Chinese semiconductor thread II

[tokenanalyst]

Lehman Optoelectronics launches its third-generation home giant screen product, ushering in the era of widespread adoption of Micro LED home giant screens.​

Lehman Optoelectronics unveiled its third-generation Micro LED home giant screens at a launch event in Shenzhen, marking the official beginning of widespread adoption of ultra-large home displays. The company introduced two flagship models: the LV135 Max (135-inch, 4K) and LV163 Max (163-inch, 4K), priced at ¥199,999 and ¥239,999 respectively dramatically undercutting the previous industry barrier of over ¥500,000 for similar screens.

Available for pre-order via JD.com and Tmall, with shipments starting late March, these screens leverage pixel-level self-illumination, modular splicing, and low power consumption to deliver IMAX-like quality in the living room embodying Lehman’s vision: “The screen is the wall, the view is the world.”

Driven by national ultra-high-definition (4K/8K) content policies and consumer demand, Micro LED’s superior contrast, color accuracy, and durability make it the ideal technology for giant home displays. The products enable immersive “virtual reality” experiences allowing users to feel seasons change or explore global landscapes without leaving home.

Industry experts hail this as a pivotal moment transitioning Micro LED from commercial to consumer markets, unlocking a trillion-yuan blue ocean for China’s LED industry. With the Chinese home display market still dominated by 65–85-inch TVs, the 135-inch+ segment is poised for explosive growth over the next 3–5 years.

Lehman’s breakthroughs in cost reduction, supply chain integration, and scenario innovation have shattered previous adoption barriers — cost, product feasibility, content availability, and public awareness positioning the company as a leader in reshaping home lifestyles and accelerating dual upgrades across the display industry chain.

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[tokenanalyst]

Mingjia Semiconductor completes financing of over 100 million yuan to accelerate the mass production of 6-inch gallium oxide substrates.​

Beijing Mingjia Semiconductor Co., Ltd. successfully closed its A++ equity financing round, raising 110 million yuan (~$15.2 million USD), bringing its total funding to nearly 400 million yuan across five rounds. Led by investors including Pengcheng Venture Capital, Chengdu Science & Tech VC, Tianying Capital, Guoyu Fund, and Hongtai Fund, the company was valued at 910 million yuan post-money.

The funds will accelerate the mass production of 6-inch gallium oxide (Ga₂O₃) substrates a critical breakthrough enabling large-scale wafer fabrication for ultra-wide bandgap (UWB) semiconductors. Mingjia plans to expand its pilot lines with 20 new equipment units, boosting GaO substrate capacity to 30,000 wafers annually, while also developing 2–4 inch lines and scaling indium phosphide (InP) polycrystalline production.


This milestone marks Mingjia’s transition from R&D to industrialization, with signing ceremonies attended by Shunyi District officials and over 20 partners including investors, banks, and supply chain collaborators solidifying its ecosystem.​

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[tokenanalyst]

Shanghai Institute of Optics and Fine Mechanics has made progress in the field of adaptive interferometry detection of freeform surface optical elements.

Recently, the research team led by Professor Liu Shijie of the Optical Detection and Characterization Center of the High Power Laser Components Technology and Engineering Department of the Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, has made new progress in adaptive interferometry detection of optical components with large deviations from freeform surfaces. The relevant results were published in Optics Express under the title " Interferogram-free adaptive wavefront interferometry: fourier spot analysis enhancing adaptive compensation performance" .

To address the problem that traditional adaptive wavefront interferometry ( AWI ) heavily relies on interference fringe reconstruction and identification, making it ineffective in detecting large-area deviations from optical elements, this study proposes an interference-free adaptive wavefront interferometry ( IF-AWI ) based on Fourier spot ( FS ) analysis . This method completely eliminates the dependence on interference fringes, phase shift, and phase unwrapping during adaptive compensation. It guides the optimization direction by analyzing the Fourier spot intensity distribution, thus achieving stable and efficient wavefront compensation and measurement even when interference fringes cannot be formed or are severely missing.

To further improve optimization efficiency and convergence performance, the research team introduced a Runge–Kutta -based intelligent optimization algorithm, which achieves a good balance between global search capability and local convergence speed. This method can successfully compensate for freeform wavefronts with peak-to-valley values exceeding 100λ and root mean square values exceeding 20λ within about 60 iterations.

This achievement breaks through the fundamental limitation of traditional adaptive interferometry on the quality of interference fringes, significantly expands the measurable dynamic range of freeform surfaces, provides a brand-new technical path for the inspection of freeform surfaces in polishing, and has important application value for the manufacturing and inspection of high-end optical components.

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[tokenanalyst]

GigaDevice Announces New Generation GD32H7 Series MCUs​

GigaDevice has launched its new GD32H7 series of ultra-high-performance microcontrollers, built on the Arm® Cortex®-M7 core and clocked at up to 750MHz. The series comprises two distinct families: the GD32H789/779 for general-purpose high-performance applications and the GD32H78E/77E, which integrate EtherCAT® slave controllers for real-time industrial automation. These MCUs are engineered to deliver exceptional computational power with a unique 640KB Tightly Coupled Memory (TCM) that operates at CPU speed, enabling zero-wait instruction and data access a critical advantage for time-sensitive tasks and complex algorithm execution.

