Bonding and HBM equipment situation:
Driven by demand for domestic substitution, domestic manufacturers are accelerating to catch up.
The localization rate of semiconductor equipment has increased, but there is still broad room for domestic substitution. In the context of Sino-US trade friction, the United States continues to increase its blockade of our high-end manufacturing industry, and the growing demand for domestic substitution continues to force my country's local manufacturers to accelerate development and fill the gap in localization. According to MIR Databank statistics, in recent years, as domestic semiconductor equipment manufacturers have continued to make breakthroughs, the localization rate of major wafer manufacturing equipment has increased significantly. Except for photolithography machines (what is visible), the localization rate of other major wafer manufacturing equipment will have increased by 2023. With great progress, it is expected that China's semiconductor equipment will continue to make breakthroughs in 2027, and there is broad room for domestic substitution.
In terms of traditional packaging, Autoview and Xinyichang took the lead in breaking through the localization of high-end aluminum wire bonding machines and high-precision die bonding machines. In the field of wire bonding machines, Otway established a project to develop aluminum wire bonding machines in 2018 as an entry point into the semiconductor packaging and testing field. In 2021, Otway officially launched the AS-WBA60 aluminum wire bonding machine, which can achieve highly reliable semiconductor chip wire welding and tension online testing. Its repeatable positioning accuracy can reach 3um, the production capacity is 9k/h, and it is compatible with 2-20mil aluminum All technical indicators of wires and aluminum strips are comparable to those of foreign first-line equipment. It has realized the localization of high-end aluminum wire bonding machine technology and has realized the introduction of small-scale customer verification. In the field of die-bonding machines, due to the similarity in process between semiconductor packaging and LED packaging, there is also the process of "die-bonding". Xinyichang relied on its deep R&D strength and continuous technological innovation capabilities in the field of LED die-bonding. In 2017 In 2016, we carried out research and development of semiconductor packaging equipment and successfully launched semiconductor die-bonding machine equipment. The HAD812 series of die-bonding machines currently sold by the company are suitable for the field of semiconductor packaging. They adopt dual dispensing, fully automatic stacking and compatible box entry and exit technology. They are equipped with high-speed and high-precision bonding heads to steadily improve the die-bonding efficiency. The production capacity is 18k/h, and the accuracy can reach 18k/h. 20μm.
In terms of advanced packaging, the companies benefiting from the stack bonding process are mainly specialized new bonding equipment manufacturers that focus on advanced bonding processes and supply leading customers in advanced packaging. The demand for bonding equipment for advanced packaging is concentrated on flip-chip bonding machines, hot press bonding machines and hybrid bonding machines. At present, companies such as Wei Jian Intelligent, Huafeng Technology, Xinqi Micro Packaging, and Maiwei Co., Ltd. have made progress in localization. . According to the official websites of each company, the 1.5um-level high-precision die-bonding machine produced by Weijian Intelligent has been successfully mass-produced and commercialized on a large scale, supports TCB hot pressure welding, and has completed the research and development of a 0.5-μm-level sub-micron fully automatic die-bonding machine. The precision index of its die-bonding machines leads the world; Huafeng Technology has now achieved comprehensive coverage of advanced packaging and bonding processes, and provides leading international packaging customers such as TSMC, ASE, Silicon Products, Changdian Technology, Tongfu Microelectronics, and DeeTee. Serve. Currently, in the field of bonding machines, the company has launched the 2060W wafer-level packaging and placement machine, the 2060P flip-chip packaging and bonding machine, and the 2060M system-level packaging and placement machine. Among them, the 2060P flip-chip bonding machine can be applied to Flip Chip, MCP, and MEMS patch processes, with a processing accuracy of ±5μm and a UPH of up to 8k;
Xinqi Micro Devices launched its WB 8 wafer bonding machine at the SEMICON CHINA 2024 exhibition, which can realize bonding methods such as anodic bonding and thermocompression bonding. It supports a maximum wafer size of 8 inches and adopts semi-automatic operation. Can be used in advanced packaging, MEMS and other applications. The maximum pressure during the bonding process of this equipment can reach 100 kN, and the maximum temperature can reach 550 °C. It has a fully automatic process and a high-vacuum bonding chamber, which can quickly evacuate, heat and cool processes to increase production capacity. At the same time, all systems are electrified and there is no risk of oil pollution; Maiwei has also successfully developed fully automatic wafer temporary bonding equipment MX-21D1 and wafer laser debonding equipment MX22D1, which are suitable for 2.5D and 3D wafers of 12-inch wafers. and FO packaging process. MX-21D1 has one pre-bonding cavity and two bonding cavities, which can increase bonding efficiency by 60%; MX-21D1 integrates process units such as glue coating, edge washing, wafer flipping, pre-bonding and bonding. , the laser has a depth of field of 5mm, has an optical path zoom function and a vertical lifting platform, and has the ability to laser debond large warped wafers.
