Chinese semiconductor industry

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ansy1968

Brigadier
Registered Member
More evidence that China is moving ahead to mass Produce 12nm & 14nm ICs in 2022 using a Locally Made Production Line.
@WTAN Sir will this induced EU, SK and Japan to change course, its a writing on the wall for everyone to see, China will achieve self sufficiency within a year and maybe by 2025 on par, now is the time for collaboration while the window are still open.
 

weig2000

Captain
More evidence that China is moving ahead to mass Produce 12nm & 14nm ICs in 2022 using a Locally Made Production Line.

I had some initial reservations about the claims that Wen Xiaojun made in the above article or the original interview, about 28nm and 14 nm domestic production lines this year and in 2022, respectively, simply because it's not clear what his background is and the research institute he is from hasn't been heard much before.

But the report bellow from guancha.com is yet another evidence to support the above claims, more or less. The report is an interview with Dr. Bao Yungang, the deputy director of the Institute of Computing, Chinese Academy of Science. Dr. Bao is better known publicly and the Institute of Computing at Chinese Academy of Science is an authoritative institution.

The report and interview are in Chinese, so apology in place. Essentially Dr. Bao said in the interview that China is making rapid progress in 14nm and 28nm domestic production lines.

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Some key quotes:

在眼下集成电路产业发展形势下,国产芯片制造的快速进步振奋人心。2019年第四季度,国产14nm工艺芯片实现量产,到了今年3月良品率已经达到90%-95%,同时已经完全有能力应对下游大规模量产的需要。目前,国产14nm领域的设备、工艺、封装、材料等各技术工艺环节都已经有系统部署,均在按部就班进行迭代升级。多位行业人士预测,国产14nm芯片各个环节会快速得到完善,明年实现规模量产的可能性很大。

The above is about domestic 14nm capability. Domestic mass production of 14nm was achieved in Q4 2019, and the yield had reached 90%-95% by March this year. In addition, the equipment, process, packaging and materials for 14nm have all been systemically under development and deployment. It is predicted by multiple insiders that all the production stages involved in 14nm production will be rapidly improved. It's very likely that volume production can be realized next year.

当然,要实现这些突破并不容易。包博士表示,国产14nm芯片攻克了许多技术难题,包括刻蚀机、薄膜沉积等关键装备实现从无到有,并批量应用在大生产线上;后道封装集成技术成果全面实现量产;抛光剂、溅射靶材等上百种关键材料,通过大生产线考核进入批量销售等等。这些成果基本覆盖了我国集成电路全产业链体系,扭转了之前工艺技术全套引进的被动局面。

More substantial information on the related technology breakthroughs for 14nm production above. Google tranlsation:

Of course, it is not easy to achieve these breakthroughs. Dr. Bao said that the domestic 14nm chip has overcome many technical problems, including the realization of key equipment such as etching machines and thin film deposition from scratch, and mass application in large-scale production lines; subsequent packaging integration technology achievements have been fully realized in mass production; polishing agent Hundreds of key materials, such as sputtering targets, have passed the assessment of large production lines and entered mass sales. These achievements basically cover the entire industrial chain system of my country's integrated circuits, and reverse the passive situation of the introduction of a complete set of process technologies.

The following is about 28nm, which Dr. Bao said is important for the "New Infrastructure" and industrial applications.

因此,加快国产28nm芯片布局,不仅有利于在这一领域站稳脚跟,而且在芯片国产替代和新基建大潮下大有可为。包博士指出,国内已经具备28nm技术节点完规模量产能力。在集成电路各产业链环节,有些企业研发已经取得了不俗成就,有些企业的产品生产线上已经得到具体应用。与此同时,国内在一些细分领域还实现了显著突破,比如在介质刻蚀领域已达到全球先进水平。

Essentially, China is in a position to have complete volume production capability at the 28nm node.

Finally, some comments on the progress in 7nm and 5nm nodes:

今年4月,国内已经实现7nm芯片试产,取得了阶段性成果。如果进展顺利,今年底或明年初时即可以实现7nm芯片批量生产。

不过,在5nm芯片工艺研发方面,国内依然面临不少困难。一方面,美国的限制一直未能出现根本性的解除,导致国内依然难以获得顶级水平的光刻机。另一方面,5nm芯片本身也是一个巨大的技术挑战,难度要高出7nm很多。但在面临多项压力、困难下,国内也已经启动了5nm芯片工艺研发,力求在2021年底之前先打通完整工艺流程,再向实验生产阶段迈进。​

7nm trial production was started in April. If everything goes smoothly, batch production of 7nm can be achieved at year end or early next year. The 5nm R&D is much more challenging, due to its inherent challenges and the sanction from the US making it difficult to get high-end litho machine. Still, the 5nm process R&D has started, and the striving goal is to have complete production process flow before the end of the year, before moving further to trial production.

