Chinese semiconductor thread II

tphuang

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He was referring to AMEC products only

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3月19日,国产半导体设备大厂中微公司董事长、总经理尹志尧在2023年度业绩说明会上表示,中微公司绝大部分刻蚀设备的零部件已实现国产化,而且在很短的时间内,将全面实现自主可控的基础。


在2023年底中微公司80%的限制进口零部件可以在国内进行替代,随后将在2024年下半年实现100%的替代。
Yes I agree that this article was based on that statement.

Clearly, something was wrong with translation. So we've had a huge discussion based on a false premise. There is no need to discuss this further.

As such, anything more on this topic will be deleted.
 

tokenanalyst

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Hesai releases fourth-generation chip architecture ultra-wide-angle long-range lidar ATX​


On April 19, 2024, Hesai officially released the ultra-wide-angle long-range lidar ATX based on the fourth-generation chip architecture.

ATX is a platform product that follows the mature AT platform that has been mass-produced for hundreds of thousands of units, and is equipped with the fourth-generation chip architecture. It comprehensively upgrades the optical-mechanical design and laser transceiver module, achieving the perfect combination of compact size and powerful performance. . ATX is not only 60% smaller in size and 50 % lighter than AT128, but also achieves longer detection distance, better optimal resolution, and wider field of view , giving smart cars strong three-dimensional perception.

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tokenanalyst

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Hefei Century Gold Core wins Japan’s large order of 130,000 pieces of 8-inch SiC substrates​


Hefei Century Gold Core Semiconductor Co., Ltd. (hereinafter referred to as "Century Gold Core") signed an order for SiC substrate wafers with a Japanese customer. According to the agreement, Century Gold Core will deliver a total of 130,000 8-inch SiC substrates to the customer for three consecutive years in 2024, 2025 and 2026, with an order value of approximately US$200 million.

At present, Century Goldcore's 6-inch SiC substrate wafer has reached order cooperation with several domestic head epitaxy and wafer manufacturers; the company's 8-inch SiC substrate wafer has completed multiple batches of product verification with domestic customers HT and ZDK. At the same time, Product verification is ongoing with Taiwan's HY, JJ, South Korea's GJ Laboratory, and SX, and orders are expected to be completed in the second half of 2024.

News from Hefei Century Gold Core Semiconductor Co., Ltd. shows that 8-inch SiC substrate wafers have also made major breakthroughs recently. The 8-inch SiC single crystal growth technology developed by the company can repeatedly grow crystals with 100% 4H crystal form, a diameter greater than 200mm, and a thickness exceeding 10mm. . An 8-inch processing line has also been built simultaneously, which will support the growth of 8-inch single crystals. Through further optimization of the process, the company's 8-inch SiC ingot is expected to have a thickness of more than 20mm.

In February 2024, the 8-inch SiC processing line of the Hefei factory was officially connected and entered small batch production. It is expected to achieve mass production delivery in July 2024.

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tokenanalyst

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Donghai Investment Honglan Semiconductor Fund was established to focus on investing in the radio frequency field​


Donghai Investment showed that Donghai Investment Co., Ltd. and Changzhou Tianning Industrial Upgrading Investment Partnership (Limited Partnership) jointly established Changzhou Tianning Donghai Honglan Venture Investment Partnership (Limited Partnership).

Partnership), focusing on investing in the radio frequency field of the semiconductor industry. The fund will give full play to the synergistic advantages of government + capital, attract high-quality semiconductor companies to Changzhou through equity investment, and support and promote the development of Changzhou's semiconductor industry.

Relying on its own semiconductor investment advantages, Donghai Investment focuses on the radio frequency field of the semiconductor industry, seizes the integration point between emerging semiconductors and various manufacturing links, uses domestic substitution/product innovation as a breakthrough point, and invests this fund in companies with rapid development opportunities and core technology thresholds. enterprises, injecting new productivity into Changzhou’s semiconductor industry chain.​
 

PopularScience

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all are old statements .. but its normal to give statement in response to US sanctions.

YMTC is already blacklisted by the USA .. and recently they started to talk '' put CXMT into entity list''.. i don't think so, CXMT will spare this time.

CXMT secured 6.5 Billion dollars from local government. they are not fools to risk such a huge amount without back up plan.

i believe, for matures nodes, domestic supply chain have completed..
YMTC is planning for third fab. Equipment is not an issue.
 

Phead128

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BUT BUT the yield is bad and using DUVi will cost a lot due to using multi patterning compare to EUVi. ;)
Assuming 5nm increases cost by 30-50% compared to 7nm according to Western analyst estimates, I fail to see the strategic implications on this.

At what cost?

Lets say SMIC 's SN+2 fab can produce enough 7nm chips for 230 million phones for $3.3 billion ($8K per wafer of 7nm Kirin 9010 @ 35K wafers per month @ 550 chips per wafer). For reference , Huawei intends to sell 60 million phones. Let say the cost rises by 50% due to multi-patterning to $5 billion to produce 5nm chips for same quantity. It's only an extra $1.5 billion annual cost which is easily affordable subsidy by China until domestic EUV is matured. Peanuts.
 
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