Chinese semiconductor thread II

gelgoog

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Huawei's HiSilicon Chip Revenue Skyrockets 24471% year-on-year​

Mar 18, 2024
(AsianFin)— Huawei's HiSilicon processor shipments reached 6.8 million units in the fourth quarter of 2023, an increase of 51 times compared to the same period in 2022, according to the latest data released by research firm Canalys.

The fourth-quarter revenue reached $7 billion, skyrocketing 244 times year-on-year.

At the same time, the top three in the global smartphone chip market, namely MediaTek, Apple, and Qualcomm, saw shipments increase by 21%, 7%, and 1% year-on-year, respectively.


For comparison Qualcomm had Q4 2023 revenues of $8.7 billion.
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Pretty spectacular recovery. And do not be too surprised if HiSilicon surpasses Qualcomm this year in revenue.

Mediatek had Q4 2023 revenues of NT$129,562 million i.e. $4 billion.
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tphuang

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Huawei's HiSilicon Chip Revenue Skyrockets 24471% year-on-year​

Mar 18, 2024
(AsianFin)— Huawei's HiSilicon processor shipments reached 6.8 million units in the fourth quarter of 2023, an increase of 51 times compared to the same period in 2022, according to the latest data released by research firm Canalys.

The fourth-quarter revenue reached $7 billion, skyrocketing 244 times year-on-year.

At the same time, the top three in the global smartphone chip market, namely MediaTek, Apple, and Qualcomm, saw shipments increase by 21%, 7%, and 1% year-on-year, respectively.


For comparison Qualcomm had Q4 2023 revenues of $8.7 billion.
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Pretty spectacular recovery. And do not be too surprised if HiSilicon surpasses Qualcomm this year in revenue.

Mediatek had Q4 2023 revenues of NT$129,562 million i.e. $4 billion.
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2023Q4_SmartphoneSoCRevenueShare.jpeg

You mean this one? I posted this a while back. Hisilicon is still way behind Qualcomm and Mediatek in revenue

Unisoc must have the cheapest SoCs ever. It needs to get better at this.
 

tphuang

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BYD Semiconductor showcasing it's product in Beijing last month

在MCU系列板块,此次亮相的相关产品均为车规级产品。车规级MCU采用高可靠性的车规级制造工艺,严格按照AEC-Q100 Grade1质量标准测试认证,遵循IATF16949体系下生产管控流程,可提供8位和32位内核系列,安全等级可最高达到ISO26262 ASILB标准。产品适用于车灯、BLDC电机控制、传感器检测、充电枪、控制面板、PM2.5等车身电器应用。除此之外,比亚迪半导体还带来了BMS、车身附件、传感器、光源产品、车载香氛、驱动IC等车规产品,其中1200V驱动芯片采用磁隔离技术实现超高压驱动应用,属于国内首创,获得了一致好评;搭载豹5的车载香氛更是得到国内外访客的高度评价
Including 8 and 32-bit MCUs that are auto grade. Along with a bunch of other chips. Including 1200V driver IC using magnetic isolation technology to achieve high voltage drive application, a first in China

Also showcased its IGBT and SiC MOSFET technology
 

tokenanalyst

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L-PAMiD achieved a breakthrough from "0" to "1", and the 12-inch production line entered the mass production stage​

The integrated company's self-produced MAX-SAW L-PAMiD (main transceiver module, integrated RF low-noise amplifier, RF power amplifier, The RF front-end module (RF front-end module) product of RF switches, duplexers/quadplexers and other devices has achieved a breakthrough from "0" to "1" and is already in the engineering sample stage.

According to disclosures, Zhuosheng Microchip Zhuo is currently divided into two production lines, 6-inch and 12-inch. The 6-inch production line is for SAW filter-related processes and products. In 2023, the output scale of the 6-inch SAW filter production line can be up to Reaching 8,000 pieces/month. Its first-phase production capacity plan is 10,000 pieces/month, and the second-phase production capacity plan is increased to 16,000 pieces/month.