All in all, it appears that China is making progress across the broad from 28nm, 14nm, to 7nm/5nm nodes. The progress has been uneven, understandably, in terms of maturity of the process and the extent of domestic equipment and materials employed.
 

broadsword

Brigadier

Here:

Huawei unit signs chip supply chain deal with China partner​

Agreement between HiSilicon and Shenzhen toolmaker aimed at beating US pressure
https%253A%252F%252Fs3-ap-northeast-1.amazonaws.com%252Fpsh-ex-ftnikkei-3937bb4%252Fimages%252F3%252F1%252F8%252F4%252F35164813-4-eng-GB%252FCropped-1625585541-05-31T203135Z_294027053_RC160746B9F0_RTRMADP_3_HUAWEI-TECH-USA-CHINA.JPG

A Kunpeng 920 chipset designed by Huawei's Hisilicon subsidiary is on display at Huawei's headquarters in Shenzhen. © Reuters
CHENG TING-FANG and LAULY LI, Nikkei staff writersJuly 7, 2021 01:02 JSTUpdated on July 7, 2021 14:08 JST
TAIPEI -- Huawei's chip design arm has struck a deal aimed at building up its domestic supply chain, a local partner said on Tuesday, in a first public move against a U.S. clampdown aimed at cutting its access to vital technology.
Shenzhen JT Automation Equipment, a Chinese chip production tool maker, on Tuesday said in a stock exchange filing that it has signed a five-year legally binding memorandum of understanding with Huawei's HiSilicon Technologies unit, China's biggest chip developer.
"Huawei's HiSilicon is stepping up efforts to push to build a domestic chip packaging and testing supply chain," JT said in the filing on Tuesday.

"Both parties aim to expand collaboration on semiconductor packaging tool development in a bid to solve the 'neck-choking' problem and realize a self-sufficient and controllable industry," the filing said in an apparent reference to U.S. efforts to restrict supplies to Huawei.
JT's share price had jumped nearly 20% as of the end of morning trade on Wednesday.
Founded in 2004 in Shenzhen, JT describes itself as an equipment maker essential for the production of consumer electronics, automotive electronics, space and aviation, and defense technology. It counts China's largest home appliance maker Gree, rival brand Haier and electronics assembler Flex among its main clients.
Huawei declined to comment on this story.
The U.S. Commerce Department since May 2019 has repeatedly ratcheted up export controls against Huawei, citing national security concerns. It aims to cut access to American technologies for Huawei and its subsidiaries.
As part of the curbs, the U.S. has blocked many of HiSilicon's suppliers including Taiwan Semiconductor Manufacturing Co. and ASE Technology Holding -- respectively the world's biggest contract chipmaker and biggest chip packaging and testing service provider -- from working with the Chinese company because their processes involve U.S. technologies.
The U.S. move hit Huawei's core chip development and its flagship smartphone business, where its market share plunged to only 4% in the first quarter of 2021 from 18% a year ago, when it was still the world's second-largest phone maker.
Chip production tools and chip design software, also known as electronic design automation, are
Please, Log in or Register to view URLs content!
, including Applied Materials, Lam Research, KLA, Synopsys and Cadence Design Systems.
Huawei's HiSilicon is China's biggest developer of chips used in a range of settings including smartphones, notebooks, servers, vehicles and TVs. The unit was also the world's biggest surveillance camera chip maker, supplying the world's largest surveillance camera maker, Hikvision, which is also blacklisted by Washington. HiSilicon-designed Kirin mobile processors helped Huawei's smartphones compete successfully against Apple and Samsung Electronics.
The embattled Chinese tech giant has not given up the semiconductor capability it built over the past several decades. Huawei has invested in more than 30 Chinese chip-related companies in less than two years, and in the first six months of this year
Please, Log in or Register to view URLs content!
in 10 domestic semiconductor-related companies.
It has also
Please, Log in or Register to view URLs content!
, especially in Europe, for staff to work in semiconductors, artificial intelligence, software and autonomous driving technologies.
 

WTAN

Junior Member
Registered Member
I had some initial reservations about the claims that Wen Xiaojun made in the above article or the original interview, about 28nm and 14 nm domestic production lines this year and in 2022, respectively, simply because it's not clear what his background is and the research institute he is from hasn't been heard much before.

But the report bellow from guancha.com is yet another evidence to support the above claims, more or less. The report is an interview with Dr. Bao Yungang, the deputy director of the Institute of Computing, Chinese Academy of Science. Dr. Bao is better known publicly and the Institute of Computing at Chinese Academy of Science is an authoritative institution.

The report and interview are in Chinese, so apology in place. Essentially Dr. Bao said in the interview that China is making rapid progress in 14nm and 28nm domestic production lines.

