Chinese semiconductor industry

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measuredingabens

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Neither i m professional expert..

SMIC 7nm has 115 MTr/mm2 .. which is better than intel 7nm process.

so how can you say this, SMIC will catch up with Intel by 2028. more or less SMIC is now equivalent to intel..

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as of now, only TSMC and SS is ahead. but by end of this decade, SMIC will be equivalent with TSMC..
I'm pretty sure the N5 figure is only theoretical density. Actual teardowns of the A15 chip put the transistor density at ~138 MTr/mm2.
 

gelgoog

Lieutenant General
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don't overthink it. They are not short on NXT2050i and such. They just need this thing to be qualified for 14nm in a year or so. Then domestic fabs can use it for 40/28/22/14nm process. This is an iterative process where they will continue to improve it. So eventually, I'm sure it can be used in 7nm process.

But given where we think EUV project is, I'm more interested in seeing this reliably operating in HVM and generating comparable yield to a process using ASML scanners. And that will take time. Otherwise, you basically loose money when you use this scanner
If the SMEE 28nm lithography machine is competitive, then SMIC will be able to use it and move NXT2050i machines they have which they bought for the 28nm fabs into the >= 14nm FinFET production facilities.
 

tokenanalyst

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Guolin Technology: Mass production of semiconductor-grade ozone equipment is about to accelerate domestic substitution​

As the leader in large-scale ozone system equipment in China, masters a full set of core technologies for ozone system equipment, and its products cover a full range of ozone generators and their system equipment.
As the leader in large-scale ozone system equipment in China, Guolin Technology (300786.SZ) masters a full set of core technologies for ozone system equipment. Its products cover a full range of ozone generators and their system equipment, which are widely used in municipal water supply, industrial wastewater, flue gas denitrification, Municipal sewage, space disinfection, etc.
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According to the annual report, Guolin Technology has actively carried out downstream diversification and extension around ozone technology in recent years and is committed to building a comprehensive solution provider in the ozone field. In the field of medical and health care, the subsidiary Guolin Health has successfully developed an electrolytic water ozone generator, and the marketing of some health products is progressing smoothly; in the field of semiconductors, the company's series of products have been successfully verified by many downstream head customers; at the same time, acetaldehyde The acid business is about to enter the formal production stage, and market expansion is also proceeding smoothly. In the future, more downstream blooms are expected to open up room for growth.
In the field of semiconductors, Guolin Technology has continued research and development for nearly five years and has successfully produced two products, high-concentration ozone water generators and high-concentration ozone gas generators, which are used in semiconductor cleaning and thin film deposition respectively. Public information shows that my country's semiconductor ozone equipment market is currently mainly occupied by overseas manufacturers such as MKS of the United States and Anselrose of Germany, and there are no mass-produced companies in the country. According to public disclosures, the ozone water concentration of the semiconductor ozone water generator produced by Guolin Technology can reach 80-150PPm, and the ozone gas generator outlet gas concentration can reach 200-300mg/L, which can meet the needs of semiconductor processes and has obtained corresponding patents. Product performance has basically matched that of overseas manufacturers.

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tokenanalyst

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FAW Greater Bay Area R&D Institute unveiled, focusing on SiC power semiconductors and other directions.​


It is reported that the China FAW Greater Bay Area R&D Institute unveiled this time will focus on five major directions: forward-looking technologies in the fields of new energy and smart vehicles, advanced materials, power electronics, and chip and vehicle-road collaborative demonstration, and will fully promote all-solid-state lidar, planar gate silicon carbide Projects such as domestic substitution of ( SiC ) power semiconductors and advanced ceramic materials.

Currently, SiC power devices are accelerating their introduction into vehicles and are widely used in power control units (PCUs), motor drive system inverters (Inverters), DC-DC converters, on-board charging systems (OBC) and non-vehicle charging systems of new energy vehicles. Charging piles, etc.

FAW is also increasing its efforts in the research and development and use of SiC power devices. At the end of August this year, FAW Hongqi issued a document stating that the trial production of the 750V HPD domestic frame-encapsulated SiC power module A sample jointly developed by the company and domestic SiC chip companies has been completed and will be used in Hongqi's first electric drive. It has been installed in the Hongqi E009 model. The inverter A prototype was tested.

It is also understood that Hongqi has also completed the national production of 1200V plastic-packed 2in1 SiC power module sample A, and jointly developed FAW's first 750V and 1200V SiC power chips with the 55th Institute of China Electronics Technology.