The IPD process platform of its 12-inch production line has officially entered the mass production stage in the first quarter of 2024. At the same time, Zhuosheng's production and research processes for micro-RF switches and low-noise amplifiers have been basically finalized. The company has developed more production and research capabilities for advanced RF front-end chips and modules and the high adaptability of its advanced architecture to terminals to expand more products in the future. Product categories and industry application fields provide more possibilities.

In addition, the filter product manufacturing capacity of Zhuosheng Micro's 6-inch production line has steadily increased, and the products have been gradually upgraded and expanded from ordinary SAW filters to MAX-SAW. During the reporting period, high-yield mass production has been achieved and is at full production.

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tokenanalyst

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Kunbo Seiko: Develops and produces small batches of 6-inch and 8-inch silicon carbide furnace bodies and key components for wafer cutting and grinding machines​

Kunbo Precision Chairman Li Quanming said that in 2024, the company's business plan is as follows: to comply with the development of technological trends in the new energy power generation industry, expand R&D investment in product performance upgrades for high-power wind turbines, and highlight its expertise in low-temperature, high-strength and high-toughness materials. Advantages of molding process technology, manufacturing main shaft transmission structural components of wind turbines above 7MW, forming technical and cost advantages. Accelerate the construction of semiconductor clean manufacturing workshops, develop and produce precision clean parts for semiconductor processing equipment and industrialize them. In terms of electric injection molding machine components, we develop sample welding structure fuselages and panels, expand supporting business with original customers, and form a series of products.

Expand the research and development of semiconductor growth furnaces, expand from the photovoltaic single crystal furnace industry to the semiconductor growth furnace industry, and cooperate with technology leaders in semiconductor growth furnaces to develop and produce small batches of 6-inch and 8-inch silicon carbide furnace bodies as well as wafer cutting and grinding The key components on board will lay the foundation for the rapid development of market demand for semiconductor equipment in the future.​

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tokenanalyst

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Fuchuang Precision achieves a good start in 2024 with high revenue and net profit growth in the first quarter​


Recently, Fuchuang Precision Disclosed the first quarter report of 2024. Benefiting from the scale effect of the Nantong factory, in the first quarter of 2024, the company achieved revenue of 701 million yuan, a year-on-year increase of 105.47%; net profit attributable to the parent company was 60.4296 million yuan, a year-on-year increase of 53.42%.

Fuchuang Precision is a domestic semiconductor company A leading enterprise in equipment parts, focusing on precision manufacturing technology of metal material parts. Its main products are divided into four categories: process parts, structural parts, module products, and gas pipelines. They are mainly used in semiconductor photolithography machines and etching machines. , thin film deposition equipment and other downstream fields.

On the one hand, the company has undertaken many national “02 major projects”, including “Integrated Manufacturing Technology and Processing Platform for Key Components of IC Equipment”. In addition, the company has successively achieved mass production of precision components for semiconductor equipment in multiple processes , and continues to promote the localization rate of some precision components for semiconductor equipment.

On the other hand, the company is also one of the few manufacturers in the world that can mass-produce precision components used in semiconductor equipment, with leading process completeness. In 2023, the company invested 206 million yuan in research and development, accounting for 9.97% of operating income, an increase of 2.08 percentage points compared with the same period in 2022. While continuously increasing investment in research and development, the company has successfully completed the verification work for domestic leading customers for some products in the research and development stage in 2022, and achieved mass production of some products.

In order to solve the contradiction between supply and demand and expand market share at the same time, during the reporting period, the company actively promoted the construction of a "full-process intelligent manufacturing production base for integrated circuit equipment parts". As the construction of the fundraising project comes to an end, in the future, during the gradual release of new production capacity, the company's informatization, intelligence, and flexibility levels will continue to be improved, and production efficiency, management capabilities, and operational levels will also be further strengthened.

