Chinese semiconductor thread II

tokenanalyst

Lieutenant General
Registered Member

The School of Electronic Engineering at Peking University invented the Van Hoff cold source transistor.​


As integrated circuits continue to evolve towards advanced nodes, reducing power consumption has become one of the core challenges facing information processing systems in the post-Moore's Law era. The subthreshold swing (SS) of traditional silicon-based metal-oxide-semiconductor transistors (MOSFETs) is limited by the Boltzmann distribution, making it difficult to exceed 60mV/dec at room temperature. This physical limit prevents further reduction in the operating voltage Vdd, and power consumption tends to become a bottleneck as device size shrinks.

Recently, a research team led by Assistant Researcher Jia Si and Professor Zhiyong Zhang from the Carbon-Based Electronics Research Center and the Key Laboratory of Nanodevice Physics and Chemistry of the Ministry of Education, School of Electronic Engineering, Peking University, proposed and experimentally verified a van Hove cold source transistor (VHS FET). This device utilizes the characteristic of quasi-one-dimensional semiconductors where the density of states drops sharply near the van Hove singularity. The Fermi level in the source region can be precisely tuned to a specific van Hove singularity through electrochemical doping or electric field manipulation to construct a "cold source" (Figure 1). This approach, which uses the same quasi-one-dimensional semiconductor material for both the source and channel to form a homojunction, allows for direct injection of cold carriers, reduces interface scattering, simplifies the device structure, and facilitates miniaturization.

The research team chose semiconductor-type carbon nanotubes to construct the van Hough source and channel (Figure 2). In this device, the main gate is responsible for switching control, while the auxiliary control gate precisely modulates the Fermi level in the source region. When the Fermi level approaches the van Hough singularity of the carbon nanotube, the source state density decreases sharply with energy, effectively filtering high-energy carriers and forming a steep hot-emission switch (Figure 3). Experimental results show that the VHS FET based on a single carbon nanotube achieves a subthreshold swing of 49 mV/dec at room temperature, significantly breaking the Boltzmann limit. At a gate length of 450 nm and an operating voltage of 0.5 V, the normalized on-state current of this device is comparable to that of a 22 nm node silicon-based transistor, while the operating voltage is 0.25 V lower than that of the silicon-based device (Figure 4). This result demonstrates that van Hough sources can not only achieve steep switching characteristics below 60 mV/dec but also maintain high current drive capability, providing design ideas for the development of a new generation of ultra-low-power steep-slope transistors.

 

tokenanalyst

Lieutenant General
Registered Member

Panmeng Semiconductor completes A+ round financing of over 100 million yuan​


Recently, Jiangxi Panmeng Semiconductor Technology Co., Ltd., a manufacturer of semiconductor-grade silicon wafers, completed a Series A+ financing round of over 100 million yuan. The investors in this round were Xicheng Jinrui and Jinqiao Fund.

Founded in 2021, Panmeng Semiconductor is a semiconductor-grade silicon wafer R&D manufacturer, focusing on the production and sales of monocrystalline silicon and silicon wafers. Its main products are heavily doped polishing wafers, lightly doped polishing wafers, general polished wafers, EPI substrate wafers, and 4-8 inch silicon rods. The target market is polishing wafers, etched wafers, general polished wafers, and EPI substrate wafers for discrete devices.

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tokenanalyst

Lieutenant General
Registered Member

QuantumCTek Announces Entry into EDA Software.​

On December 19, QuantumCTek announced it will enter the EDA (Electronic Design Automation) software sector by signing a RMB 8.7 million procurement contract with its affiliate Ququan (Wuhan) Technology Co., Ltd. to develop "QuantumCTek EDA software" and provide technical services marking the company’s first public step into EDA development. This initiative aims to create near-industrial-grade EDA tools for designing future quantum computing chips, as chip complexity grows and EDA becomes critical in quantum hardware development.

