Chinese semiconductor industry

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tphuang

tphuang

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https://twitter.com/i/web/status/1735850331748085987

I demonstrated here just 1 example of how much different chips reside in 1 important component of an EV (which is electric power steering system)

And over time, I think the shift is already under way for China Inc to use domestic supply chain for these critical components.

Domestic suppliers will also use domestic chip production over time

All about de-risking

Building mature chip fabs alone do not mean anything. They need to find customers. Customers are available due to de-risking reasons.
 
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interestedseal

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interestedseal said:
Yes, SIOM seems to be pursuing this route of 2μm wavelength solid state laser produced with Thulium doped LiYF4 crystals. I read somewhere that 2μm laser might actually have higher CE(conversion efficiency) than the current 10μm CO2 laser. Here is the link to their website that describes their research on thulium LPPEUV.
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This paper from SIOM claims a theoretical CE of 6.9% with a 2μm laser, which is higher than the current 6% from NXE:3400B. I wonder if they’ve started experimentally validating this setup.
Recently we’ve seen a surge in EUV light source research. For example, here is another team working on desktop EUV light source. They seem to be focused on novel droplet generator designs.
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measuredingabens

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I suppose the question now is when they can deliver a prototype to SMIC. Correct me if I'm wrong, but the patents indicate the subsystems should be relatively complete at this point and what's left is assembling them (if it hasn't been done already) and running it through initial tests.
 
sunnymaxi

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another Patent from Huawei

Huawei's new patent has been approved to improve the efficiency and accuracy of wafer alignment

The patent is titled "Wafer Processing Equipment and Wafer Processing Method"

Image
 
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measuredingabens

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Some more 6G developments. The researchers here have proposed and demonstrated "a microwave universal metasurface antenna (UMA) capable of dynamically, simultaneously, independently, and precisely manipulating all the constitutive properties of EM waves in a software-defined manner." As for its significance, it's apparently the first such antenna able to simultaneously manipulate all the fundamental properties of EM waves. This was published back in August, so it looks like we may have missed it.
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tokenanalyst

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Trying to grab some Veeco share, batch processing thin film deposition. They also are selling some diamond semiconductor equipment.​

Yunmao Technology's new factory was officially put into operation, and independent innovation boosted high-quality development of localization replacement.​


During the event, Huang Xiaozhou, Member of the Standing Committee of the Xiamen Municipal Committee and Executive Vice Mayor, Hong Qingyan, Member of the Standing Committee of the Jimei District Committee and Deputy District Mayor, Wang Yunyu, founder of Yunmao Technology, and Zhao Zhao, founder of Yunmao Technology Maosheng, Sequoia China Partner Yang Zhaoguo, and Sunny Industrial Fund General Manager Xiao Chaojun jointly launched the launch ceremony of Yunmao Technology’s new factory, which means that the new factory is officially put into operation and also marks the official opening of the new factory. Yunmao Technology has taken an important step in expanding production capacity, improving product quality, and meeting market demand to meet the growing demand for high-quality thin film deposition equipment in the future.
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At this production launch ceremony, Yunmao Technology also released and displayed the company’s latest product results, including PBATCH batch plasma ALD, KG production powder ALD, SICE- High-end thin film deposition equipment such as Y6 silicon carbide epitaxial CVD system contributes its unique strength to accelerate the development process of domestically substituted semiconductors.

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snake070

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长春光电信息产业园三期项目预计明年6月建成​

长春光电信息产业园三期项目总占地面积6.7万平方米，计划总投资19.7亿元。该项目于2022年5月开工建设，计划于2024年6月完成全部建设。拟入驻长光集智、长光正圆、奥普光电、长光辰芯4家企业。

长春经开国控集团有限公司副总经理 吕卓越：它的主导产品是高端智能制造和集成电路，其不仅承载着国家重大科研项目，破解内循环和科技创新的问题，更为国家和民族解决芯片“卡脖子”问题
 
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