Chinese semiconductor industry

Today (December 7), dozens of high-flow gas purification equipment customized by Xianpu Gas for the 12-inch line chip factory project were officially delivered! This delivery marks the further consolidation and development of Semiconductor Gas in the field of advanced semiconductors, especially its impressive achievements in 12-inch line chip manufacturing.




Shanghai Xianpu is a nationally recognized foreign-funded high-tech enterprise and a Shanghai specialized and special new enterprise. The company introduces internationally advanced purification technology and design and production concepts, develops and produces various types of terminal gas purifiers and gas purification equipment with a wide flow range. Products are widely used in electronics, optoelectronics, optical fiber, photovoltaics, chemical industry and other fields.
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Since its establishment in 2004, Xianpu has obtained sixty patent certificates through continuous research and innovation on the basis of fully mastering the core technologies of international advanced gas purification, and independently developed more than a dozen series and hundreds of products, with the purity of There are two grades of 9N and 7N, with the pressure ranging from normal pressure of 1.0MPa to high pressure of 24MPa, and the flow rate ranging from hundreds of milliliters per minute to tens of thousands of cubic meters per hour.
Xianpu's gas purification products can not only provide ultra-high-purity process gases for crystal growth, epitaxy, oxidation, diffusion, CVD, MOCVD, PECVD and many other semiconductor process equipment; they can also be used for ultra-high-purity gas and electron gas production, with low Concentration standard gas and mixed gas preparation; as well as oxygen used for purifying TIG orbital welding machines in ultra-high purity gas pipeline construction and nitrogen for acceptance purge; it can also be used in ultra-trace water, oxygen analyzers, and gas chromatographs (GC) , purified carrier gas or zero point gas for various gas analysis instruments such as atmospheric pressure ion mass spectrometer (APIMS),
Based on unremitting technological innovation, strict quality management and the cost advantage of domestic manufacturing, Xianpu provides customers with cost-effective gas purification solutions with practical products, professional services and reasonable prices.​

On the morning of December 12, the "2023 Integrated Circuit Industry Cluster (Zhejiang) Innovation and Development Conference" hosted by relevant departments of Zhejiang Province, Hangzhou Municipal Government, and China Semiconductor Industry Association was successfully held in Hangzhou. An important signing ceremony was held at this conference. The Binjiang District Government signed contracts with Hangzhou Guangli Microelectronics Co., Ltd., Hangzhou Xingxin Technology Co., Ltd. and Huaxincheng (Hangzhou) Technology Co., Ltd. to jointly build the Zhejiang Provincial Semiconductor Signoff Center. .​

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The Zhejiang Provincial Semiconductor Sign-off Center will fully serve the national integrated circuit industry chain development strategy, actively respond to the specific task deployment of the EDA industry development, and at the same time give full play to the resource aggregation advantages of the manufacturing EDA industry in Zhejiang Province, with sign-off data as the key starting point, and design Sign-off and manufacturing sign-off are the key links, with common technology development verification and industrialization promotion as the main mission, building a high-level sign-off platform that can serve the entire domestic industry, creating national industrial integrated manufacturing EDA solutions, and promoting the development of the industry The chain-to-chain effect and synergistic advantages promote the qualitative leap of high-end chips from "made well" to "made well", and realize the production and manufacturing of domestic high-performance chips with high yield and high stability, which is important for improving the overall integrated circuit industry in my country. The design and manufacturing level and the high-quality development of the integrated circuit industry in Zhejiang Province are of great significance.​

Core tip: Recently, Suzhou Xinrui Technology Co., Ltd. (hereinafter referred to as Xinrui Technology) announced the completion of Series B financing of over 100 million yuan. This financing was jointly provided by Linxin Capital, Huafang Capital, Fengyuan Capital, and Yunjin Capital.
Recently, Suzhou Xinrui Technology Co., Ltd. (hereinafter referred to as "Xinrui Technology") announced the completion of Series B financing of over 100 million yuan. This financing was jointly completed by Linxin Capital, Huafang Capital, Fengyuan Capital, Yunjin Capital, Shenzhen High-tech Investment, Zhuoyuan Capital and many other well-known investment institutions and industrial capitals.
Xinrui Technology was established in February 2021 and focuses on the research and development, production and sales of semiconductor wafer bonding equipment. The core technical team has more than 20 years of experience in semiconductor equipment development. After more than ten years of research and development, its product applications cover all fields of semiconductors, and its process capabilities cover 2-12 inches. It is an overall solution provider for temporary bonding and permanent bonding. Currently, nearly a hundred units of bonding equipment for compound semiconductors have been provided, and a 12-inch temporary bonding and debonding equipment for 2.5D/3D packaging will be launched in 2023.
In recent years, as front-end manufacturing approaches physical limits, the pursuit of advanced processes is no longer the only option. People have turned to other ways to increase the density of transistors in chips. 3D chips are the most mainstream and one of the most popular directions nowadays. one.
Zhou Wei, chairman of Xinrui Technology, said: "Currently, high-end wafer-level bonding equipment is almost monopolized by foreign manufacturers. The funds raised in this round will mainly be used to develop large-size, high-precision hybrid bonding equipment, striving to achieve localized substitution, and We hope to help the development of China’s semiconductor industry in the direction of 3D chips and wafer stacking.”​

Core tip: According to the announcement of the State Intellectual Property Office, Peking University applied for a project called a CMOS logic circuit based on GaN and carbon nanotubes and its preparation method, Publication No. CN117238958A, application date
According to an announcement from the State Intellectual Property Office, Peking University applied for a project called "A CMOS logic circuit based on GaN and carbon nanotubes and its preparation method", with the publication number CN117238958A, and the application date is June 2022.




The patent abstract shows that the invention discloses a CMOS logic circuit based on GaN and carbon nanotubes and a preparation method thereof. The CMOS logic circuit is composed of a GaN n-type transistor and a carbon nanotube p-type transistor prepared on the same chip. A buffer layer, an electronic conductive channel layer and a barrier layer are sequentially stacked on the substrate. The GaN n-type transistor is The source, drain and gate structures are located on the barrier layer, the gate is located on the gate structure, and the GaN n-type transistor is covered with a passivation layer; the carbon nanotube p-type transistor includes a carbon nanotube channel and drains at both ends. The gate dielectric layer and the gate electrode are in sequence on the carbon nanotube channel; the carbon nanotube p-type transistor is located on the passivation layer on the side or above the GaN n-type transistor. The CMOS logic circuit of the present invention has high saturation current density and high operating speed. It can be used as a peripheral circuit of GaN power devices to achieve monolithic integration, effectively solving the problem of inter-chip parasitic inductance caused by current Si circuits, thereby giving full play to GaN power devices. performance advantages.

UPOptotech ready for the mass production of semiconductor equipment, including litho, high end gratings.​

UPOptotech stated on the interactive platform on December 16 that the research and development cycle of ultra-precision rulers depends on the use demand and technology accumulation. Generally, the research and development cycle is longer. The grating ruler is the core component of semiconductor equipment, and its accuracy requirements depend on the technical specifications of the entire machine. The high-precision ruler can complete internal testing and verification within this year, and can be adapted to external applications starting next year.​