With global forecasts estimating quantum computing could generate up to $2 trillion in economic value by 2035, and applications spanning logistics, finance, cybersecurity, and drug discovery, the demand for domestic quantum EDA tools is rising. China’s quantum tech companies are increasingly developing indigenous EDA solutions such as Origin Quantum's Q-EDA "Origin Kunyuan," which supports both superconducting and semiconductor quantum chip design.

Meanwhile, QuantumCTek also announced that due to the passing of Chairman Lü Pin, Ying Yong has been elected to temporarily assume all key leadership roles until new directors are elected.

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tokenanalyst

Lieutenant General
Registered Member

China Industry and Beijing Government 2026 goals for Atomic Level Manufacturing 2026.​

-Atomic Layer Deposition (ALD) Simulation Platform

  • Goal: Simulate ALD processes at atomic/mesoscale to optimize precursor, temperature, pressure parameters and predict film properties.
  • Output (2026):
    • Platform with adsorption/desorption, growth, and quality assessment modules.
    • Simulates 10nm films over 100,000 atomic seconds; 3+ key parameters.
    • Accuracy: Growth rate >90%, step coverage for 10:1 AR >90%.
    • Targets: Hf(Zr)O₂, Al₂O₃ on Si/SiO₂ with high-k dielectrics.

-Atomic-Level Planarization of Heterogeneous Polycrystalline Materials

  • Goal: Achieve atomic-scale polishing with near-zero subsurface damage on ≥4-inch heterogeneous/polycrystalline surfaces.
  • Output (2026):
    • Surface roughness Ra < 2 Å, subsurface damage ≤20 atoms.
    • Shape accuracy <10 Å over 10×10 µm.
    • In-situ characterization resolution <1 Å.

-Selective ALD for Atomic-Level Alignment

  • Goal: Enable defect-free, selective deposition on interconnect dielectrics to reduce overlay errors.
  • Output (2026):
    • Selectivity >99.9% on metal/dielectric systems.
    • Controlled single-layer growth (>6nm) in target areas; zero defects elsewhere.
    • Validated on 12-inch ALD tools; ready for industrial use.

-Atomic-Level Defect Control & Repair for High-Intensity Optical Components

  • Goal: Characterize and repair atomic defects in high-power optics under laser stress.
  • Output (2026):
    • Prototype platform for characterization + repair of ≥5 defect types.
    • Repair aperture >300mm; laser damage threshold ↑ >50% post-repair.
    • Validated on laser damage testing platforms.

-Large-Scale Atomic-Level Metal Powders

  • Goal: Produce ultra-fine metal powders (<1000 atoms/particle) for low-temp welding and advanced manufacturing.
  • Output (2026):
    • Daily output: kg-level, >90% particles <1000 atoms; some <200 atoms.
    • Applications: Welding, 3D printing, medical devices.
    • New standard: Process evaluation index system to address rapid thermal drop (>20%).

-Atomic-Level Powder Coating Technology

  • Goal: Apply <1nm passivation layers on energetic powders without agglomeration or decomposition.
  • Output (2026):
    • Coating thickness <1nm, specific surface area retention >95%.
    • Batch capacity >10kg/batch, consistency >95%.
    • Enables green energy apps: nuclear, hydrogen.

-Multi-Field Assisted CMP Equipment

  • Goal: Atomic-scale polishing via synergistic electric, optical, acoustic, plasma fields.
  • Output (2026):
    • Modular equipment with 6 pressure zones, control precision 0.1 psi.
    • Polishes Si substrates to <10 atomic layers undulation.

-Cluster Ion Beam Polishing for Diamond Optical Windows

  • Goal: Atomically smooth large-diameter, high-AR diamond windows for lasers/IR detectors.
  • Output (2026):
    • Equipment for ≥75mm diameter, AR ≥100 windows.
    • Surface roughness Ra ≤1nm, shape accuracy PV ≤ λ/4.
    • Beam: Ar/SF₆ clusters, ≥60keV, ≥100μA, adjustable diameter 0.5–10mm.
    • Supports 3-inch-class production.

