Chinese semiconductor thread II

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ansy1968

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gotodistance said:
It is rumored that the mass production version of China's domestic EUV, excluding the trial production version, will have a process density greater than TSMC's 5nm & 4nm processes for its first gen,
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N+4 3nm chip
gotodistance said:
and is expected to catch up with TSMC's process technology by the year 2026.
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Huawei(+SiCarrier)? or SMEE?
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Our projected timeline until TSMC and SAMSUNG mass produced its 2nm node process in 2027. So the gap will shrink by a year and by 2028 its possible that SMIC or Huawei will launch their own version of 2nm chip.

SMEE will concentrate in mass producing its SSA800 and the incoming SSA900 DUVi , they are not part of EUVL consortium BUT Huawei is.
 
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latenlazy

Brigadier
tokenanalyst said:

Microscopic deprotection mechanisms and acid loss pathways of chemically amplified photoresists for deep/extreme ultraviolet photolithography​


Chemically amplified resists are an important type of material to realize precise microscopic patterning in deep and extreme ultraviolet photolithography. Currently, their development relies heavily on trial-and-error, while achieving higher sensitivity and resolution requires rational molecular design. This task can benefit from an in-depth comprehension of the acid-catalyzed deprotection mechanisms and acid loss pathways at the atomic level. However, our current understanding is largely empirical and the diverse types of photoresists and protective groups pose a significant challenge in fully revealing the microscopic mechanisms. In this study, density functional theory calculations are employed to investigate three primary types of deprotection reactions: tert-butyloxycarbonyl, ester, and ring-opening. Representative polymer photoresist units and fully/half-protected molecular glasses are considered as model systems. The calculations reveal multiple reaction pathways, each characterized by distinct energy barriers. In particular, the rate-determining steps are identified, and potential photoacid loss pathways are uncovered. These findings establish a comprehensive molecular understanding of the deprotection mechanisms of chemically amplified resists for advanced photolithography, providing valuable theoretical insights for their systematic design to achieve higher performances.

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Oh man this was a fun paper.
 
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tokenanalyst

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Mass industrialization of lithography machine quartz components.​

1. Key technical directions for functional glass materials in the information display and semiconductor fields​


① Develop new glass substrate material recipes for indium gallium zinc oxide thin film transistors (IGZO-TFT) for semiconductor displays. Develop core equipment for industrial polishing of 8.5-generation TFT-LCD glass substrates; develop key preparation technologies such as clarification, homogenization, and thinning of 10.5-generation TFT-LCD glass substrates, and break through core technologies such as clarification and homogenization of large-flow precious metal channels, high-temperature nonlinear step thinning, and tight micro-stress control; develop core thermal equipment such as platinum channels and tin baths for the production of high-generation (G8.6+, G11/10.5) TFT-LCD glass substrates. ② Develop core material recipes for OLED glass substrates suitable for float forming processes. Develop annealing technology and equipment for low residual stress and low reheat shrinkage of OLED substrate glass; conduct digital research on key thermal processes of OLED substrate glass; develop efficient melting, clarification, homogenization, and precision thinning float forming technology for OLED substrate glass; build a demonstration line for the production of float 8.5-generation OLED display glass substrates, and establish an evaluation system and standard specifications for OLED display glass materials. ③ Develop ultra-thin flexible glass one-shot forming technology and equipment; develop flexible cover glass "flattening-pull-down" fast and stable one-shot forming, high-efficiency laser cutting, chemical strengthening and toughening, lossless transmission and other precision processing technologies; carry out flexible glass stress layer distribution technology control and optimization. ④ Carry out key technology and industrialization research on DUV lithography machine quartz glass; develop high-purity quartz glass materials for 193 nm lithography machines, complete experimental verification in DUV lithography systems and achieve domestic substitution, etc.​
 
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tokenanalyst

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Domestic semiconductor equipment project officially landed in Wuhan New City​


Wuhan East Lake High-tech Zone and Wuhan Deer Laser Technology Co., Ltd. (referred to as "Deer Laser") held a signing ceremony, and Deer Laser's headquarters and the third phase of the R&D and production base project settled in Optics Valley .

At present, Deer Laser has invested in the construction of the first and second phases of the production base in Wuhan Future Science and Technology City. This time, it plans to invest 3 billion yuan to establish the headquarters and the third phase of the R&D and production base, build the group headquarters and the cutting-edge laser technology innovation institute, expand the photovoltaic module laser packaging equipment production line, and add a new semiconductor laser equipment production plant.

Delong Laser was founded in Wuhan, China Optics Valley in 2008 and was listed on the Shenzhen Stock Exchange's ChiNext in 2019. It has a research and development and production base in Wuxi, and overseas research and development centers in Tel Aviv, Israel and Singapore. It is a national manufacturing single champion demonstration enterprise, a national smart photovoltaic pilot demonstration unit and a national talent and wisdom introduction demonstration base.

According to the news from China Optics Valley, Delong Laser's core products in the photovoltaic field have a global market share of over 80%. At the same time, Delong Laser is actively expanding into new display and semiconductor fields and developing advanced laser equipment.

It is reported that in the field of new display, Delong Laser has leveraged the advantages of laser technology in thin film materials, hard and brittle transparent materials and special thin metal materials, and launched equipment such as OLED/Mini LED laser repair, Micro LED laser mass transfer, and laser mass welding.

In the field of integrated circuits, Delong Laser focuses on the development and innovation needs of third-generation semiconductors, advanced packaging and other technologies, targets key needs and core issues in the semiconductor field, develops a number of advanced semiconductor laser technologies, and launches TGV laser microvia, IGBT/SiC laser annealing, wafer laser stealth cutting and other equipment.
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H

Hyper

Junior Member
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ansy1968 said:
N+4 3nm chip

Our projected timeline until TSMC and SAMSUNG mass produced its 2nm node process in 2027. So the gap will shrink by a year and by 2028 its possible that SMIC or Huawei will launch their own version of 2nm chip.

SMEE will concentrate in mass producing its SSA800 and the incoming SSA900 DUVi , they are not part of EUVL consortium BUT Huawei is.
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What is SMEE rate of production per year?
 
H

Hyper

Junior Member
Registered Member
tokenanalyst said:
RSLaser posted a study for their manufacturing plant and they indicated a bit close to 100 lasers produced yearly, between Krf, ArF and ArFi lasers. You can make you own deductions what is going to be when every company in the entire Chinese lithography supply Chain is up and running.
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Well mature nodes are expanding faster than new nodes so I assume KrF and ArF will be majority of the machines.
 
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