broadsword
Brigadier
Who is she? Asking for myself.
Chinese semiconductor thread II
- Thread starter vincent
- Start date
Who is she? Asking for myself.
How many Kirin 9010 chips fit on a 12 inch wafer?
According to Kirin 9000s die measured 107 mm2.
Our @hvpc, with access to TechInsights full analysis, gave a detailed description here on the forum, in particular actual die size should be: 10.66 x 10.39 mm
There is an to compute dies per wafer in a correct way (is not trivial because of the dies at the edge of the wafer).
Inserting correct dimensions and leaving remaining parameters at default I got this:
So it's 222 theoretical dies per wafer, but now we have to consider the yield.
Nobody knows the actual yield, but we can assume it to be between 50% (pessimistic) and 85% (optimistic). With those values we get:
Yield 50% --> 110 dies/wafer
Yield 85% --> 188 dies/wafer
It means that between 53K and 90K wafers are needed to produce 10M Kirin 9000s
Please note this data refers to Kirin 9000s, not the 9010 inside the new Huawei Pura 70
isn't 200mm equal 8 inches？
Because $95 billions is needed for Israel and Ukraine, you have to make do with $52 billion dollars ....lol
The US government has cancelled the latest round of funding for R&D under the CHIPS Act as it is oversubscribed. The CHIPS Program Office announced that it would not move forward with its third Notice of Funding Opportunity to construct, modernize, or expand commercial R&D facilities in the United States.18 hours ago
The US government has cancelled the latest round of funding for R&D under the CHIPS Act as it is oversubscribed. The CHIPS Program Office announced that it would not move forward with its third Notice of Funding Opportunity to construct, modernize, or expand commercial R&D facilities in the United States.18 hours ago
antiterror13
Brigadier
yeahh and 12 in is 300mm. I have recalculated and got 539 DPW 300mm. I'd take in the middle of 70% yield
So 70% * 539 = 377 DPW ... so 10M Kirin 9000 would need 26,500 wafers
BUT BUT the yield is bad and using DUVi will cost a lot due to using multi patterning compare to EUVi.
Assuming that apple makes $600 from each phone, and Huawei makes $300 for each phone. $300 profits for 60 million phones, that would be $18 bilion of profits for Huawei. So the extra costs for DUV multi-patterning is trivial. As Huawei displaces apple smartphones in China, all the profits stays local instead.
I've discussed this many times before. Each 12-inch wafer can have about 550 chips. If we do 70-75% yield, then that's about 400 chips. Depending on binning criteria, they could do better or worse than that. Again, not all the defective chips are just thrown out.
10 million would take around 25000 wafers. Which isn't all that much really
Huawei needs to produce about 60 million this year and maybe 100 million next year. That would be 150k wafers this year and 250k wafers next. But keep in mind that it's also looking to produce 500k Ascend GPUs and maybe 1.5m Kunpeng CPUs this year. And that number will probably increase 50% next year
10 million would take around 25000 wafers. Which isn't all that much really
Huawei needs to produce about 60 million this year and maybe 100 million next year. That would be 150k wafers this year and 250k wafers next. But keep in mind that it's also looking to produce 500k Ascend GPUs and maybe 1.5m Kunpeng CPUs this year. And that number will probably increase 50% next year