-Atomic-Precision X-ray Mirror

  • Goal: Fabricate ultra-smooth X-ray mirrors for synchrotrons/FELs.
  • Output (2026):
    • 400mm-sized mirrors with:
      • RMS surface accuracy <2nm, slope error <0.2µrad, roughness <0.1nm.
    • Based on plasma + elastic emission processing; autonomous error correction.

-Atomic-Scale Dispersed Metal Formulations

  • Goal: Replace bulk metal additives with atomic dispersions to reduce toxicity/residues.
  • Output (2026):
    • >95% dispersion in formulations.
    • Cu reduction: >80% in fungicides, >90% residue drop.
    • Zn reduction: >70% in rubber vulcanization, cost ↓ >50%.
    • Validated on ≥1M mu field trials.

-Atomic-Step Electroplating of High-Purity Single-Crystal Copper

  • Goal: Produce large, ultra-pure single-crystal Cu plates/targets for 6G/new energy.
  • Output (2026):
    • Plate: ≥25×30cm, 6N purity, ≥3mm thick.
    • Target: 2–8 inch, sputtered film resistivity ↓ >15% vs. polycrystalline.
    • Annual production line: ≥5000 plates/year.

-Graphene-Based Thermal Interface Materials

  • Goal: Ultra-efficient thermal management via atomic-precision graphene structures.
  • Output (2026):
    • Vertical thermal conductivity >300 W/m·K, thermal resistance <0.05 K·cm²/W.
    • Compressive stress <30 PSI, springback >50%.
    • Deployed in ≥10,000 high-power devices.

-High-Density Atomic Cluster Sensor Array Printing

  • Goal: Print flexible, high-res sensor arrays using cluster inks for wearables.
  • Output (2026):
    • Density >100 sensors/cm², 3+ ink types, 3+ sensing modalities.
    • Pressure range: 5kPa–50MPa, bending stability ±10% @ 100k cycles.
    • Temp sensor: 10–80°C, accuracy ≤0.5°C.

-High-Resolution TEM (120–300kV)

  • Goal: Enable atomic-scale dynamic characterization of manufactured structures.
  • Output (2026):
    • Commercial 120–300kV field-emission TEMs.
    • Info resolution <1.4 Å, point resolution <3 Å.
    • Low-dose, high-coherence imaging for reliability evaluation.

-Super-Resolution Area-Domain Swept-Frequency OCT

  • Goal: Break optical diffraction limit for 3D atomic-scale surface/internal structure detection.
  • Output (2026):
    • Accuracy <0.1nm, speed 1M points/s (each with surface + internal data).
    • Capable of 12-inch wafer scanning; validated in advanced electronics & metamaterials.

-Multi-Probe Atomic Manipulation Platform

  • Goal: Precise, simultaneous manipulation of atoms via 4 independent probes.
  • Output (2026):
    • Z-axis noise <5 pm, probe spacing ≤50nm, temp range 10K–420K.
    • Integrates AI-driven atomic tracking & coordinated control for materials science R&D.

-In-Situ Ultrathin Film Thickness Detector (MBE)

  • Goal: Real-time, sub-atomic thickness monitoring during MBE growth.
  • Output (2026):
    • Range: 1–50nm, resolution: sub-single-atom layer.
    • Drift <5×10⁻³/h, SNR >1000:1, measurement time <10ms.
    • Works for metals, oxides, organics in high vacuum.

-Atomic Cluster Non-Invasive Saliva POCT Sensor

  • Goal: Rapid, multiplexed biomarker detection via gold cluster plasmonics.
  • Output (2026):
    • System error: <100 atoms in cluster count.
    • Detects glucose, uric acid, cortisol in <10 min.

