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D1z + LPDDR5X next year. Make it happen CXMT!
Chinese semiconductor thread II
- Thread starter vincent
- Start date
D1z + LPDDR5X next year. Make it happen CXMT!
Zhejiang University progress on Atomic-level precision research and development of enterprise customized instruments and equipment.
All technologies have independent intellectual property rights. Some patents are as follows:
(1)Creep performance testing device, patent number: ZL202310488956.X;
(2)Bending creep test device, patent number: ZL2023105458547;
(3)A wafer moving device and semiconductor production equipment, patent number: ZL2023110048222;
(4)Shear creep testing device, patent number: ZL2023109612996;
(5)Wafer inspection device and wafer inspection method, patent number: ZL2023110801486;
(6)Wafer cleaning device, patent number: ZL2023112604730;
(7)Processing equipment and processing methods, patent number: ZL2023113380224;
(8) Wafer processing device and wafer processing method, patent number: ZL2023114897100;
(9) Wafer drying device and wafer drying method, patent number: ZL2023115523754.
CETC advance packaging solutions including Systems on a Package and Heterogeneous Integration
Huawei may be relying on CXMT (ChangXin Memory Technologies), a Chinese DRAM fab that recently produced the first fully domestic LPDDR5 module. However, DRAM production also heavily relies on EUV-made chips for performance and power efficiency, presenting another challenge for Huawei and its domestic partners in their quest to become competitive in the smartphone market.
RAM is supplied by South Korea's SK Hynix, but Huawei is likely to use memory stored in its inventory before trade sanctions shut down business between the two companies. Huawei may also choose chips from ChangXin Memory Technologies (CXMT) if they run out of stock at the moment, according to iFixit.
you don't need EUV to make D1z or D1a node DRAMs. They are only getting to D1z in mass production next year.
remember, DRAMs are a commodity. they can source it from third parties
I will make a bet that China will far surpass US in advanced Chip manufacturing by 2032. In fact I will make a bet that China will catch up to Taiwan in advanced Chip production by then in both volume and technology. China is moving at 3 times the speed compared to everyone else right now. They will make progress in 10 years what others will take 30 years.