In the most advanced field of hybrid bonding, domestic bonding equipment companies have also made breakthroughs. According to the official website of Ecoris, the nano-level high-precision hybrid bonding process Qixin 8800 developed by Ecoris has achieved a breakthrough in domestic key equipment, with an accuracy of 500nm and a bonding yield of 95%;
the HBS developed by Huazhuo Jingke A series of fully automatic wafer hybrid bonding systems with an alignment accuracy of 200nm and can complete direct bonding at room temperature;
According to the investor relations record form disclosed by Tuojing Technology in October 2023, as of October 2023, Tuojing Technology It is the only domestic hybrid bonding equipment manufacturer that mass-produces in the field of integrated circuits. The wafer-to-wafer bonding product (Dione300) has achieved mass production and has received repeat purchase orders. The chip-to-wafer bonding surface pretreatment product (Dione300) Pollux) has been shipped to the client for verification;
At the SEMICON CHINA 2024 exhibition, Maiwei also launched the MX-11D1 wafer fusion bonding equipment, which integrates EFEM, plasma surface treatment, surface hydrophilic treatment, high-precision crystal Process units such as circular alignment/bonding, alignment offset infrared measurement, and mechanical debonding are suitable for CIS, 3D NAND, DRAM, Micro LED, etc. The equipment has an ultra-high-precision micro/macro motion stage, Resolution<2nm, and the internal environment reaches Class1 level. It also has a mature software framework, simple UI design and rich functions, and realizes self-made key components (such as air float blocks, flexible hinges) , micro/macro motion table).
Driven by demand for domestic substitution, domestic manufacturers are accelerating to catch up.
The localization rate of semiconductor equipment has increased, but there is still broad room for domestic substitution. In the context of Sino-US trade friction, the United States continues to increase its blockade of our high-end manufacturing industry, and the growing demand for domestic substitution continues to force my country's local manufacturers to accelerate development and fill the gap in localization. According to MIR Databank statistics, in recent years, as domestic semiconductor equipment manufacturers have continued to make breakthroughs, the localization rate of major wafer manufacturing equipment has increased significantly. Except for photolithography machines (what is visible), the localization rate of other major wafer manufacturing equipment will have increased by 2023. With great progress, it is expected that China's semiconductor equipment will continue to make breakthroughs in 2027, and there is broad room for domestic substitution.
In terms of traditional packaging, Autoview and Xinyichang took the lead in breaking through the localization of high-end aluminum wire bonding machines and high-precision die bonding machines. In the field of wire bonding machines, Otway established a project to develop aluminum wire bonding machines in 2018 as an entry point into the semiconductor packaging and testing field. In 2021, Otway officially launched the AS-WBA60 aluminum wire bonding machine, which can achieve highly reliable semiconductor chip wire welding and tension online testing. Its repeatable positioning accuracy can reach 3um, the production capacity is 9k/h, and it is compatible with 2-20mil aluminum All technical indicators of wires and aluminum strips are comparable to those of foreign first-line equipment. It has realized the localization of high-end aluminum wire bonding machine technology and has realized the introduction of small-scale customer verification. In the field of die-bonding machines, due to the similarity in process between semiconductor packaging and LED packaging, there is also the process of "die-bonding". Xinyichang relied on its deep R&D strength and continuous technological innovation capabilities in the field of LED die-bonding. In 2017 In 2016, we carried out research and development of semiconductor packaging equipment and successfully launched semiconductor die-bonding machine equipment. The HAD812 series of die-bonding machines currently sold by the company are suitable for the field of semiconductor packaging. They adopt dual dispensing, fully automatic stacking and compatible box entry and exit technology. They are equipped with high-speed and high-precision bonding heads to steadily improve the die-bonding efficiency. The production capacity is 18k/h, and the accuracy can reach 18k/h. 20μm.