The GD32H7 series offers industry-leading memory configurations, including up to 2MB of Execution Flash, 8MB of Storage Flash, and 1.2MB of SRAM, making it ideal for applications requiring large code bases and high-speed data buffering. Its architecture ensures seamless continuity in performance, allowing sustained computational output without bottlenecks. Coupled with optimized power efficiency, the series sets a new standard for balancing raw processing capability with low dynamic power consumption essential for both high-end industrial systems and energy-conscious portable devices.

To support advanced system expansion, the GD32H7 MCUs feature dual OSPI interfaces capable of 200MHz operation with Double Data Rate (DTR) mode, enabling direct, high-speed connectivity to external memory types such as PSRAM, HyperRAM, NAND, and NOR Flash. This flexibility, combined with integrated real-time communication capabilities, makes the GD32H7 series a compelling foundation for next-generation applications in servo control, digital power supplies, smart home systems, and fire protection empowering developers to build faster, smarter, and more responsive intelligent equipment.

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[tokenanalyst]

With an investment exceeding 300 million yuan, Jingce Semiconductor, a leading domestic metrology equipment company has commenced construction on its Shanghai base.​

According to reports, on the morning of January 16, the R&D headquarters and equipment manufacturing base project of Shanghai Jingce Semiconductor Technology Co., Ltd. officially broke ground. This marks a new stage of development for this leading company in the field of semiconductor testing equipment, which is deeply rooted in Qingpu District under the precise service and support of the Shixi Software and Information Park. It also adds new momentum to the construction of the Yangtze River Delta innovation hub.

Located in the Shixi Software and Information Park in Qingpu District, the project covers an area of 26.8 acres and represents a total investment of over 300 million yuan. Upon completion, it will become a comprehensive base integrating R&D, production, and experimentation, further strengthening the park's core hub role in the integrated circuit industry chain. The project took only 10 days from land acquisition to obtaining a construction permit, demonstrating the "Qingpu speed" and precise service.

Shanghai Jingce Semiconductor Technology Co., Ltd. is a holding subsidiary of Wuhan Jingce Electronics Group Co., Ltd. Established in July 2018, the company focuses on semiconductor front-end process measurement technology and has mastered key core technologies such as spectral scattering measurement, optical interferometry, and electron beam/ion beam imaging. Its products cover film thickness measurement, optical critical dimension (OCD) measurement, electron beam defect detection and other equipment, which are widely used in advanced storage, HBM (high bandwidth memory) and other fields.

As a leading enterprise in China's semiconductor metrology field, the company has secured orders exceeding 400 million yuan in recent years. Its products have been delivered in batches to numerous well-known domestic semiconductor companies, and its technological capabilities and product stability have been highly recognized by customers. The company plans to invest approximately 350 million yuan in a second-phase laboratory expansion project, adding cleanrooms, office and laboratory areas, and other facilities to further enhance its R&D and production capabilities and alleviate the resource constraints of its existing production lines. Haijing Measurement Semiconductor Technology Co., Ltd. is a leading enterprise in China's semiconductor metrology field, and through technological innovation and capacity expansion, it is gradually enhancing its competitiveness in the global market.

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[JPaladin32]

Not sure if this was found before, but a high single-core Kirin 9030 Geekbench 6 score of 1866 was done by someone in DroidTong. To put this into perspective, its IPC is actually a bit higher than the ARM Cortex-X4 on the Snapdragon 8 Gen 3.

 

[tokenanalyst]

Loongson Technology's revenue is projected to grow by 26% in 2025​

Loongson Technology is on a strong recovery trajectory, projecting a 26% year-over-year revenue increase to approximately RMB 635 million in 2025, alongside a significant narrowing of losses. Net losses attributable to parent company shareholders are expected to decline by 28% year-on-year to RMB -449 million, with non-recurring adjusted losses also down 24% to RMB -503 million. This financial improvement stems from strategic growth in both policy-driven and open markets, driven by the company’s independent R&D capabilities. Key drivers include robust performance in industrial control chips, fueled by the resurgence of security applications and the cost-effectiveness of its new-generation embedded CPUs, as well as strong traction for its flagship “Three Musketeers” CPU solutions in office and industry IT systems. Additionally, the company has pioneered a new revenue stream through external technology licensing of its 3C6000 server chips, further diversifying its income sources.

Beyond revenue and loss metrics, Loongson’s operational health has markedly improved. Gross margins have rebounded to healthy levels due to higher sales of premium industrial control products, strong margins from technology licensing, and large-scale shipments of low-cost companion bridge chips for desktop CPUs. Asset quality has also strengthened, with total credit and asset impairment losses falling by RMB 84 million to RMB 165 million, reflecting better accounts receivable management and reduced inventory write-downs as market demand recovers. The company attributes its “steady recovery trend” to sustained innovation, optimized product portfolios, and refined market strategies that have enhanced its competitiveness in critical information technology sectors. These developments position Loongson Technology to build a solid foundation for long-term, high-quality, and sustainable growth in China’s domestic tech ecosystem.

