Chinese semiconductor thread II
- Thread starter vincent
- Start date
It is tricky to define "domestic". Is a chip produced locally but use foreign tools considered "domestic"? If the idea of the government is considering a chip domestic only when we can control the whole suppy chain to produce it then 10% actually might make sense.
Companies like Horizon Robotics which fab everything at TSMC are of little help. They could at least fab their 28nm chips at SMIC or HLMC.
They are also dependent on licensing of ARM cores which could be yanked at leisure by the UK government. Just like they did with Russia.
Moving a chip design from TSMC to SMIC or HLMC could easily take a year to do. If they need to redesign to take the ARM cores out it might take them 2 or 3 years to do. Better start doing it before being sanctioned.
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Governments don't do market research. Not their job.
When it looks like a duck, smells like a duck, walk like duck even quack like a duck then its probably a duck.
From the article.
In short, the cost of each 5nm wafer coming out of SMIC’s production site will be highly expensive, so Huawei probably believes that the costs do not justify using this technology for its smartphone chipsets. This setback means that the Kirin 9100 could be fabricated on the 7nm process, but using the N+3 node, it could boast a higher density than the Kirin 9010 and the Kirin 9000S. This improvement means that the Kirin 9100 will boast a higher number of transistors, resulting in better ‘performance per watt’ and improved power efficiency.
11 hours ago — The Mate 70 series has previously been rumored not to transition to SMIC's 5nm process, with the Kirin 9100 expected to be retained at 7nm.
From the article.
New Kirin SoC could be limited to SMIC’s 7nm process but sporting higher transistors, leading to some advantages over previous chipset releases
The Mate 70 series has previously been rumored , with the Kirin 9100 expected to be retained at 7nm. While that sounds incredibly disappointing, there were likely practical reasons for this decision, assuming Huawei has already made its. Mass producing 5nm wafers on the older DUV machinery instead of EUV equipment means that production costs will be high and yields will be low.In short, the cost of each 5nm wafer coming out of SMIC’s production site will be highly expensive, so Huawei probably believes that the costs do not justify using this technology for its smartphone chipsets. This setback means that the Kirin 9100 could be fabricated on the 7nm process, but using the N+3 node, it could boast a higher density than the Kirin 9010 and the Kirin 9000S. This improvement means that the Kirin 9100 will boast a higher number of transistors, resulting in better ‘performance per watt’ and improved power efficiency.
11 hours ago — The Mate 70 series has previously been rumored not to transition to SMIC's 5nm process, with the Kirin 9100 expected to be retained at 7nm.
this i would think is pretty solid news. This poster is 100% solid with his sources.
Mate 70 is coming out in 2nd half of Q4. Its 5G chip will use an improved process and new self developed OS (Harmony Next). Its' specifically delayed until that time due to these factors. It will also come with OV50K CIS and 1.5k LTPO screen.
Guangdong's economic "half-year report" released, integrated circuit output increased by 31.1% year-on-year
The output of high-tech products has grown rapidly, with the output of new energy vehicles, smart phones, integrated circuits, and industrial robots increasing by 25.7%, 23.4%, 31.1%, and 37.6% respectively .The output of high-tech products has grown rapidly, with the output of new energy vehicles, smart phones, integrated circuits, and industrial robots increasing by 25.7%, 23.4%, 31.1%, and 37.6% respectively .
Shanghai Semiconductor Equipment Materials Phase II Investment Fund Completes Industrial and Commercial Registration, with an Initial Phase of RMB 1.5 Billion
Recently, Shanghai Semiconductor Equipment and Materials Phase II Investment Fund completed its industrial and commercial registration. Tianyancha news shows that Shanghai Semiconductor Equipment and Materials Phase II Private Equity Investment Fund Partnership (Limited Partnership) was established on May 22, 2023. The executive partner is Shanghai Semiconductor Equipment and Materials Industry Investment Management Co., Ltd., with an investment of approximately 1.5 billion yuan.
On May 29, Shanghai Wanye Enterprise Co., Ltd. (stock name: Wanye Enterprise) announced that Shanghai Semiconductor Equipment and Materials Phase II Private Equity Investment Fund Partnership (Limited Partnership) has completed the industrial and commercial registration procedures. The fund's target total size is 2.02 billion yuan, and the first phase raised 1.5005 billion yuan. It mainly focuses on the fields of semiconductor equipment, materials and spare parts, and can take into account the upstream and downstream of the semiconductor industry chain such as semiconductor design, digital economy, artificial intelligence, new energy and other related fields. Among them, the investment proportion in the field of semiconductor equipment, materials and spare parts is not less than 60%.
The announcement shows that the fund was jointly initiated by Wanye Enterprise, Shanghai Xinzhengcheng Enterprise Management Partnership (Limited Partnership), Shanghai Semiconductor Equipment Materials Industry Investment Management Co., Ltd., Shanghai Guosheng (Group) Co., Ltd., Pioneer Technology Group Co., Ltd., Aojie Technology Co., Ltd., and Shanghai Feikai Materials Technology Co., Ltd. Among them, Wanye Enterprise subscribed 400 million yuan, Pioneer Technology subscribed 90 million yuan, Aojie Technology subscribed 60 million yuan, and Feikai Materials subscribed 50 million yuan.