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tokenanalyst

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Piotech 2024 progress on thin film deposition equipment.​


The company's PECVD has achieved full coverage of dielectric materials, and its process coverage capabilities such as ALD, SACVD, and HDPCVD have been continuously improved, and its competitiveness in the field of thin film deposition has been highlighted. The equipment in the field of hybrid bonding is also the first domestically produced product of the same type used in mass production, and the volume is worth looking forward to.

The competitiveness of thin film deposition equipment continues to improve, and the hybrid bonding equipment has become the first domestic mass production equipment PECVD: it has achieved coverage of the full range of PECVD thin film materials. General dielectric thin film materials (including SiO2, SiN, TEOS, SiON, SiOC, FSG, BPSG, PSG, etc.) and advanced dielectric thin film materials (including ACHM, LoKⅠ, LoKⅡ, ADC Ⅰ, ADCⅡ, HTN, a-Si, etc.) have been Realize industrial application.

PE-ALD: It has been industrialized and can deposit SiO2, SiN and other dielectric thin film materials with high temperature, low temperature, high quality and other requirements. The first PE-ALD (N 300H Astra) equipment (depositing SiO2 thin film) passed customer verification and achieved industrial application.

Thermal-ALD: The first Thermal-ALD (TS-300 Altair) equipment passed customer verification and achieved breakthrough progress.

SACVD: The company's SACVD equipment that can realize SA TEOS, BPSG, and SAF thin film process deposition has passed customer verification.

HDPCVD: The first equipment (depositing USG film) passed customer verification and continues to receive customer orders.

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tokenanalyst

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Wanhua Chemical new patent for long-term and high-rate tungsten chemical mechanical polishing fluid​


Wanhua Chemical Group Co., Ltd. (hereinafter referred to as: Wanhua Chemical) applied for a project titled "A long-term and high-rate tungsten chemical mechanical polishing fluid and its application." Publication number CN117947422A. The patent abstract shows that the present invention discloses a long-term and high-speed tungsten chemical mechanical polishing liquid and its application. The tungsten chemical mechanical polishing liquid contains the following mass percentage components: 0.1%-5% abrasive, 0.5 ~5% oxidant, 0.001%~0.05% tungsten catalyst, 0.01%-0.05% stabilizer, 0.005%-0.05% surface quality improver, 0.001%-0.003% oxidase, the balance is deionized water . The tungsten chemical mechanical polishing liquid of the present invention has the characteristics of high speed for a long time and good surface quality.

With the continuous development of integrated circuits, the miniaturization of processing precision and the complexity of circuit functions, multi-layered, high-performance three-dimensional structures have become the development trend of wiring. Under high current density, metallic tungsten has good resistance to electron migration, does not form hillocks, has low stress, and can form good ohmic contact with silicon. It is used as a filling metal material for contact windows and via holes in multi-layer wiring. has been widely accepted. Tungsten polishing liquid is mainly used to manufacture memory chips. It is only used in some process sections in logic chips. Tungsten chemical polishing liquid is generally not prepared for immediate use in FAB factories.

Polishing liquid and oxidant are usually mixed in the tank, and then reuse. It takes about a week to use a barrel of tank polishing fluid, and such a long time will inevitably cause the hydrogen peroxide to decompose, and the decomposition of the hydrogen peroxide will lead to a decrease in the hydrogen peroxide content, further reducing the oxidation ability, resulting in a decrease in the polishing rate.
Currently, in order to increase production capacity, FAB manufacturers require tungsten chemical polishing fluids to have a stable high polishing rate for as long as possible, thereby increasing production. However, high polishing rate will inevitably bring about the problem of poor surface quality. Therefore, it is very necessary to obtain a tungsten chemical polishing fluid with high polishing rate for a long time and good surface quality. The invention provides a tungsten chemical mechanical polishing liquid with high polishing rate for a long time and good surface quality. By adding an oxidase and a surface quality improving agent, it can ensure that the tungsten chemical mechanical polishing liquid has high polishing rate for a long time and excellent surface quality.

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