Chinese semiconductor thread II
- Thread starter vincent
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yeah, but it's production revenue is probably a lot lower than that. A lot of work ahead still
Jinghe Integrated Circuit and Shanghai Jingce signed a purchase agreement for 20 domestic measurement equipment
Jinghe Integrated Circuit and Shanghai Jingce Semiconductor Technology Co., Ltd. (hereinafter referred to as "Shanghai Jingce") held a signing ceremony for the purchase intention of EPROFILE 300FD measurement equipment. After just one year of testing, verification, and successful introduction into production, the performance of the EPROFILE 300FD measurement equipment has reached international standards in all aspects. Jinghe Integrated Circuit plans to introduce a large number of 20 units in Jinghe Phase III and subsequent new production capacity, which will effectively reduce equipment procurement and maintenance costs.
Jinghe Integrated has been making every effort to promote localization development. At present, 90% of the raw materials are supplied by domestic manufacturers. In the field of equipment, Jinghe Integrated has introduced a large number of domestic equipment manufacturers such as North Huachuang, AMEC, Tuojing, Huahai Qingke, Zhichun, Shengmei, Yitong, Hefei Yuwei, Zhongke Feice, Tianxinwei, and Yiwen. In the future, Jinghe Integrated will also cooperate with Shanghai Jingce in the fields of scanning electron microscopes, bright field defect detection machines, WAT testers, and yield testers, in order to continuously increase the proportion of localized equipment, continuously optimize operating costs, and build a safe and stable supply chain ecosystem.
Yes, it's true, But this is a good thing. As long as China domestic producers will have only a limited part of revenues in China market, then there will be growth. This is called "potential" and is the real fuel that feeds thousands of Chinese companies from full IC fabs, from equipment makers down to tiny and obscure chemicals, including research institutes, universities, etc.
When China will have conquered the biggest part of the internal market, that will be the last year of growth before stagnation.
Hejingyuan received over 300 million yuan in financing to build advanced bonding equipment and bonding substrate production lines
According to the news, Beijing Qinghe Jingyuan Semiconductor Technology Co., Ltd. recently announced the completion of the latest round of financing, with a financing amount of over 300 million yuan. Investors include Shenzhen Capital Group, Yuanzhi Spark, Xinpengwei, and old shareholders Zhengwei Capital, Xindongneng, and Tianchuang Capital continue to support.
It is reported that this round of financing will be used for the construction of advanced bonding equipment and bonding substrate production lines. Qinghe Jingyuan plans to continue to expand its production scale, and the annual production capacity of advanced bonding equipment will be expanded to 60 units (sets) to meet the growing customer demand. A new 400,000-piece 8-inch SiC bonding substrate production line will be built to accelerate the mass production of 8-inch SiC substrates and further consolidate Qinghe Jingyuan's leading position in the field of domestic bonding integration technology.
According to the data, Qinghe Wafer, as one of the few semiconductor companies in the world that has mastered a full set of advanced semiconductor materials and heterogeneous integration technologies, is committed to providing cutting-edge technologies and solutions for the fields of wafer-level heterogeneous integration, advanced packaging, and ultra-precision processing. At present, the company has completed the research and development and mass production of various bonding substrate materials such as SiC, LTOI, and LNOI, as well as high-end wafer bonding equipment.
Flexible nanoimprint lithography enables efficient fabrication of biomimetic microstructures
byFabrication of microstructures through steps of thermo-compression molding, imprinting, UV exposure and two-step etching process. Credit: Science China Press
Gallium nitride (GaN)-based light-emitting diodes (LEDs) have transformed the lighting industry by replacing conventional lighting technologies with superior energy efficiency, longer operating life and greater environmental sustainability. In recent years, considerable attention has been paid to the trend toward miniaturization of LEDs, driven by display devices, augmented reality, virtual reality, and other emerging technologies.
Due to the lack of cost-effective native , the presence of high threading dislocation density in heteroepitaxial films grown on sapphire substrate is a major limiting factor for device performance. In addition, Fresnel reflections at the interface between epitaxy and substrate caused by abrupt changes in the refractive indices of the material reduce the light energy utilization.
Distributed nano-nipple arrays on the compound eyes of moth-like animals have excellent anti-reflective ability and strong light-absorption capacity, which provides great inspiration for improving light utilization. However, rapid and precise processing of microstructures on curved surfaces of optoelectronic devices is highly challenging.