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[tokenanalyst]

Capable of producing tens of millions of chips! China's first gallium nitride laser chip IDM mass production line has achieved stable operation.​

China has achieved a landmark breakthrough in semiconductor technology with the successful stable operation of its first gallium nitride (GaN) laser chip IDM (Integrated Device Manufacturer) mass production line, located in Liuzhou, Guangxi. Developed by Guangxi Juxin Technology (Hurricane Technology) under the leadership of Dr. Hu Xiaodong a Peking University, Tsinghua, and UESTC-educated scientist the facility can now mass-produce tens of millions of GaN laser chips annually, ending China’s 30-year dependence on foreign imports for short-wavelength visible lasers (blue and green).

GaN laser chips dubbed the “jewel in the crown” of semiconductor optoelectronics are critical for laser displays, advanced manufacturing, medical devices, and national defense. For decades, this technology was dominated by U.S. and Japanese firms, severely constraining China’s high-tech industries.

Dr. Hu’s team overcame eight core technical barriers after over 20 years of R&D, developing proprietary crystal epitaxy and packaging technologies. The company achieved full domestic substitution for low-power green lasers and is preparing to begin mass production of high-power blue lasers in 2026 a major step toward closing the gap with global leaders.

In July 2025, Hurricane Technology secured RMB 300 million in Series B funding, which will accelerate R&D for next-gen high-power blue lasers, expand upstream/downstream supply chains, and attract top-tier talent. The company is now entering a new growth phase driven by three pillars: technological innovation, scaled production, and ecosystem development.

This milestone not only transforms Liuzhou long known for heavy industry into a high-tech semiconductor hub but also marks China’s decisive entry into the global GaN laser chip market, reducing strategic vulnerabilities and boosting domestic high-end manufacturing capabilities.

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[tokenanalyst]

Guangdong Chip Semiconductor Phase IV Project Launched​

On January 22, the launch ceremony for the fourth phase of the Guangdong Semiconductor Technology Co., Ltd. (hereinafter referred to as "Guangdong Semiconductor") project was held in Guangzhou Development Zone and Huangpu District.

The project, with a total investment of approximately 25.2 billion yuan, plans to construct a 12-inch mixed-signal specialty process production line with a monthly capacity of 40,000 wafers. Focusing on six key areas—sensing, transmission, computing, storage, control, and display—it will systematically build a world-class platform for mixed-signal and optoelectronic integration specialty processes. According to reports, the fourth phase of the Guangdong Chip project will precisely address the urgent demand for specialty processes driven by the explosive growth in cutting-edge fields such as AI, edge AI, industrial electronics, and automotive electronics.

Chen Wei, president of Guangdong Chip Semiconductor Technology Co., Ltd., believes that the official launch of the fourth phase of the Guangdong Chip project has clarified a new direction for the company's advancement. On the premise of consolidating and expanding its advantages in analog specialty processes, the company will use the fourth phase project to precisely supplement and optimize key production capacity, deeply strengthen its specialty process platform capabilities, and realize the transformation from "pure analog" to "analog-based manufacturing zone, creating a research and design cluster in Guangzhou Science City, and creating an application scenario demonstration zone in the south."

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[tokenanalyst]

With a total investment of 5 billion yuan, Lead Technology's semiconductor core components and systems project was launched in Lingang.​

On January 22, 2026, Shanghai’s Lingang New Area hosted the groundbreaking and commissioning ceremony for key 2026 semiconductor projects, led by the launch of the “Semiconductor Core Components and Systems Project” by Shanghai Yuanchuang Kexin Semiconductor Technology Co., Ltd., a subsidiary of Lead Technology Group.

With a 5 billion yuan ($700M+) investment and spanning 108 mu (about 72,000 m²), the project is a strategic pillar of China’s national semiconductor strategy. It aims to establish a fully integrated platform covering materials R&D → component manufacturing → equipment verification → technical services, enabling end-to-end solutions for domestic semiconductor equipment makers.

Leveraging Lead Technology’s 30 years of expertise in rare and dispersed metal materials and its closed-loop supply chain from materials to recycling the project will develop critical, domestically undersupplied components including:
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• Mass Flow Controllers (MFCs)​
• Precursor delivery systems​
• Online monitoring sensors​
• Advanced ceramic parts​
• Specialized power supplies​
• Semiconductor vacuum systems​

The initiative directly addresses bottlenecks in China’s semiconductor equipment supply chain, aiming to boost localization rates and reduce reliance on imports. Upon completion, it will supply leading domestic wafer fabs and equipment manufacturers, strengthening the regional ecosystem in Lingang.

Chen Jinshan, senior Shanghai official, attended and announced the launch. Zhu Shihui, Lead Technology’s Chairman, emphasized this as a proactive response to national strategic needs, with plans to collaborate across the industry to build a secure, controllable semiconductor equipment supply chain.

As a multi-award-winning firm with national R&D experience, Lead Technology’s Lingang facility is positioned as a benchmark project for domestic semiconductor manufacturing, enhancing innovation and resilience in China’s integrated circuit cluster.

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