The latest progress of Yixin Group’s advanced packaging projects
The company recently successfully completed the electromechanical engineering of the wafer-level advanced packaging project of Yixin Integrated Circuit (Yiwu) Co., Ltd., helping the project to be officially put into production.
It is understood that the project covers an area of about 70 acres, with a construction area of 49,900 square meters and a clean factory area of 25,000 square meters. It plans to produce 25,000 WLP wafer-level packaging products and 50 million SIP modules per month. Block production capacity.
As the mechanical and electrical engineering clean package of the project, Boda Construction undertook the construction and commissioning of clean decoration, pneumatic, water supply and drainage, HVAC, electric lighting, automatic control, weak current and other systems. The project was delivered on time in accordance with Party A's node requirements. The owner's equipment was moved on time in July and put into production smoothly.
Shenghejing Micro Integrated Packaging Project Starts
On May 19, according to "Jiangyin Release" news, the Shenghejing Micro ultra-high-density interconnected three-dimensional multi-chip integrated packaging project and J2C factory groundbreaking ceremony was held in Jiangyin High-tech Zone.
After the J2C factory project started this time is completed, an additional 30,000 square meters of clean room area will be added, pushing the total area of the purification factory in Shenghe Jingwei's Jiangyin operation base to more than 100,000 square meters, which will strongly support the company's three-dimensional multi-chip integrated processing and ultra- The development of projects such as high-density interconnected three-dimensional multi-chip integrated packaging meets the advanced packaging and testing service needs of customers in multiple fields such as smartphones, artificial intelligence, communications and computing, industrial and automotive electronics.
Chairman of Shenghe Jingwei said that this time the large field of view photolithography technology was used to achieve the 0.8um/0.8um line width and line spacing technical level, and the processed silicon through hole adapter board products reached 3 times the mask size. The new project marks the company's The field of advanced packaging technology has officially entered the sub-micron era.
Pangu Semiconductor’s Advanced Packaging and Testing Project Signed in Pukou
According to the "Pukou Economic Development Zone" news, on May 18, the Pangu Semiconductor advanced packaging and testing project with a total investment of 3 billion yuan was officially signed in the Pukou Economic Development Zone.
Pangu Semiconductor's advanced packaging and testing project has invested 3 billion yuan. Construction will start this year. A new factory with a total construction area of about 120,000 square meters and related ancillary facilities will be built. After reaching full production, the annual output value is expected to be no less than 900 million yuan. This project focuses on the development and application of board-level packaging technology, which will complement the weak links in Pukou's integrated circuit industry chain and enhance the level of industrial development.
Huatian Technology invested 8 billion yuan in 2018 to start the construction of the first phase of the Huatian Nanjing project. It only took 17 months from the start of construction to the start of production. Huatian Jiangsu was established in 2021 and invested 9.95 billion yuan to launch the wafer-level advanced packaging and testing production line project. The main body of the project is currently fully capped. In March this year, the company invested an additional 10 billion yuan in the second phase of the Huatian Nanjing project. Less than two months later, Pangu Semiconductor, controlled by Huatian Jiangsu, signed a contract, marking that Pukou Economic Development Zone has become the most important sector in Huatian's technology industry map.
The first phase of the advanced packaging project of Wuyuan Semiconductor has reached its peak
On May 15, according to the "North Shore Industry Alliance", the capping ceremony of the first phase of the Wuyuan Semiconductor project was successfully held.
The Wuyuan Semiconductor project is located in the North Shore chip packaging base. The project is centered around the 3D wafer stacking advanced packaging production line and is being constructed in two phases. The first phase has a total investment of 2.37 billion yuan, a total area of 122 acres, and a planned construction area of 116,000 square meters. The R&D testing plant, power plant, three-dimensional stacked plant, supporting substations, dangerous goods warehouse, etc. are expected to be completed and accepted by the end of December this year.
It is reported that Wuyuan Semiconductor provides a series of customized advanced packaging products and services based on wafer-level advanced packaging technology. A 12-inch wafer-level advanced packaging experimental line has been built, and a 12-inch wafer-level advanced packaging mass production line with a monthly production capacity of 20,000 pieces has started construction and will be put into mass production in June 2025.
