Nvidia Sees Huawei as Formidable AI Chipmaking Rival, CEO Says
is among a field of “very formidable” competitors to in the race to produce the best AI chips, according to the American company’s chief.
@tphuang ..
Chinese semiconductor industry
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is among a field of “very formidable” competitors to in the race to produce the best AI chips, according to the American company’s chief.
@tphuang ..
yep, saw that. Realistically though, Huawei does need to move to chiplets and advanced packaging with AI chips in order to increase yield and performance. I'm waiting for their next chip to be closer in performance to H100
Shiguangxinke: Solve the pain points of the lidar industry and promote the localization of high-performance SPAD chips
According to Jiweiwang news, there are very few companies in the world that have experience in mass production of area array SPAD chips, and Shiguang is one of them.
Shiguang focuses on highly integrated, full-chip, fully digital SPAD-SoC, targeting terminal applications such as autonomous driving, robots, and XR.
Through full-chip and fully digital system-on-chip integration, Shiguang integrates high-performance back-illuminated SPAD array, high-precision clock sampling matrix, single-photon ranging engine, high-concurrency dToF perception algorithm accelerator, lidar control unit and high-speed data interface, etc. Key modules are integrated into a single chip, realizing fully digital data collection and real-time on-chip processing of massive data, thereby greatly simplifying the system structure and helping lidar break through existing boundaries in terms of performance, appearance, reliability and cost. To ultimately realize the widespread application of three-dimensional perception.
Shiguang has successful experience in scarce capabilities such as devices, digital, area array, car specifications, and mass production. Core members have led the design of the world's first large area array SPAD chip for automotive lidar; the person in charge of each subsystem is He comes from the top Silicon Valley chip R&D team or international authoritative scientific research institutions, and has participated in the research and development of various large-scale chip projects.
Key technologies and innovation points:
1. Integrated sensing, computing and storage, highly integrated into chips
The light-recognizing SPAD-SoC integrates sensing (high-performance back-illuminated SPAD array, high-precision clock sampling matrix), computing (high-concurrency dToF sensing algorithm accelerator), and storage (single photon ranging engine) units into the same chip. so that the data transmission between modules is not limited by the bandwidth and delay between discrete chips.
2. Full digitalization
The fully digital architecture is recognized as the next generation lidar architecture. In the highly integrated SPAD-SoC solution for light recognition, photons enter the lidar and are converted into electrical signals, followed by subsequent data processing and point cloud presentation. , the entire process is digital, which solves the loss and distortion caused by the existing secondary conversion of digital to analog, resulting in a higher signal-to-noise ratio and higher accuracy.
3. 2D addressing
It supports 2D addressing scanning, with smaller partitions and lower crosstalk effects between different pixel channels in the same partition. It solves the industry's long-standing pain point of "high anti-pollution" and maintains high frame rates and long detection distances at the same time.
4. More than just imaging
Based on SPAD's infinite gain and single-photon detection capabilities, the light-recognizing SPAD-SoC has the characteristics of high-speed and low-light imaging; it can output 2D and 3D data at the same time, and can output a fixed resolution in real time without the need for a camera or post-processing of the data. depth image, signal image and environment image.
Shiguang SPAD-SoC has laid out intellectual property rights in multiple directions such as chip architecture, digital circuits, and SPAD devices. In terms of customer applications, it is mainly for autonomous driving applications, covering short, medium and long-range detection, and can be used for both forward long-range lidar and short-range blinding lidar to help realize ADAS, L4 and above autonomous driving; it is also targeted at robots , industrial automation and other applications.
A strong team provides unremitting motivation for Shiguang's continuous breakthroughs. Shiguang is also a pioneer in the VCSEL+SPAD lidar technology route. With its unique ability to define and optimize the SPAD-SoC chip architecture from the perspective of the lidar system, it has overcome the technical hurdles of highly integrated chips in the field of lidar and shortened development. Achieving optimal performance, efficiency and cost at the same time makes it possible to fully popularize lidar. The accumulation of SPAD technology routes gives Shiguang a leading advantage globally.
So far, Shiguang has completed angel round and Pre-A round financing of nearly 100 million yuan, and has won many honors..
Relying on the team's overall R&D capabilities, as well as its scarce technology and experience accumulation in SPAD devices, digital design, automotive mass production, and complete lidar machines, barriers to light recognition competition are constantly being established. At the same time, relying on Chiguang's strong engineering capabilities and rapid product iteration capabilities, Chiguang will bring more breakthrough SPAD-SoC chip products to the entire industry in the future.
Qingyi Optoelectronics raised 1.2 billion to invest in a high-precision mask production base
Qingyi Optoelectronics - On December 6, Qingyi Optoelectronics announced that the company plans to issue shares to specific targets to raise a total of no more than 1.2 billion yuan (including the original amount). The raised funds, after deducting relevant issuance expenses, will be used to invest in high-precision The first phase of the mask production base construction project and the first phase of the high-end semiconductor mask production base construction project..
