Chinese semiconductor industry

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tphuang

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more on diamond RF chip front
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looks like CETC's 46th institute recently showcased their own testing of Gan on Diamond technology but also using SiC in process. Clearly here, GaN-on-Diamond/Sic show better power amplifying than GaN-on-Sic (which itself is superior to GaN-on-Si. This is likely just the beginning. Tech and production technology should continue to improve
 

taxiya

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Looks like CXMT is really scared of US sanction,and very cautious to not to violate any US sanction. They have to clarify to the media that their research on GAA does not violate US sanction.

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Let me play your preferred behaviour in a simpler way. I hereby accuse you of stealing my Mercedes, in order to act not scared of me, you would remain silent. Are you ashamed of defending your own reputation? Or remaining silent means that you acknowledge my accusation?

It is not about sanction, it is about truth.
 

tokenanalyst

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Moore Thread's first kilo-card intelligent computing center is launched to comprehensively accelerate the development of large models from computing power to ecology​

The unveiling ceremony of Moore Thread’s KUAE Intelligent Computing Center, the first nationally produced 1,000-kilo-watt model training platform, was successfully held in Beijing. Announced the official launch of China’s first large-scale computing cluster based on domestically produced full-featured GPUs. At the same time, Moore Thread and many domestic partners initiated and established the Moore Thread PES-KUAE Intelligent Computing Alliance and the Moore Thread PES-Large Model Ecological Alliance to jointly consolidate domestic large models from intelligent computing infrastructure to large model training and inference. The integrated ecology continues to accelerate the development of my country's large model industry.
651396206103.2184.png

Moore Thread CEO Zhang Jianzhong brought major announcements in the keynote speech, including the large-model intelligent computing accelerator MTT S4000, and the Moore Thread KUAE platform, which is designed to provide powerful support for training and inference of large models with hundreds of billions of parameters. He said: "Moore Thread The official opening of the KUAE Intelligent Computing Center is an important milestone in the company's development. Moore Thread has built an intelligent computing product line from chips to graphics cards to clusters, relying on the multiple computing advantages of full-featured GPUs to meet the growing needs of large model training and Reasoning needs, with green and safe intelligent computing power, vigorously promote the implementation of multi-modal applications such as AIGC, digital twins, physical simulation, metaverse and the high-quality development of thousands of industries."
Intelligent computing accelerator card MTT S4000Both training and promotion Specially designed for large models
The Moore thread large model intelligent computing accelerator card MTT S4000 uses the third-generation MUSA core. A single card supports 48GB of video memory and 768GB/s of video memory bandwidth. Based on Moore Thread's self-developed MTLink1.0 technology, MTT S4000 can support multi-card interconnection and help accelerate distributed computing of hundreds of billions of large models. At the same time, MTT S4000 provides advanced graphics rendering capabilities, video encoding and decoding capabilities, and ultra-high-definition 8K HDR display capabilities to help implement comprehensive application scenarios such as AI computing, graphics rendering, and multimedia. What is particularly important is that with the help of Moore Thread's self-developed MUSIFY development tool, the MTT S4000 computing card can make full use of the existing CUDA software ecosystem and realize zero-cost migration of CUDA code to the MUSA platform.
1090647424610.5178.png

KUAE Intelligent Computing Center solution integrates software and hardwareReady to use out of the box
The Moore Thread KUAE Intelligent Computing Center solution is based on a full-featured GPU and is a full-stack solution integrating software and hardware, including infrastructure with the KUAE computing cluster as the core, the KUAE Platform cluster management platform and the KUAE ModelStudio model service. Solve the construction and operation management problems of large-scale GPU computing power in an integrated delivery manner. This solution can be used out of the box, greatly reducing the time cost of traditional computing power construction, application development and operation and maintenance platform construction, and achieving rapid launch on the market for commercial operations.

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tokenanalyst

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Helin micro-nano test probe R&D mass production investment project adds implementation entities and implementation locations​


Helin Weina issued an announcement stating that the company held the eighth extraordinary meeting of the second board of directors and the sixth extraordinary meeting of the second board of supervisors on December 18, 2023, and reviewed and approved "Proposal on Increasing the Implementation Subjects and Implementation Locations of Investment Projects with Raised Funds", agreeing to add UIGREEN Co., Ltd., the company's overseas wholly-owned subsidiary, as the implementation subject of the "MEMS process wafer test probe R&D and mass production project" with raised funds investment project and corresponding Add implementation locations.

Before the change of the fundraising project, the implementation entity was: Helin Weina, and the implementation location was: Suzhou; after the change of the fundraising project, the implementation entity was: Helin Weina and UIGREEN Co., Ltd., and the implementation location was: Suzhou, Japan.
According to the data, the business scope of UIGREEN Co., Ltd. is: the design, production and sales of precision molds and metal parts, stamping parts, and micro connectors; the design, production and sales of automotive, medical, and communication electronic plastic parts; micro electronics and acoustics Design, production and sales of products; design, production and sales of micro semiconductor test supplies; design, production and sales of automation equipment; import, export and sales of goods and parts; import and export trade.

He Linweina said that the addition of UIGREEN Co., Ltd. as the implementation entity of the fundraising project "MEMS process wafer test probe R&D mass production project" and the corresponding increase in implementation locations will help the company further improve the efficiency of the use of raised funds and promote The implementation of the raised investment project will not change the investment direction of the raised funds in any disguised manner or harm the interests of shareholders, and will not have an adverse impact on the company.