-Atomic-Level Defect Passivation in Perovskite Solar Cells

  • Goal: Enable large-area, stable, high-efficiency perovskite PV modules.
  • Output (2026):
    • Films >900 cm² (30×30cm+), defect density <10¹⁴ cm⁻³.
    • PCE ≥20%, degradation <5% after 2000h illumination.
    • Passes IEC Double 85 damp-heat test.
 

AsuraGodFiend

Junior Member
Registered Member

China Industry and Beijing Government 2026 goals for Atomic Level Manufacturing 2026.​

-Atomic Layer Deposition (ALD) Simulation Platform

  • Goal: Simulate ALD processes at atomic/mesoscale to optimize precursor, temperature, pressure parameters and predict film properties.
  • Output (2026):
    • Platform with adsorption/desorption, growth, and quality assessment modules.
    • Simulates 10nm films over 100,000 atomic seconds; 3+ key parameters.
    • Accuracy: Growth rate >90%, step coverage for 10:1 AR >90%.
    • Targets: Hf(Zr)O₂, Al₂O₃ on Si/SiO₂ with high-k dielectrics.

-Atomic-Level Planarization of Heterogeneous Polycrystalline Materials

  • Goal: Achieve atomic-scale polishing with near-zero subsurface damage on ≥4-inch heterogeneous/polycrystalline surfaces.
  • Output (2026):
    • Surface roughness Ra < 2 Å, subsurface damage ≤20 atoms.
    • Shape accuracy <10 Å over 10×10 µm.
    • In-situ characterization resolution <1 Å.

-Selective ALD for Atomic-Level Alignment

  • Goal: Enable defect-free, selective deposition on interconnect dielectrics to reduce overlay errors.
  • Output (2026):
    • Selectivity >99.9% on metal/dielectric systems.
    • Controlled single-layer growth (>6nm) in target areas; zero defects elsewhere.
    • Validated on 12-inch ALD tools; ready for industrial use.

-Atomic-Level Defect Control & Repair for High-Intensity Optical Components

  • Goal: Characterize and repair atomic defects in high-power optics under laser stress.
  • Output (2026):
    • Prototype platform for characterization + repair of ≥5 defect types.
    • Repair aperture >300mm; laser damage threshold ↑ >50% post-repair.
    • Validated on laser damage testing platforms.

-Large-Scale Atomic-Level Metal Powders

  • Goal: Produce ultra-fine metal powders (<1000 atoms/particle) for low-temp welding and advanced manufacturing.
  • Output (2026):
    • Daily output: kg-level, >90% particles <1000 atoms; some <200 atoms.
    • Applications: Welding, 3D printing, medical devices.
    • New standard: Process evaluation index system to address rapid thermal drop (>20%).

-Atomic-Level Powder Coating Technology

  • Goal: Apply <1nm passivation layers on energetic powders without agglomeration or decomposition.
  • Output (2026):
    • Coating thickness <1nm, specific surface area retention >95%.
    • Batch capacity >10kg/batch, consistency >95%.
    • Enables green energy apps: nuclear, hydrogen.

-Multi-Field Assisted CMP Equipment

  • Goal: Atomic-scale polishing via synergistic electric, optical, acoustic, plasma fields.
  • Output (2026):
    • Modular equipment with 6 pressure zones, control precision 0.1 psi.
    • Polishes Si substrates to <10 atomic layers undulation.

-Cluster Ion Beam Polishing for Diamond Optical Windows

  • Goal: Atomically smooth large-diameter, high-AR diamond windows for lasers/IR detectors.
  • Output (2026):
    • Equipment for ≥75mm diameter, AR ≥100 windows.
    • Surface roughness Ra ≤1nm, shape accuracy PV ≤ λ/4.
    • Beam: Ar/SF₆ clusters, ≥60keV, ≥100μA, adjustable diameter 0.5–10mm.
    • Supports 3-inch-class production.

-Atomic-Precision X-ray Mirror

  • Goal: Fabricate ultra-smooth X-ray mirrors for synchrotrons/FELs.
  • Output (2026):
    • 400mm-sized mirrors with:
      • RMS surface accuracy <2nm, slope error <0.2µrad, roughness <0.1nm.
    • Based on plasma + elastic emission processing; autonomous error correction.

