It's a shareholder of SMEE and its stock went up after announcement. Later it modified and deleted the mentioning of 28nm or any specifics only says advanced litho equipment has developed by SMEE.
it's a shareholder so it should have insights.
Chinese semiconductor industry
- Thread starter Hendrik_2000
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it's a shareholder so it should have insights.
The key questions are obviously:
1. Did they delete it because they have a 28nm lithography machine and don't want to make a public announcement now, or because they don't have it and the announcement was a mistake?
2. If they do have it, can it be produced in mass quantities and used in mass production lines to make chips for private enterprises?
3. Regardless of 28nm, can any of their front end lithography machines be used in mass quantities on mass production lines? Even if their 90nm lithography machine was put into mass use, this would be news, unless I missed something.
4. Are their lithography machines sanction-proof, and if not, how far away are they from that?
1. Did they delete it because they have a 28nm lithography machine and don't want to make a public announcement now, or because they don't have it and the announcement was a mistake?
2. If they do have it, can it be produced in mass quantities and used in mass production lines to make chips for private enterprises?
3. Regardless of 28nm, can any of their front end lithography machines be used in mass quantities on mass production lines? Even if their 90nm lithography machine was put into mass use, this would be news, unless I missed something.
4. Are their lithography machines sanction-proof, and if not, how far away are they from that?
bro you seriously don't know anything ..
1. entire Chinese semiconductor community knows, SMEE successfully developed 28nm DUVi ..
2. SSA800i currently verifying.. close to HVM
3. all core components of SSA800i are domestically produced. confirmed by havok himself..
There is not such thing as a 28nm lithography machine, the best resolution with immersion I think is about 38nm. What information I have is that the plan is to have something closer to ASML NXT2000 immersion machine [good overlay and all that neat stuff] but I think the trial by fire for this new immersion machine will be in a 28nm process node, if can pass that then they will move on to more advance nodes.
28nm rated means it can only handle 28nm for minimum configuration. Shouldn't use that for lower node manufacturering.
Let's not make this overly complicated. They used 28nm in their original language so people know this is immersion scanner.
so there is no question they are testing this out now (at least at SMIC & ICRD). ICRD uses it in 55nm process. I would imagine SMIC can try it either at 40 or 28nm. Whatever they try, doesn't really matter, since SMIC needs to add capacity in both
They have enough Arfi scanner stocked up for a while. It's not an issue. They can take their time to work with SMEE to get it ready for HVM. I don't think it really matters if SSA800 is ready today or a year from now. It will be ready in the next year in all likelihood.
The current US sanctions still do not prevent 1980Di from being exported to China for most of the fabs, so they should take advantage of that and stock up as many of these machines as possible.
SMIC is most likely blocked, so they are incentivized to get SSA800 working in their process.
But keep in mind that SMIC has stocked up many scanners and imported many in the past few months. They are not short on ASML scanners!
At this point, I'm not too excited about SSA800. I assume it will be ready for HVM at some point. If ASML is not allowed to sell to certain fabs in China, then SMEE will have the entire market to themselves.
The ones that we really are waiting on are:
1) de-americanized 14 and then 7nm process
2) EUV
3) DDR5 + HBM
I watched a video from them looks like they making a lot of components, including what looks like advanced positioning sensors, probably for some of their lithography machines [Yes, I said it, lithography machines] after being on the export control list for a while.
All will depend on the overlay of the machine, for I have been seeing they are trying to match ASML 2nd and 3rd most advanced scanners, if they manage to match those, welp.
What about high volume photoresists for 14 nm and beyond and metrology eequipments?
I would say:
De-Americanized 14 nm logic -> Early 2025
EUV prototype -> Somewhere in 2026
DDR5 -> In 6 months. Early 2025 with a de-Americanized line
HBM -> Dependent on if they were working on it. Should follow the DDR5 shortly if they were.
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