Please, Log in or Register to view URLs content!

Some key quotes:



The above is about domestic 14nm capability. Domestic mass production of 14nm was achieved in Q4 2019, and the yield had reached 90%-95% by March this year. In addition, the equipment, process, packaging and materials for 14nm have all been systemically under development and deployment. It is predicted by multiple insiders that all the production stages involved in 14nm production will be rapidly improved. It's very likely that volume production can be realized next year.



More substantial information on the related technology breakthroughs for 14nm production above. Google tranlsation:



The following is about 28nm, which Dr. Bao said is important for the "New Infrastructure" and industrial applications.



Essentially, China is in a position to have complete volume production capability at the 28nm node.

Finally, some comments on the progress in 7nm and 5nm nodes:



7nm trial production was started in April. If everything goes smoothly, batch production of 7nm can be achieved at year end or early next year. The 5nm R&D is much more challenging, due to its inherent challenges and the sanction from the US making it difficult to get high-end litho machine. Still, the 5nm process R&D has started, and the striving goal is to have complete production process flow before the end of the year, before moving further to trial production.

All in all, it appears that China is making progress across the broad from 28nm, 14nm, to 7nm/5nm nodes. The progress has been uneven, understandably, in terms of maturity of the process and the extent of domestic equipment and materials employed.
Good Article Weig2000.
There are now quite a number of articles out there already confirming the 14nm Production.
Looks like much of the Semi Equipment and Materials for 14nm have been in R&D and are now almost ready.
The interesting part about this article is that it confirms that trial production of 7nm ICs did indeed take place in April at SMIC. This confirms what Liang Mong Song mentioned last year.
Even more interesting is that if things go well, mass production of 7nm ICs will take place by the end of the year or early next year.
Note that this is happening despite the US embargo on materials and machinery for production of ICs under 14nm node.
This also probably confirms that production of 7nm ICs is possible using the equipment in the 14nm FAB at SMIC.
So looks like the US Embargo has failed to stop 7nm IC Production in China.
It is indeed all too late as the Boat has left the Port already.
 

WTAN

Junior Member
Registered Member
@WTAN Sir will this induced EU, SK and Japan to change course, its a writing on the wall for everyone to see, China will achieve self sufficiency within a year and maybe by 2025 on par, now is the time for collaboration while the window are still open.
Yes....by next year these countries will have to change their course.
Either break ranks with the US and supply China with Equipment or lose the China Market.
Also China will very likely export it excess capacity of 14nm and 28nm ICs worldwide causing greater competition for these countries.
Now that China has the SMEE 28NM DUVL, i would not be surprised that ASML and Nikon decide to Dump their DUVL in China at rockbottom prices in order to stop SMEEs progress. Nikon will do this in order to survive the Liquidation of its Lithography Division.
 

jfcarli

Junior Member
Registered Member


Please, Log in or Register to view URLs content!

Huawei unit signs chip supply chain deal with China partner​

Agreement between HiSilicon and Shenzhen toolmaker aimed at beating US pressure
https%253A%252F%252Fs3-ap-northeast-1.amazonaws.com%252Fpsh-ex-ftnikkei-3937bb4%252Fimages%252F3%252F1%252F8%252F4%252F35164813-4-eng-GB%252FCropped-1625585541-05-31T203135Z_294027053_RC160746B9F0_RTRMADP_3_HUAWEI-TECH-USA-CHINA.JPG

A Kunpeng 920 chipset designed by Huawei's Hisilicon subsidiary is on display at Huawei's headquarters in Shenzhen. © Reuters
CHENG TING-FANG and LAULY LI, Nikkei staff writersJuly 7, 2021 01:02 JSTUpdated on July 7, 2021 14:08 JST
TAIPEI -- Huawei's chip design arm has struck a deal aimed at building up its domestic supply chain, a local partner said on Tuesday, in a first public move against a U.S. clampdown aimed at cutting its access to vital technology.
Shenzhen JT Automation Equipment, a Chinese chip production tool maker, on Tuesday said in a stock exchange filing that it has signed a five-year legally binding memorandum of understanding with Huawei's HiSilicon Technologies unit, China's biggest chip developer.
"Huawei's HiSilicon is stepping up efforts to push to build a domestic chip packaging and testing supply chain," JT said in the filing on Tuesday.