"The common projection lithography methods are very sensitive to the shape of the substrate, so the accuracy of definition may be reduced when the substrate has large warps or irregular shapes. We propose a flexible nanoimprint lithography technique that enables and high-quality processing of bionic microstructures on curved surfaces," says Professor Shengjun Zhou.
The researchers first carried out the design of bionic microstructure array and flexible nanoimprinting molds. The fabrication of the microstructures was realized by thermo-compression molding, imprinting, UV exposure and a specially designed two-step etching process to obtain a compound-eye-like silica microstructures (NCSM) template.
It is shown that flexible nanoimprinting has adaptability to substrate warpage, allows precise definition of microstructures, and provides good durability. Compared to projection lithography, productivity was increased by a factor of 6.4 and economic cost savings of 25% were achieved.
The researchers investigated the growth behavior of GaN crystals on NCSM template by epitaxial growth interruption experiments. They found that adjusting the morphology of the nucleation layer by the NCSM template helps to control the growth orientation of GaN and obtain epitaxial films with low dislocation density. In addition, the NCSM template can significantly improve the light extraction efficiency of the devices owing to the modulation of photons by the bionic microstructures.
Professor Sheng Liu says, "Thanks to these two improvements, the light output capability of mini-LEDs based on NCSM template has been greatly enhanced."
He concludes, "This study is promising for the efficient fabrication of microstructures and performance enhancement of optoelectronic devices. In the future, we will continue to explore flexible nanoimprinting techniques and expect it to show broader applications."
The paper is in the journal Science Bulletin.
Microscopic deprotection mechanisms and acid loss pathways of chemically amplified photoresists for deep/extreme ultraviolet photolithography
Chemically amplified resists are an important type of material to realize precise microscopic patterning in deep and extreme ultraviolet photolithography. Currently, their development relies heavily on trial-and-error, while achieving higher sensitivity and resolution requires rational molecular design. This task can benefit from an in-depth comprehension of the acid-catalyzed deprotection mechanisms and acid loss pathways at the atomic level. However, our current understanding is largely empirical and the diverse types of photoresists and protective groups pose a significant challenge in fully revealing the microscopic mechanisms. In this study, density functional theory calculations are employed to investigate three primary types of deprotection reactions: tert-butyloxycarbonyl, ester, and ring-opening. Representative polymer photoresist units and fully/half-protected molecular glasses are considered as model systems. The calculations reveal multiple reaction pathways, each characterized by distinct energy barriers. In particular, the rate-determining steps are identified, and potential photoacid loss pathways are uncovered. These findings establish a comprehensive molecular understanding of the deprotection mechanisms of chemically amplified resists for advanced photolithography, providing valuable theoretical insights for their systematic design to achieve higher performances.
With CMP and ECMP equipment at the Jiwei Conference, Zhongsi Technology has received orders from major silicon wafer manufacturers.
Zhongsi Technology has developed the first 12-inch CMP equipment (TTAIS®300 CMP) that can support both 3-disk and 2-disk processes through independent innovation. It can be applied to all high-end processes below 90nm. In the process of chip production, it provides advantages such as high maintainability, high production efficiency, and low comprehensive use cost. In addition to IC processes, TTAIS®300 CMP also supports chemical mechanical polishing of 12-inch large silicon wafers.
In addition, for silicon carbide substrates, Zhongsi Technology has also launched the ECMP equipment (TNTAS®ECMP), the first electrochemical polishing technology, which has achieved more than 50% improvement in time and cost compared with traditional polishing equipment, and no longer uses polishing liquid containing highly corrosive oxidants such as potassium permanganate. The process conditions are mild and environmentally friendly.
At present, Zhongsi Technology's CMP equipment and ECMP equipment have achieved a phased breakthrough: the 6-inch equipment TENMS® ECMP150S electrochemical polishing equipment newly launched in 2024 has obtained orders and intentions from many third-generation semiconductor material process device production lines; at the same time, TTAIS®300 12-inch equipment has also been gradually introduced into integrated circuit manufacturing and large silicon wafer production companies for various process verifications, and has been recognized by large silicon wafer manufacturers and has received repeat orders.
TSMC or Samsung?