Chinese semiconductor industry

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AndrewS

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There is nothing to reverse engineer from Gucci and others. They are mediocre products that get boosted by brand name and white worship. Quality counterfeits (not $1-2 ones) are essentially their carbon copies that you won't be able to distinguish unless you were told from the start. You won't see such situations with the products that actually rely on technology and R&D rather than brand groupthink. For example, Apple has both but you won't ever find a cheap carbon copy of the iPhone - it will have inferior hardware and software, making it a completely different and objectively worse product.

The actual production cost of a luxury bag is around $200-$500 from what I gather

The rest is profit and marketing costs for a "luxury" product


Last year, Alexander Wang sent a model down the runway at New York Fashion Week in a leather biker jacket that cost $2,995. A startup called Italic found the same factory that Wang used and created a similar jacket—including the placement of studs, zippers, and a belted waist—that was distinct enough that it wasn’t considered cribbing the design. Italic’s price? $280.

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xypher

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The actual production cost of a luxury bag is around $200-$500 from what I gather

The rest is profit and marketing costs for a "luxury" product
Probably even less tbh. Depending on the size of the bag, jackets usually require more material and Italic is definitely not working for 0 profit. So the real cost for the jacket is likely in the $100 range.

P. S. We are going completely off-topic tho.
 

WTAN

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@Hendrik_2000 bro to add to your post ( I enjoy it very much) here is another YT video supporting Huawei 14nm 3D stacking tech. I'm excited , with explanation from @krautmeister ,@FairAndUnbiased ,@foofy ,@WTAN and @tokenanalyst about what this tech can do, it will revolutionized the Chinese IC and reach partial parity with the established players. As always Huawei lead the way, they are truly the VANGUARD of China Tech development.

A background

Richard Yu, the CEO of Huawei's consumer business, has publicly declared that "Huawei will be back in 2023", which means he has a lot of confidence, perhaps because it will solve its chip manufacturing problems. Huawei has been looking for ways to solve its chip supply problem for more than a year, first through a partnership with Qualcomm and later through its own development of technologies such as dual-core stacking. Despite the agreement, Qualcomm is only allowed to supply 4G chips, and its support is obviously limited in the current global mobile phone market transition to 5G, so Huawei will have to solve the chip technology problems on its own. Huawei's research and development of double core superposition technique can make use of the launch of China has 14 nm, using the existing mature technology to increase the chip performance to close to 7 nm level, more recent news refers to the superposition of huawei adopts double core research and development of new kirin chip can be close to 5 nm in terms of technical performance, highlights its great strength in chip technology research and development.

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Looks like Hisilicon is very ambitious.
It is developing 2 Types of 14nm 3D Stacked Chips. The first Chip with Performance similiar to 7nm and followed by another Chip with Performance similar to 5nm.
2023 will be a very big year for Huawei.
 

ansy1968

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Looks like Hisilicon is very ambitious.
It is developing 2 Types of 14nm 3D Stacked Chips. The first Chip with Performance similiar to 7nm and followed by another Chip with Performance similar to 5nm.
2023 will be a very big year for Huawei.
@WTAN Sir I know 14nm 3D chiplet is comparable to 7nm performance, BUT 5nm? Is that possible? maybe they are developing a 7nm 3D chiplet?
 

MortyandRick

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Looks like Hisilicon is very ambitious.
It is developing 2 Types of 14nm 3D Stacked Chips. The first Chip with Performance similiar to 7nm and followed by another Chip with Performance similar to 5nm.
2023 will be a very big year for Huawei.
Is that true? I hope so but I really done want to get overzealous.
 

Overbom

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Looks like Hisilicon is very ambitious.
It is developing 2 Types of 14nm 3D Stacked Chips. The first Chip with Performance similiar to 7nm and followed by another Chip with Performance similar to 5nm.
2023 will be a very big year for Huawei.
So can we expect that the stacked 14nm chips will have similar performance to 7nm, but will be more expensive? Is that correct
 

WTAN

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@WTAN Sir I know 14nm 3D chiplet is comparable to 7nm performance, BUT 5nm? Is that possible? maybe they are developing a 7nm 3D chiplet?
Its mentioned in the article/video(at bottom) you posted Ansy.
It is very likely using the 14nm 3D Chip as the design of the 5nm type Chip has already been recently finalised.
But at the same time thats the latest piece of news i heard thats been going around.
Hisilicon wants to get back to producing 5nm type Chips in order to have a competitive range of Mobile Phones for the local and overseas market.
 
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