Chinese semiconductor industry

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tokenanalyst

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Zhongke Feichai: Plans to use 309 million yuan of super-raised funds to increase the investment scale of the "high-end semiconductor quality control equipment industrialization project"​

Zhongke Feichai announced that it would use 309 million yuan of excess funds raised from its initial public offering to increase the investment scale of the "High-end Semiconductor Quality Control Equipment Industrialization Project".

Zhongke Feichai said that the use of super-raised funds to increase the investment scale of the "high-end semiconductor quality control equipment industrialization project" is an adjustment made by the company after full evaluation based on the company's current operating conditions and future development plans, and is in line with the company's overall strategy The development direction will help enhance the company's comprehensive competitive strength and play a positive role in the company's future development strategy. details as follows:
(1) With the company's continuous product innovation and technological innovation, the company's product categories and series have become increasingly rich, and its output and sales scale have grown steadily. In order to meet the continued growing demand for the company's high-end semiconductor quality control equipment in domestic and foreign markets, the company plans to increase the investment and construction scale of the "High-end Semiconductor Quality Control Equipment Industrialization Project" and increase the investment scale in R&D and production supporting facilities to better To meet the company's growing production and research and development needs.
(2) Optimize the production conditions of high-end semiconductor quality control equipment. The original planned production workshop of the project has a maximum cleanliness level of 1,000. As the company's current and future products gradually develop towards more advanced processes, product performance and product technical indicators continue to improve, product production and research and development will further require production sites and supporting facilities. To improve, in order to meet production needs, the company will expand the construction area of this project while also increasing investment in the construction and decoration of the 100-level clean workshop.
(3) Enhance the company’s comprehensive product research and development capabilities. The original plan of this project was to build a production site only for high-end semiconductor production. As the company's business scale expanded, the company's R&D scale and number of R&D personnel also increased significantly. Based on the original plan, the company plans to increase the construction area of the R&D site and purchase R&D equipment to enhance the company's R&D strength and provide support for the company's product upgrades and iterations as well as the research and development of new products and new technologies.
(4) In order to meet the higher requirements for the research and development and production of advanced equipment, the company needs to correspondingly increase the anti-microseismic structure of the factory building and enhance the partial structure of the auxiliary factory building.
(5) Due to the expansion of the building scale, other project construction costs such as ventilation and air-conditioning projects, survey and design fees, project management company and investment supervision fees have increased.

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sunnymaxi

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LMAO, Are you phishing? 28nm DUVI has been completed by the end of 2022, 7nm duvi will be completed in 2023

在活动自由交流环节,有学生向朱煜提问其课题组研发的工件台和ASML公司差距。朱煜回应称:目前课题组研制的工件台在大的代际上与ASML公司最先进工件台(2000系列以上产品)处于同一水平。但在小的代际上与ASML的2000系列以上产品还存在一代的差距,再迭代一次后就可以追上国际先进水平

“工件台”means the dual-stage system


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come on man. exactly the same i m trying to tell .. lol

DUVi successfully developed. now machine is in full scale testing. close to HVM
 

snake070

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Relax! I am keenly aware of the EUV development projects, what matters is in 2023 December we don't have a viable EUV Lithography from China. In 2024, 2025, 2026? Sure but not as of right now!
You don't understand how China works.

Lithography is now a state secret in China, you can only get a little bit of information from other companies' financial reports and university papers.

As long as Chinese lithography is still using foreign parts now, Chinese officials won't reveal anything.
 

ansy1968

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You don't understand how China works.

Lithography is now a state secret in China, you can only get a little bit of information from other companies' financial reports and university papers.

As long as Chinese lithography is still using foreign parts now, Chinese officials won't reveal anything.
My take there will ne an official statement in 0CT next year coinciding with PROC 75th anniversary and a special gift for Brandon re election bid. And I'm confident that Huawei will unveil their Mate 70 pro using SMIC N+3 5nm chip and a domestic 7nm line . :)
 
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sunnymaxi

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My take there will ne an official statement in 0CT next year coinciding with PROC 75th anniversary and a special gift for Brandon. And I'm confident that Huawei will unveil their Mate 80 pro using SMIC N+3 5nm chip and a domestic 7nm line . :)
what about Mate70 ? which process M70 is going to use .. same N+2 ?
 

snake070

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My take there will ne an official statement in 0CT next year coinciding with PROC 75th anniversary and a special gift for Brandon. And I'm confident that Huawei will unveil their Mate 80 pro using SMIC N+3 5nm chip and a domestic 7nm line . :)
I don't know if the N5 node will be used in Huawei's phones next year, but it's true that it's already in small-scale mass production...
N+3 transistor density of around 140MTr/mm2
 
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