Jiaxin Semiconductor Equipment Technology Co., Ltd a subsidiary of Wanye Enterprises launched their first "official" product in their new website.
Physical Vapor Deposition
They are set to launch a new series of semiconductor equipment and auxiliary equipment
Physical Vapor Deposition
They are set to launch a new series of semiconductor equipment and auxiliary equipment
At present, Jiaxin Semiconductor has subsidiaries Jiaxin Jianeng, Jiaxin Hongyang and new product research and development departments. It has formed multiple semiconductor front-end core equipment product lines, and its business covers etching, thin film deposition, rapid heat treatment and other categories. Main process equipment and supporting process equipment such as exhaust gas treatment provide complete sets of front-end equipment solutions for integrated circuit wafer manufacturing plants such as automotive chips, power chips, and logic chips. Since its establishment, Jiaxin Semiconductor has successfully acquired rapid thermal processing (RTP) equipment, silicon nitride, sidewall, and metal plasma etching machines, high-density plasma thin film deposition equipment (HDP-CVD), and boron-phosphorus-doped silicon dioxide thin film chemistry. Deposition equipment (SACVD), silicon dioxide plasma thin film deposition equipment (PECVD), titanium/titanium nitride deposition equipment (MOCVD), aluminum-copper metal sputtering equipment (Metal Sputter (Al/Ti/TiN)), dual combustion + dual Orders for various types of equipment such as water washing exhaust gas treatment equipment. Since the establishment of the company, the cumulative order amount has exceeded 470 million yuan, and the stable fulfillment of orders on hand has continued to release the endogenous growth momentum of performance.
Huahai Qingke: 12-inch ultra-precision wafer thinning machine Versatile-GP300 has received small batch orders
According to Jiwei.com news on December 6, Huaihai’s latest research report stated that the company’s 12-inch ultra-precision wafer thinning machine Versatile-GP300 is the first time in the industry to achieve the organic integration of 12-inch wafer ultra-precision grinding and CMP global planarization. Integrated equipment, small batch orders have been obtained, and multiple units have been sent to different clients for verification this year. As advanced packaging technologies such as 3D chip structures and chiplets continue to evolve, it is expected that thinning equipment will be more widely used. The company will continue to seize market opportunities and achieve breakthroughs in new fields.
Regarding the progress of the 14nm process verification of CMP equipment, Huahai Qingke pointed out that the company attaches great importance to the technology and performance upgrade of CMP products, and has launched new functions, new modules and new products that meet the requirements of more material processes and more advanced processes. At the same time, Further increase investment in R&D and continue to promote CMP equipment development and process breakthroughs for higher performance and more advanced nodes.
Regarding the construction of the Yizhuang project in Beijing, Huahai Qingke said that the company's wholly-owned subsidiary Huahai Qingke Beijing implemented the "Huahai Qingke Integrated Circuit High-end Equipment R&D and Industrialization Project" in the Beijing Economic and Technological Development Zone, which will be used by the company to carry out chemical mechanical polishing The construction period for the research and development and industrialization of high-end semiconductor equipment such as equipment, thinning equipment, and wet-process equipment is expected to be 26 months. As my country's integrated circuit development becomes a national key strategy and the global trade environment becomes increasingly complex, the demand for localization of semiconductor-specific equipment has become increasingly urgent and growing rapidly. The company needs to proactively expand production capacity to meet the rapidly growing market demand. This project It will further expand the company's production and operation scale and improve its technology research and development capabilities, thereby enhancing the company's core competitiveness.
Ningxia’s first domestic kilo-card smart computing cluster signed a contract, Moore Threads and China Energy Construction jointly assisted the high-quality development of the western computing industry
On December 7, under the guidance of the Development and Reform Commission of the Ningxia Hui Autonomous Region (referred to as the Autonomous Region Development and Reform Commission) and hosted by Yinchuan Energy College, the 2023 "Eastern Digital and Western Calculation" higher education and computing industry cooperation summit was successfully held. With the theme of "Digital Intelligence Minning, Industry and Education Fusion", the summit gathered more than 100 representatives from government departments in Ningxia and Fujian provinces, representatives from relevant universities, scientific research institutes, industry associations, and heads of domestic enterprises in the field of digital economy. At the meeting, under the witness of the Development and Reform Commission of the Autonomous Region, a grand signing ceremony was held for the "Ningxia Domestic Kilocard Intelligent Computing Cluster Construction Project" in cooperation with China Energy Construction Green Digital Technology (Zhongwei) Co., Ltd. (abbreviation: China Energy Construction Digital Technology) The ceremony marked the official opening of Ningxia's first large-scale cluster intelligent computing center based on domestically produced full-featured GPUs. At the same time, the "Ningxia Public Intelligent Computing Service Platform", the country's first domestic public intelligent computing service platform supported by Moore Thread full-featured GPU, also announced the official launch of construction.
Imma check if I can buy it on JD.
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