"Both parties aim to expand collaboration on semiconductor packaging tool development in a bid to solve the 'neck-choking' problem and realize a self-sufficient and controllable industry," the filing said in an apparent reference to U.S. efforts to restrict supplies to Huawei.
JT's share price had jumped nearly 20% as of the end of morning trade on Wednesday.
Founded in 2004 in Shenzhen, JT describes itself as an equipment maker essential for the production of consumer electronics, automotive electronics, space and aviation, and defense technology. It counts China's largest home appliance maker Gree, rival brand Haier and electronics assembler Flex among its main clients.
Huawei declined to comment on this story.
The U.S. Commerce Department since May 2019 has repeatedly ratcheted up export controls against Huawei, citing national security concerns. It aims to cut access to American technologies for Huawei and its subsidiaries.
As part of the curbs, the U.S. has blocked many of HiSilicon's suppliers including Taiwan Semiconductor Manufacturing Co. and ASE Technology Holding -- respectively the world's biggest contract chipmaker and biggest chip packaging and testing service provider -- from working with the Chinese company because their processes involve U.S. technologies.
The U.S. move hit Huawei's core chip development and its flagship smartphone business, where its market share plunged to only 4% in the first quarter of 2021 from 18% a year ago, when it was still the world's second-largest phone maker.
Chip production tools and chip design software, also known as electronic design automation, are
Please, Log in or Register to view URLs content!
, including Applied Materials, Lam Research, KLA, Synopsys and Cadence Design Systems.
Huawei's HiSilicon is China's biggest developer of chips used in a range of settings including smartphones, notebooks, servers, vehicles and TVs. The unit was also the world's biggest surveillance camera chip maker, supplying the world's largest surveillance camera maker, Hikvision, which is also blacklisted by Washington. HiSilicon-designed Kirin mobile processors helped Huawei's smartphones compete successfully against Apple and Samsung Electronics.
The embattled Chinese tech giant has not given up the semiconductor capability it built over the past several decades. Huawei has invested in more than 30 Chinese chip-related companies in less than two years, and in the first six months of this year
Please, Log in or Register to view URLs content!
in 10 domestic semiconductor-related companies.
It has also
Please, Log in or Register to view URLs content!
, especially in Europe, for staff to work in semiconductors, artificial intelligence, software and autonomous driving technologies.
 

weig2000

Captain
Good Article Weig2000.
There are now quite a number of articles out there already confirming the 14nm Production.
Looks like much of the Semi Equipment and Materials for 14nm have been in R&D and are now almost ready.
The interesting part about this article is that it confirms that trial production of 7nm ICs did indeed take place in April at SMIC. This confirms what Liang Mong Song mentioned last year.
Even more interesting is that if things go well, mass production of 7nm ICs will take place by the end of the year or early next year.
Note that this is happening despite the US embargo on materials and machinery for production of ICs under 14nm node.
This also probably confirms that production of 7nm ICs is possible using the equipment in the 14nm FAB at SMIC.
So looks like the US Embargo has failed to stop 7nm IC Production in China.
It is indeed all too late as the Boat has left the Port already.

The only caveat is that this 7nm process is being done on SMIC's current most advanced fab (the Southern fab?), which is mostly built with non-indigenous equipment. But I guess that's OK. I have made the argument before that there should be two fronts to advance: one is pushing the cutting-edge process nodes with best equipment and materials available; the other is aiming to build de-Americanized fab with as much indigenous equipment and materials as possible, likely at less advanced nodes.
 

latenlazy

Brigadier
Good Article Weig2000.
There are now quite a number of articles out there already confirming the 14nm Production.
Looks like much of the Semi Equipment and Materials for 14nm have been in R&D and are now almost ready.
The interesting part about this article is that it confirms that trial production of 7nm ICs did indeed take place in April at SMIC. This confirms what Liang Mong Song mentioned last year.
Even more interesting is that if things go well, mass production of 7nm ICs will take place by the end of the year or early next year.
Note that this is happening despite the US embargo on materials and machinery for production of ICs under 14nm node.
This also probably confirms that production of 7nm ICs is possible using the equipment in the 14nm FAB at SMIC.
So looks like the US Embargo has failed to stop 7nm IC Production in China.
It is indeed all too late as the Boat has left the Port already.
The sanctions may have in fact made 7nm at lower production efficiencies a viable business for SMIC, which means that they can go to market sooner. May also be informing their 5nm timeline.
 

WTAN

Junior Member
Registered Member
The only caveat is that this 7nm process is being done on SMIC's current most advanced fab (the Southern fab?), which is mostly built with non-indigenous equipment. But I guess that's OK. I have made the argument before that there should be two fronts to advance: one is pushing the cutting-edge process nodes with best equipment and materials available; the other is aiming to build de-Americanized fab with as much indigenous equipment and materials as possible, likely at less advanced nodes.
Yes, this latest 14nm FAB of SMIC mainly uses foreign equipment. The Americans overlooked the fact that the equipment and materials supplied to SMIC to produce 14nm Chips can also be used to produce 7nm Chips with minimal changes.

Fortunately with the Indigenous 14nm Production Line being rapidly developed and tested, locally made 7nm Chips built with a Indigenous Production Line may just be around the corner.
 
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