While vigorously promoting the research and development of SiC power devices, Hongqi has launched models using SiC power modules. In April this year, FAW Hongqi's new electric medium and large SUV Hongqi E202 was unveiled at the 2023 Shanghai Auto Show. The Hongqi E202 is based on the "Flag" super architecture of the 800V SiC fast charging platform. It only takes 5 minutes to charge and can have a range of 300km.

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tokenanalyst

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Eisen : Advanced packaging, a core supplier of photolithography + electroplating wet chemicals, contributes new momentum​

Core supplier of advanced packaging lithography + electroplating wet chemicals. The company has two major industrial sectors: electroplating solution and supporting reagents and photoresist and supporting reagents, which are widely used in integrated circuits, new electronic components, display panels and other industries. The company's domestic market share in the packaging and electroplating field exceeds 20%, and its share in Changdian Technology reaches 50%.

Electroplating solutions and ancillary products: RDL and copper pillars in advanced packaging will continue to drive market growth. As the bumping diameter decreases, the requirements for electroplating chemicals continue to increase. The company's electroplating products are mainly used in the bumping process in advanced packaging. The company's electroplating copper base liquid has achieved mass production and entered the supply chain of Huatian Technology; the electroplating tin-silver additive has been verified by Changdian Technology. The company's market share in the domestic packaging electroplating field exceeds 20%. Since 2019, it has become the exclusive supplier of electroplating solutions for AAC Technologies, with a supply share of 50% in Changdian Technology.

Photoresist and supporting reagents: Breaking the monopoly of semiconductor materials by the United States and Japan, the company is actively laying out advanced packaging tracks. The company's latest self-developed g/i line negative photoresist has gradually been supplied in batches, and the mass production scale of newly developed etching solutions has increased. Advanced packaging technology accelerates iteration, and the increase in the number of RDL process layers further increases the demand for photoresist. Among the company's 12,000 tons of semiconductor special materials projects, 5,100 tons of production capacity are planned to be photoresist and supporting reagents, and the company will expand production to meet industry opportunities.

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tokenanalyst

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Interesting paper show how Chinese universities upgraded themselves a 80s Ion Implantation tool for modern semi manufacturing. Pretty relevant given the context of the new situation.

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speculating here but is probably that given the current situation Chinese repair and part companies will have to know as good as the people who designed these tools and very probably they will have to do upgrades themselves.
 

paiemon

Junior Member
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The current US sanctions still do not prevent 1980Di from being exported to China for most of the fabs, so they should take advantage of that and stock up as many of these machines as possible.
I see a loophole with those restrictions; since the DUVi systems are transferable, nothing is stopping a non-blocked fab or dummy startup based in China buying up a bunch and transhipping them to the blocked entities after receiving into storage or if they wish, go through the motions of installation. Just adds another layer of paperwork. And while the US could insist on end user verification that aint happening in the current climate lol. Plus you can always just uninstall and ship it off after the inspectors leave if it came to that.
 

tonyget

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Interesting. Never heard of this 5G front-end module manufacture XinpleTek(芯朴科技)

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Deep Dive Teardown of the Fibocom FG650-CN Wireless Module​

The FibocomFG650-CN is an IoT module that supports 5G connectivity in two network architectures: 5G independent networking (SA) and 5G non-standalone networking (NSA). It also supports LTE and WCDMA communications. This module is specially designed for China. The module has the same size (44.1 x 41.2 x 2.71 mm) and PIN positioning as Fibocom’s Qualcomm platform 5G products (FG150 series). The FibocomFG650-CN is equipped with Unisoc’s UDX710 5G Baseband Processor that cost $28.5. Unisoc is the most cost driver manufacturer because it provides Baseband Processor, RF Transceivers, and Power Management chip. The FibocomFG650-CN module has an operating voltage range of 3.2V to 4.6V, with a typical value of 3.8V, an operating temperature range of -30 to +75°C, and an extended temperature range of -40 to +85°C. This module has appropriate FIBOCOM AT commands. The module has five antenna pins, but one pin is not used in this module. The rest belongs to two main antennas and two diversity antennas. TechInsights discovered two ICs were used for the first time, the Dosilicon (FMND2G08S3D-IF) SLC NAND Flash Memory -256 MB and the XinpleTek (XP5254-11) 5G n41 Front-End Module.
 
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