manqiangrexue
Brigadier
I would be happy to see China reach 50% by 2025; the 70% target was going nowhere with lazy Chinese companies happy to rely on foreign trading partners. Now the trust is gone and they are truly working. 50% or 70% is a detail; the trend of Chinese production making strides to reach and breach the best in the world is the most important part. And China is known to beat estimates so a 4 year one, I wouldn't pay heed until it's 12-18 months out.According to industry forecasts that I've read, even in 2025 more than half of IC production in China will come from foreign companies. The Made in China 2025 goal set the ambitious target of manufacturing 70% the value of the IC market in China.
Nothing from your first 2 sentences would support this. Industry experts estimate 50%; the target is 70%... so it looks like 20%. Nonsense.They seem to be on track to reach 20% by 2025.
It's growing it now.China first needs to grow its domestic IC industry, otherwise its lithography toolmakers will not be able to scale up to the level to challenge the current leader.
Actually, it was more than what meets the eye. China is able to suddenly make leaps and bounds now because it didn't start from nothing. That money went into good research that kept China within striking distance from market-competitive lithographs but they did not come because a free market favored ASML. Now the market is no longer free so China can bring them out and sprint from a close deficit rather than from out of sight as the US had hoped.Just in this year alone, the top three players: Samsung, Intel and TSMC will invest over $80bn dollars into growing their business. It was way back in 2014 that China set up its National Integrated Circuit Plan with the goal of investing $150 billion in the semiconductor industry. All the money was spent by 2020, but with very little to show.
That's just saying that the world didn't team up to beat ASML. That's pointless; ASML doesn't even manufacture all of its own components.If you look at the general geopolitical situation, there is a general drive from countries and region around the world to prop up their domestic semiconductor industry. ASML stands to reap huge rewards from this redundant and inefficient allocation of investment.
Nikon could not compete because the US took the food out of its mouth to build up ASML as it feared Asian domination and also because Japan's domestic market is too small. Neither of these issues exist with China.I thought you would suggest that China's lithography systems may compete against ASML because they will be cheaper. If you look at ASML's competition: Nikon offers DUV immersion systems that on paper appear to offer pretty much the same performance as ASML's systems and they are a lot cheaper. Despite that, ASML's share of the DUV immersion market in the last three years ranged from 95% to 85%. Obviously, the customers know best where the true value lies, regarldess of what the marketing brochures may claim.
That's only true in the sense that nobody's laughing at a serious topic. But it is very vulnerable to a Chinese catch-up and overtake. Once China is determined and moving, which it is, ASML simply does not have the resources or manpower to stave it off.ASML is so far ahead of everybody else that it's not even funny.
I don't need more money and I never bet against China because China always delivers. Furthermore, one cannot win a bet against one's own blood; it is a loss regardless of the outcome.Instead of betting against ASML, you should've bet in favor of them. Anyone who did in the last 5 years made a very nice profit on their stocks.
Don't think this is true. China is slated to do 7nm before EUV is ready.Complex features on 7nm require more than just double patterning with DUV immersion.
SMIC currently uses DUV to do 14nm.As far as I know, DUV cannot do 28nm. The physical limit is 32 nm. 28nm must refer to to the process name.
In a vaccum, it may be correct but there are other solutions that Chinese companies demonstrate, not used in traditional foundries that can improve chip performance. Reducing the nm scale isn't the only way to improve chip performance and this debacle has really forced China to advance in every way in the field. While the lithographs are being readied, other solutions are implemented and when the lithographs are ready, they come in again to further improve performance. Once China is determined at something, it will be done. Banning tech to China is the stupidest thing that the US keeps doing.It's well understood in the industry that single exposure EUV products have superior electrical features to DUV multiple exposure products. Anyone stuck on DUV, will have a hard time to competing in performance.
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