antiterror13
Brigadier
You realize that 90 nm resolution doesn't mean 90 nm process node, because process node doesn't actually correlate with any specific feature size since 90 nm, right?
You also realize that 90 nm is close to the resolution limit for dry etch before immersion is required? And that 90 nm dry etch is competitive with Japanese lithography systems so at minimum it still has a market regardless of ASML?
Do you realize you can double resolution with a 90 nm dry etch system if you have a sufficiently high performance wafer stage and double pattern?
And you realize that 28 nm with double patterning can yield 7 nm class features (as 7 nm class doesn't mean actually 7 nm size) as Nikon has shown?
There is no indication that @nlalyst has any knowledge of it ... sadly