HH group Chief Engineer Zhao Yuhang announced FinFet process in January, 2020.. R&D of FinFet was completed back then..
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sanctions stopped HH FinFet process.. so they decided to postpone the program until fully domestic immersion line come online.. now all respective tools have successfully developed. recently FinFet capable photoresist also entered in mass production. so it is matter of time.. i believe we could hear something in 2025..
as you see the pattern, SMIC/HH/Nexchip big three climbing up the ladder step by step.. Nexchip 28nm immersion line in 2025. SMIC 7nm and below.. so HH bound to enter in Finfet process. this is in correlation with domestic tools moving up in value added supply chain..
Regarding HH, there are 2 companies:
- Shanghai Hua Hong Semiconductor 華虹半導體 (
)
- Shanghai Huali Microelectronics 上海华力 (
)
Currently Hua Hong only has process up to 55/65 nm
Instead HLMC (that is a JV with HH)
currently :
At the process node, it has successfully mass-produced 28nm low-power, 28nm RF process and 28nm high-performance streamlined enhanced version process technology (28nm HKC+). Shanghai Huali is gradually expanding its 28nm process technology capabilities and launching more features Process technology: 28nm high-voltage process, 28nm image sensor and 28nm embedded flash memory process, etc. In addition, Huali's 22nm process has also completed research and development and entered the preliminary mass production stage.
To note that revenues and wafer capacity of HLMC are
not reported in quarterly reports of HH.
Also to note HLMC is
not publicly traded (so they don't have to publish results)
BTW the same is true for SMIC, where their 7nm fab is legally under a different JV company Semiconductor Manufacturing South China Corp (SMSC). A company that is
not traded and for which their capacity/revenue
don't end up in SMIC quarterly results!
IOW China hides both capacity and revenues for 28nm (HH) and more advanced nodes!
I'd say it makes totally sense they do this, for the time being....