In terms of advanced packaging, the companies benefiting from the stack bonding process are mainly specialized new bonding equipment manufacturers that focus on advanced bonding processes and supply leading customers in advanced packaging. The demand for bonding equipment for advanced packaging is concentrated on flip-chip bonding machines, hot press bonding machines and hybrid bonding machines. At present, companies such as Wei Jian Intelligent, Huafeng Technology, Xinqi Micro Packaging, and Maiwei Co., Ltd. have made progress in localization. . According to the official websites of each company, the 1.5um-level high-precision die-bonding machine produced by Weijian Intelligent has been successfully mass-produced and commercialized on a large scale, supports TCB hot pressure welding, and has completed the research and development of a 0.5-μm-level sub-micron fully automatic die-bonding machine. The precision index of its die-bonding machines leads the world; Huafeng Technology has now achieved comprehensive coverage of advanced packaging and bonding processes, and provides leading international packaging customers such as TSMC, ASE, Silicon Products, Changdian Technology, Tongfu Microelectronics, and DeeTee. Serve. Currently, in the field of bonding machines, the company has launched the 2060W wafer-level packaging and placement machine, the 2060P flip-chip packaging and bonding machine, and the 2060M system-level packaging and placement machine. Among them, the 2060P flip-chip bonding machine can be applied to Flip Chip, MCP, and MEMS patch processes, with a processing accuracy of ±5μm and a UPH of up to 8k;
Xinqi Micro Devices launched its WB 8 wafer bonding machine at the SEMICON CHINA 2024 exhibition, which can realize bonding methods such as anodic bonding and thermocompression bonding. It supports a maximum wafer size of 8 inches and adopts semi-automatic operation. Can be used in advanced packaging, MEMS and other applications. The maximum pressure during the bonding process of this equipment can reach 100 kN, and the maximum temperature can reach 550 °C. It has a fully automatic process and a high-vacuum bonding chamber, which can quickly evacuate, heat and cool processes to increase production capacity. At the same time, all systems are electrified and there is no risk of oil pollution; Maiwei has also successfully developed fully automatic wafer temporary bonding equipment MX-21D1 and wafer laser debonding equipment MX22D1, which are suitable for 2.5D and 3D wafers of 12-inch wafers. and FO packaging process. MX-21D1 has one pre-bonding cavity and two bonding cavities, which can increase bonding efficiency by 60%; MX-21D1 integrates process units such as glue coating, edge washing, wafer flipping, pre-bonding and bonding. , the laser has a depth of field of 5mm, has an optical path zoom function and a vertical lifting platform, and has the ability to laser debond large warped wafers.
In the most advanced field of hybrid bonding, domestic bonding equipment companies have also made breakthroughs. According to the official website of Ecoris, the nano-level high-precision hybrid bonding process Qixin 8800 developed by Ecoris has achieved a breakthrough in domestic key equipment, with an accuracy of 500nm and a bonding yield of 95%;
the HBS developed by Huazhuo Jingke A series of fully automatic wafer hybrid bonding systems with an alignment accuracy of 200nm and can complete direct bonding at room temperature;
According to the investor relations record form disclosed by Tuojing Technology in October 2023, as of October 2023, Tuojing Technology It is the only domestic hybrid bonding equipment manufacturer that mass-produces in the field of integrated circuits. The wafer-to-wafer bonding product (Dione300) has achieved mass production and has received repeat purchase orders. The chip-to-wafer bonding surface pretreatment product (Dione300) Pollux) has been shipped to the client for verification;
At the SEMICON CHINA 2024 exhibition, Maiwei also launched the MX-11D1 wafer fusion bonding equipment, which integrates EFEM, plasma surface treatment, surface hydrophilic treatment, high-precision crystal Process units such as circular alignment/bonding, alignment offset infrared measurement, and mechanical debonding are suitable for CIS, 3D NAND, DRAM, Micro LED, etc. The equipment has an ultra-high-precision micro/macro motion stage, Resolution<2nm, and the internal environment reaches Class1 level. It also has a mature software framework, simple UI design and rich functions, and realizes self-made key components (such as air float blocks, flexible hinges) , micro/macro motion table).