-Atomic-Scale Dispersed Metal Formulations

  • Goal: Replace bulk metal additives with atomic dispersions to reduce toxicity/residues.
  • Output (2026):
    • >95% dispersion in formulations.
    • Cu reduction: >80% in fungicides, >90% residue drop.
    • Zn reduction: >70% in rubber vulcanization, cost ↓ >50%.
    • Validated on ≥1M mu field trials.

-Atomic-Step Electroplating of High-Purity Single-Crystal Copper

  • Goal: Produce large, ultra-pure single-crystal Cu plates/targets for 6G/new energy.
  • Output (2026):
    • Plate: ≥25×30cm, 6N purity, ≥3mm thick.
    • Target: 2–8 inch, sputtered film resistivity ↓ >15% vs. polycrystalline.
    • Annual production line: ≥5000 plates/year.

-Graphene-Based Thermal Interface Materials

  • Goal: Ultra-efficient thermal management via atomic-precision graphene structures.
  • Output (2026):
    • Vertical thermal conductivity >300 W/m·K, thermal resistance <0.05 K·cm²/W.
    • Compressive stress <30 PSI, springback >50%.
    • Deployed in ≥10,000 high-power devices.

-High-Density Atomic Cluster Sensor Array Printing

  • Goal: Print flexible, high-res sensor arrays using cluster inks for wearables.
  • Output (2026):
    • Density >100 sensors/cm², 3+ ink types, 3+ sensing modalities.
    • Pressure range: 5kPa–50MPa, bending stability ±10% @ 100k cycles.
    • Temp sensor: 10–80°C, accuracy ≤0.5°C.

-High-Resolution TEM (120–300kV)

  • Goal: Enable atomic-scale dynamic characterization of manufactured structures.
  • Output (2026):
    • Commercial 120–300kV field-emission TEMs.
    • Info resolution <1.4 Å, point resolution <3 Å.
    • Low-dose, high-coherence imaging for reliability evaluation.

-Super-Resolution Area-Domain Swept-Frequency OCT

  • Goal: Break optical diffraction limit for 3D atomic-scale surface/internal structure detection.
  • Output (2026):
    • Accuracy <0.1nm, speed 1M points/s (each with surface + internal data).
    • Capable of 12-inch wafer scanning; validated in advanced electronics & metamaterials.

-Multi-Probe Atomic Manipulation Platform

  • Goal: Precise, simultaneous manipulation of atoms via 4 independent probes.
  • Output (2026):
    • Z-axis noise <5 pm, probe spacing ≤50nm, temp range 10K–420K.
    • Integrates AI-driven atomic tracking & coordinated control for materials science R&D.

-In-Situ Ultrathin Film Thickness Detector (MBE)

  • Goal: Real-time, sub-atomic thickness monitoring during MBE growth.
  • Output (2026):
    • Range: 1–50nm, resolution: sub-single-atom layer.
    • Drift <5×10⁻³/h, SNR >1000:1, measurement time <10ms.
    • Works for metals, oxides, organics in high vacuum.

-Atomic Cluster Non-Invasive Saliva POCT Sensor

  • Goal: Rapid, multiplexed biomarker detection via gold cluster plasmonics.
  • Output (2026):
    • System error: <100 atoms in cluster count.
    • Detects glucose, uric acid, cortisol in <10 min.

-Atomic-Level Defect Passivation in Perovskite Solar Cells

  • Goal: Enable large-area, stable, high-efficiency perovskite PV modules.
  • Output (2026):
    • Films >900 cm² (30×30cm+), defect density <10¹⁴ cm⁻³.
    • PCE ≥20%, degradation <5% after 2000h illumination.
    • Passes IEC Double 85 damp-heat test.
Can someone explain what is this about is it about parts of euv or another thing?
 
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