Chinese semiconductor thread II

paiemon

Junior Member
Registered Member
Power chip is kind of simple.

I think the hardest chip to make for auto is safety brake system and often dominated by Bosch.
next complicated one is battery management chip, for monitor and regulate.
then there's DSP for Motor control.

Does BYD has brake system, battery management and motor control chip? It still has a way to go.
Making the chip isn't the hardest part, qualifying them to be used in specific vehicles, validated for use with the software control systems and vehicle ECU will be the biggest hurdle since most OEMs have established partners that are qualified for use with the system with decades of experience. Its that reputation and established confidence they bring to the table. BYD can certainly do the same, but automotive is a conservative industry especially when it comes to anything that will affect critical control functions or safety related for a good reason so it will take time for adoption by other Chinese OEMS as they strike a balance between securing their supply chain while still maintaining output.
 

ansy1968

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Registered Member
Huawei Mate70 series N+3 process flagship chip As for the fingerprint unlocking solution that everyone is concerned about, it was unexpected In addition, the PC chip N+3 process is being tested... more radical

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3nm?
That's for 5nm, N+4 is for 3nm.

IF We follow the timeline, N+4 3nm will be appearing in 2026 when the expected Chinese EUVL will be introduced next year. Then we can surmised that we surpass the Americans as the TSMC Arizona FAB will start mass producing its 5nm chip that year.

A great parting gift for Brandon and a second career for Gina as Huawei ambassador....lol
 
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ansy1968

Brigadier
Registered Member
1 year cadence sounds unrealistic and doubtful.
I share your concern bro BUT following Liang Mong Song previous statement. I think its achievable as the only obstacle is the EUVL machine.

Liang Mong Song resignation letter circa 2020.

Liang Mong Song: SMIC's 7nm node has already completed full development, and is preparing for mass production in April 2021. Designs and most of the development for 5nm and 3nm nodes have also already been completed, only awaiting EUVL delivery at this point.​

 

broadsword

Brigadier

China-based startup Byinka to ship 7th-gen IGBT to customers​

Jingyue Hsiao, DIGITIMES Asia, TaipeiMonday 22 July 2024
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Credit: AFP

China-based power semiconductor provider Byinka has announced the shipment of its 7th-generation Insulated Gate Bipolar Transistor (IGBT) to leading companies across industries such as electric vehicles (EV), photovoltaics (PV), and energy storage. This development marks a significant step in closing China's technology gap with Japanese and European companies in IGBT technologies.

In an interview with Jiwei, Byinka CEO He Lin revealed that their 7th-generation IGBT has been trialed and introduced in small batches, with excellent feedback. Some performance metrics reportedly outperform international top brands, and the company's products have now entered the large-scale delivery stage.
The 7th-generation IGBT developed by Byinka boasts higher power density, a simpler drive circuit, and a wider safe operating area (SOA). It can be manufactured using a 50nm node process, representing a significant technological advancement.
Byinka is taking a calculated approach to entering the automotive IGBT market. While recognizing the importance of achieving automotive-grade qualification for their 7th-generation IGBT technology, they are strategically focusing on solidifying their presence in the industrial control and photovoltaics sectors first. This approach allows them to refine their technology and build a strong reputation before tackling the demanding automotive market.

Market dynamics and future outlook​

Lin noted that while oversupply is driving fierce competition in the mid-to-low-end IGBT segment, demand for high-performance devices is surging. According to Jiwei, the growth rate of the IGBT market in the energy storage sector is expected to outpace the automotive industry in the coming years, reaching a market share of 9.7% by 2025. Notably, China stands as the world's dominant IGBT market, consuming over 40% of global demand, with this share expected to rise further.
Founded in 2022, Byinka successfully developed its in-house 7th-generation IGBT using 300mm wafers in July 2023. The company has since launched a full range of 7th-generation IGBT products, spanning from 1000V to 1700V.
According to DIGITIMES Research, while global leaders Infineon and Fuji Electric developed their 7th-generation IGBT in 2018, most China-based companies' IGBT technology remains at the 5th or 6th generation level, lagging by at least five years. However, the vast domestic market is expected to strongly support the revenue growth of Chinese companies.
Other China-based semiconductor companies have also made strides in developing 7th-generation IGBTs in recent years. StarPower Semiconductor unveiled its product in 2022, and MACMIC launched its 7th-generation IGBT in 2023, both utilizing 300mm wafers.
 
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