Chinese semiconductor industry

Recently, the chiplet interconnection protocol standard "Chiplets Interconnect Protocol (CIP)" was approved to become a group standard of the China Institute of Electronics. The standard number is T/CIE 192-2023 and will be implemented on January 1, 2024. .
The standard was developed by the 58th Research Institute of China Electronics Technology Group Corporation in collaboration with the University of Electronic Science and Technology of China, China Electronics Technology Group Corporation Intelligent Technology Research Institute, Zhejiang University, Jiangsu Weirui Supercomputing Technology Co., Ltd. and other units.

Recently, Ningbo Xinfeng Precision Technology Co., Ltd. successfully developed the first domestic 12-inch fully automatic ultra-precision wafer ring cutting equipment for three-dimensional integration. This major breakthrough not only filled a gap in the domestic market, but also broke the international monopoly. and technical barriers, opening a new chapter in China's semiconductor equipment manufacturing.

The field of artificial intelligence (AI) has developed rapidly in recent years, which has had a profound impact on all aspects of industry and social life and created huge market demand. At the same time, it has put forward more stringent requirements for the performance, power consumption and cost of AI chips. Three-dimensional integration (3D IC) technology is one of the core technologies to meet the needs of AI. It represents the development hotspot and important direction of semiconductor manufacturing and can effectively improve performance, reduce power consumption and manufacturing costs.

Various chips involved in three-dimensional integration must use ring cutting equipment during the stacking process, which poses new challenges to the processing technology and manufacturing equipment. It is necessary to achieve ultra-precision ring cutting processing of wafers at the micron level to remove the wafer. Round edge part material, thereby improving chip yield, reliability and stability.

Recently, Jiangsu Zhuoyuan Semiconductor Co., Ltd. (hereinafter referred to as "Zhuoyuan Semiconductor") received financial investment from Shenzhen Investment Capital.

It is understood that Zhuoyuan Semiconductor has been focusing on the R&D, production and manufacturing of wide-bandgap semiconductor crystal equipment and materials since its establishment. Its main business includes wide-bandgap semiconductor crystal growth equipment, diamond and silicon carbide (SiC) crystal processes and solutions solutions and related applications in smart grids, new energy vehicles and other fields.

At the end of May this year, Zhuoyuan Semiconductor's diamond substrate production line project settled in the second phase. The second phase of the factory covers an area of about 15 acres. It is planned to have a R&D testing center, pilot workshop and production workshop, and is equipped with professional testing and experimental equipment. The main products It includes MPCVD diamond equipment and diamond substrates, SiC crystal growth equipment and SiC substrate wafers, etc.

Through a vertically integrated manufacturing model, the project accelerates the joint iteration of design and manufacturing, and develops in conjunction with the upstream and downstream industrial chains to promote the development of advanced technologies and processes and form core technologies for semiconductor equipment and materials with independent intellectual property rights.

According to TrendForce Compound Semiconductor, on December 4, Zhuoyuan Semiconductor received a financial investment of 24 million yuan from Kaide Yuehao.​