish these data, in fact, they are also telling the United States not to impose restrictions, otherwise everyone will be in trouble.
 

tphuang

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The digitimes article says they stopped procurement but not anything else so I think they may be continuing testing and development but won’t ship it in bulk for sales
my point is to not take digitimes as a gospel

please post the actual link in Chinese or post picture of the Chinese text. I have no idea how good this source is. And if you just continue to post sub-standard source, I'm going to be deleting things very quickly.

Guangli Microelectronics Integrated Circuit EDA Industrialization Base Project Completed

On August 21, the Guangli Micro Integrated Circuit EDA Industrialization Base project was completed.

The total investment of the project is about 345 million yuan. It is located in Puyan Unit, Binjiang District, Hangzhou, with a land area of 12.3 acres and a total construction area of about 32,000 square meters. It is positioned as the company's future headquarters building and R&D production base. After the project is completed, it can meet the R&D office needs of thousands of employees, thereby greatly improving the production capacity of WAT test equipment. By then, the project will become a domestic hardware and software R&D and production base with leading hardware conditions.

According to information, Hangzhou Guangli Microelectronics Co., Ltd. is a leading domestic supplier of integrated circuit EDA software and wafer-level electrical testing equipment. It focuses on chip yield improvement and electrical testing technology, providing EDA software, circuit IP, WAT electrical testing equipment and a complete set of solutions combined with chip yield improvement technology. It can achieve chip performance, yield and stability improvements throughout the entire product cycle from integrated circuit design to mass production, and its successful cases cover multiple integrated circuit process nodes
again, please post link

I have not seen you link any of these articles that you posted here. I'm warning you. If this practice keeps up, I'm going to be deleting all your posts.
 

tphuang

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9100, the actual highest density area is much higher than the theoretical density

View attachment 134548
that is not what this is saying.

Huawei's FinFet being 20% more dense than traditional Finfet design has been talked about for a year now. It's not any different than GAAFET design at same critical features dimensions being more dense than Finfet

I would certainly not link this to 9100. If SMIC in their latest process has adopted this (that's a big if), then it would apply to all their production, not just kirin-9100
 

tokenanalyst

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The first batch of process equipment for Hua Hong Wuxi Phase II 12-inch production line was successfully moved in​


On August 22, the first batch of process equipment moving-in ceremony was held for the 12-inch production line of the second phase project of Hua Hong Wuxi Integrated Circuit R&D and Manufacturing Base.
It is understood that on April 20 this year, the main plant of FAB9 of Huahong Manufacturing (Wuxi) Project was fully capped. This project is the second phase of Huahong Wuxi Integrated Circuit R&D and Manufacturing Base, with a total investment of US$6.7 billion. It will build a 12-inch specialty process production line with a process level of 65/55-40nm and a monthly production capacity of 83,000 pieces.
Currently, Hua Hong Semiconductor has built three 8-inch wafer fabs in Jinqiao and Zhangjiang, Shanghai, with a monthly production capacity of about 180,000 wafers. In addition, a 12-inch wafer fab with a monthly production capacity of 94,500 wafers ("Hua Hong Wuxi Phase I") has been built in Wuxi High-tech Industrial Development Zone. This is not only the world's leading 12-inch specialty process production line, but also the world's first 12-inch power device foundry production line. Currently, the construction of Hua Hong Wuxi Phase II 12-inch chip production line is being promoted.
At present, the global 12-inch wafer production construction has become a major trend. While Hua Hong Semiconductor is constantly improving its technical strength, it is also constantly expanding its 12-inch production capacity, striving to maintain its global leading position in the field of 12-inch specialty processes. According to the financial report released by Hua Hong on August 8, the sales revenue from 8-inch wafers and 12-inch wafers in the second quarter was US$245.5 million and US$233.0 million respectively, of which the sales revenue of 12-inch wafers increased from 42.8% in the same period last year to 48.7%.

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