Chinese semiconductor thread II

Wahid145

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Nexchip has a 28nm process in its roadmap and is supposedly working on it. But still not in production.
Hua Hong's HLMC subsidiary also used to have a FinFET process in its roadmap many years ago but then it seemingly dropped out of sight.
I kept looking for HuaHong FinFET for ages and still don't see anything. Really don't know if they stopped R&D on it or they are just hiding it due to impending us sanctions
 

sunnymaxi

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I kept looking for HuaHong FinFET for ages and still don't see anything. Really don't know if they stopped R&D on it or they are just hiding it due to impending us sanctions
HH group Chief Engineer Zhao Yuhang announced FinFet process in January, 2020.. R&D of FinFet was completed back then..

FZlNJaxaQAA9zi-.jpg

sanctions stopped HH FinFet process.. so they decided to postpone the program until fully domestic immersion line come online.. now all respective tools have successfully developed. recently FinFet capable photoresist also entered in mass production. so it is matter of time.. i believe we could hear something in 2025..

as you see the pattern, SMIC/HH/Nexchip big three climbing up the ladder step by step.. Nexchip 28nm immersion line in 2025. SMIC 7nm and below.. so HH bound to enter in Finfet process. this is in correlation with domestic tools moving up in value added supply chain..
 
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tokenanalyst

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Shaanxi Optoelectronics Pioneer Institute Technology Co., Ltd. (referred to as "Optoelectronics Pioneer Institute") announced the completion of a B round of financing of several hundred million yuan.

The Optoelectronics Pioneer Institute will comprehensively upgrade the advanced photonic device engineering innovation platform in 2024. On the one hand, it plans to invest 220 million yuan to add high-reliability automotive-grade laser chip process equipment , develop laser chip process technology for the field of automotive laser radar, and further enhance the research and development and pilot foundry capabilities of compound optoelectronic chips; on the other hand, it plans to invest 750 million yuan to supplement silicon photonic process equipment and develop 130nm silicon photonic process technology .

1724361787046.png

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tphuang

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From June on NexChip
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在全球半导体市场持续回暖之下,晶圆代工厂商“晶合集成”订单饱满,产能需求出现供不应求。自2024年3月至今,晶合集成产能一直处于满载状态,6月产线负荷约为110%,订单超过现有产能。为满足不断增加的市场需求,更好服务客户,晶合集成计划于2024年内总扩产3-5万片/月。


近年来,晶合集成不断推动技术节点向前发展,加速新产品应用落地,赢得市场广泛认可。晶合集成预计于2024年,在技术节点上围绕55纳米、40纳米不同制程产品加速扩充产能。在产品上,晶合集成将以高阶CIS产品为今年度扩产主力产品,并且依据市场需求,逐步扩充显示驱动芯片产能。目前晶合集成已经实现40纳米高压工艺代工的OLED显示驱动芯片小批量试产。不仅在产品端成功跨越至OLED显示驱动芯片领域,更为提升国内显示驱动芯片自给率再次贡献晶合力量。

They are expanding by 30 to 50k wpm this year. Their production line in June had 110% utilization. orders exceed production level. They are looking to expand mostly 55nm and 40nm. Have start low rate production on 40nm OLED DDIC. Of course, I think we mentioned earlier of 55nm CIS product (the 180MP camera IIRC).

so yeah, demand is huge and they are having no trouble getting orders. But at very low prices. With all the Capex, they are just not making money.

It's quite hard to generate good margin in China when you are operating in the 40 to 90nm segment
 

Hyper

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Is not a repeat, IWAPS is a completely different conference in China dedicated to patterning.
Half of the papers were already presented at SPIE. Also I see the logo of SPIE in the website as a partner or sponsor. They are presenting the papers again.
 

european_guy

Junior Member
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HH group Chief Engineer Zhao Yuhang announced FinFet process in January, 2020.. R&D of FinFet was completed back then..

View attachment 134596

sanctions stopped HH FinFet process.. so they decided to postpone the program until fully domestic immersion line come online.. now all respective tools have successfully developed. recently FinFet capable photoresist also entered in mass production. so it is matter of time.. i believe we could hear something in 2025..

as you see the pattern, SMIC/HH/Nexchip big three climbing up the ladder step by step.. Nexchip 28nm immersion line in 2025. SMIC 7nm and below.. so HH bound to enter in Finfet process. this is in correlation with domestic tools moving up in value added supply chain..

Regarding HH, there are 2 companies:

- Shanghai Hua Hong Semiconductor 華虹半導體 (
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- Shanghai Huali Microelectronics 上海华力 (
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)

Currently Hua Hong only has process up to 55/65 nm

Instead HLMC (that is a JV with HH) currently
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:

At the process node, it has successfully mass-produced 28nm low-power, 28nm RF process and 28nm high-performance streamlined enhanced version process technology (28nm HKC+). Shanghai Huali is gradually expanding its 28nm process technology capabilities and launching more features Process technology: 28nm high-voltage process, 28nm image sensor and 28nm embedded flash memory process, etc. In addition, Huali's 22nm process has also completed research and development and entered the preliminary mass production stage.

To note that revenues and wafer capacity of HLMC are not reported in quarterly reports of HH.

Also to note HLMC is not publicly traded (so they don't have to publish results)

BTW the same is true for SMIC, where their 7nm fab is legally under a different JV company Semiconductor Manufacturing South China Corp (SMSC). A company that is not traded and for which their capacity/revenue don't end up in SMIC quarterly results!

IOW China hides both capacity and revenues for 28nm (HH) and more advanced nodes!

I'd say it makes totally sense they do this, for the time being....
 
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