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tphuang

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Moore Thread's first kilo-card intelligent computing center is launched to comprehensively accelerate the development of large models from computing power to ecology​

The unveiling ceremony of Moore Thread’s KUAE Intelligent Computing Center, the first nationally produced 1,000-kilo-watt model training platform, was successfully held in Beijing. Announced the official launch of China’s first large-scale computing cluster based on domestically produced full-featured GPUs. At the same time, Moore Thread and many domestic partners initiated and established the Moore Thread PES-KUAE Intelligent Computing Alliance and the Moore Thread PES-Large Model Ecological Alliance to jointly consolidate domestic large models from intelligent computing infrastructure to large model training and inference. The integrated ecology continues to accelerate the development of my country's large model industry.
651396206103.2184.png

Moore Thread CEO Zhang Jianzhong brought major announcements in the keynote speech, including the large-model intelligent computing accelerator MTT S4000, and the Moore Thread KUAE platform, which is designed to provide powerful support for training and inference of large models with hundreds of billions of parameters. He said: "Moore Thread The official opening of the KUAE Intelligent Computing Center is an important milestone in the company's development. Moore Thread has built an intelligent computing product line from chips to graphics cards to clusters, relying on the multiple computing advantages of full-featured GPUs to meet the growing needs of large model training and Reasoning needs, with green and safe intelligent computing power, vigorously promote the implementation of multi-modal applications such as AIGC, digital twins, physical simulation, metaverse and the high-quality development of thousands of industries."
Intelligent computing accelerator card MTT S4000Both training and promotion Specially designed for large models
The Moore thread large model intelligent computing accelerator card MTT S4000 uses the third-generation MUSA core. A single card supports 48GB of video memory and 768GB/s of video memory bandwidth. Based on Moore Thread's self-developed MTLink1.0 technology, MTT S4000 can support multi-card interconnection and help accelerate distributed computing of hundreds of billions of large models. At the same time, MTT S4000 provides advanced graphics rendering capabilities, video encoding and decoding capabilities, and ultra-high-definition 8K HDR display capabilities to help implement comprehensive application scenarios such as AI computing, graphics rendering, and multimedia. What is particularly important is that with the help of Moore Thread's self-developed MUSIFY development tool, the MTT S4000 computing card can make full use of the existing CUDA software ecosystem and realize zero-cost migration of CUDA code to the MUSA platform.
1090647424610.5178.png

KUAE Intelligent Computing Center solution integrates software and hardwareReady to use out of the box
The Moore Thread KUAE Intelligent Computing Center solution is based on a full-featured GPU and is a full-stack solution integrating software and hardware, including infrastructure with the KUAE computing cluster as the core, the KUAE Platform cluster management platform and the KUAE ModelStudio model service. Solve the construction and operation management problems of large-scale GPU computing power in an integrated delivery manner. This solution can be used out of the box, greatly reducing the time cost of traditional computing power construction, application development and operation and maintenance platform construction, and achieving rapid launch on the market for commercial operations.

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the 768 GB/s interconnect is interesting, since that is too fast per US sanctions. Indicating that this is possibly fabbed at SMIC
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also quite a long list of participants in ecosystem

this news also made sense the earlier news of MT signing with Ningxia for its first thousand-cards domestic cluster
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since until now, MT didn't really have a card used for AI training that can talk to each other with high speed interconnect

edit: never mind chip-to-chip interconnect looks to be 240GB/s
768GB/s is the memory bandwidth, not sure what that's referring to exactly. Maybe bandwidth out of the 8-card box
 
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tphuang

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couple of months ago, MT also participated in China Mobile's global ecosystem partner conference
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showcasing its' S3000 product for cloud desktop and such. So all their GPUs before this were not really usable for AI training
 

tokenanalyst

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Improve MicroLED performance! Shanghai University develops new chip bonding technology​


According to news on December 18, a Shanghai University research team recently demonstrated a technology to improve the integration and performance of next-generation Micro LED microdisplay devices. It is reported that shrinking LEDs to micro sizes will have manufacturing and reliability impacts. Key difficulties include integrating the Micro LED pixel array with the silicon control circuitry that operates the display.

This integration technology is achieved throughflip chipbonding process, which physically and electronically combines the Micro LED chip Connect to bonding pads on the silicon backplane. However, when the pixel size shrinks below 50 microns, this adhesive interface can easily fail due to small defects and mechanical stress.

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In response to the above problems, the Shanghai University research team enhanced the flip-chip bonding process by using layered gold-indium-gold (Au/In/Au) metal interlayers instead of traditional pure indium bumps. The team used flip-chip bonding technology to connect the Micro LED to silicon at a mild temperature of 200°C, avoiding damage caused by heating and cooling mismatches while forming a highly conductive bond.

Research results show that compared with pure indium, gold-indium-gold (Au/In/Au), a multi-layer metal sandwich flip-chip bonding process, reduces resistance by 40% while also eliminating cracks and cracks on the bonding surface. gap. Testing the shear strength showed that the mechanical strength of the Au/In/Au bond was more than three times greater.

The research team integrated these hierarchical connections into a 15-by-30-pixel Micro LED demonstration array with a 20-by-35-micron-sized light source. As a result, the panels exhibit premium display performance, including low operating voltage and record high brightness, reaching 1.78 million candelas per square meter.

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tokenanalyst

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@measuredingabens
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I think China is getting good at laser writing system but I think they still need do A LOT of more work on E-Beam lithography. I think RSLaser and others are developing their new generation of solid state 248nm and 193nm DUV lasers, so is possible to create maskless systems with high writing speed and enough resolution for advance mask production.​
 

latenlazy

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It looks like EEM was developed in Japan and is mainly used by Japanese companies. Speaking of Nikon EUV, does anybody know what issues did Nikon encounter that prevented them from commercializing their EUV? They did build several working EUV prototypes.

They thought the market opportunity was not going to be profitable since the customer base shrank and ASML was already locking in the main fabs who signaled commitment to an EUV process.
 
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