This is the new Huawei SoC that is aimed for Nova 12 and tablet
Main difference is the slower speed on the big core. W. Not idea on NPU or ISP, but GPU should be the same.
I think the goal with this SoC vs 9000S is just higher yield
Chinese semiconductor industry
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This is the new Huawei SoC that is aimed for Nova 12 and tablet
Main difference is the slower speed on the big core. W. Not idea on NPU or ISP, but GPU should be the same.
I think the goal with this SoC vs 9000S is just higher yield
yep, we saw CXMT listed on Redmi's list of domestic partners. This is a pretty big step imo.
I do wonder why Huawei doesn't at least use this for its lower end phones. Maybe CXMT is afraid of us govt
Because CXMT's LPDDR5 has not mass produced yet. CXMT says it's “been verified”, also says “它的市场化落地”. Means it just pass verification stage now，it will take some time to mass produce，and some time to appear on smartphone.
If we consider 7nm and forward to be advanced node，then advanced node accounts for 46% of total foundry share. Far from the popular myth circulating on internet that demand for advanced node is small，advanced node only has tiny share of overall chips.
Actually, both are true. Demand for mature node is higher when you talk about unit volume, and advanced node is higher when you consider total dollar value.
Loongson releases next-generation computer CPU 3A6000 in Beijing on Tue. The CPU is self-designed with key indexes comparable to global mainstream products, which observers said marks China’s new breakthrough in homegrown CPU design..
The Loongson 3A6000 processor uses a fourth-generation LoongArch, an instruction set architecture (ISA) processor. It is manufactured using 12-nanometer technology and features a quad-core design, with an operating frequency of 2.5GHz. It adopts a domestic instruction system and structure, and it belongs to a new generation of general-purpose processors that are self-developed and technologically controllable.
The Loongson 3A6000 is comparable to the Intel Core i3-10100 and AMD Ryzen 3 3100 CPUs in certain key functions, according to tech website Wccf tech.
"The release shows that domestic CPUs have reached a new height in self-sufficiency and performance. It also demonstrates that China is capable of producing first-class products based on a proprietary CPU structure," Shi Huikang, an official of the Ministry of Industry and Information Technology, told media outlets.
The Loongson 3A6000 processor uses a fourth-generation LoongArch, an instruction set architecture (ISA) processor. It is manufactured using 12-nanometer technology and features a quad-core design, with an operating frequency of 2.5GHz. It adopts a domestic instruction system and structure, and it belongs to a new generation of general-purpose processors that are self-developed and technologically controllable.
The Loongson 3A6000 is comparable to the Intel Core i3-10100 and AMD Ryzen 3 3100 CPUs in certain key functions, according to tech website Wccf tech.
"The release shows that domestic CPUs have reached a new height in self-sufficiency and performance. It also demonstrates that China is capable of producing first-class products based on a proprietary CPU structure," Shi Huikang, an official of the Ministry of Industry and Information Technology, told media outlets.
Big news!
Even head of schedule, CXMT roadmap says DDR5 on the market in Q1 2024
Although LPDDR5 is not DDR5. I found these 2 technical articles on DDR5 and LPDDR5
Maybe these 2 kind of memories are not exactly the same, but the key speed feature is 6400 Mbps for both (BTW this is also the speed of HBM3)
I'm further optimistic to see HBM3 in 2024, especially considering that Huawei will strongly push for it to complement its AI chip. With the latest US bans on AI chips, localization of HBM3 memory is very critical, and now it also seems within technological reach by China.
I read somewhere that YMTC expect to be fully booked in Q1 2024....SK Hynix chips on the Mate 60 are a temporary solution, especially after SK Hynix officially stated that they do not sell to Huawei and those chips are from old inventory. It does not matter if is true or not, it means SK cannot keep supplying Huawei forever.
I wouldn't be surprised to see both YMTC and CXMT on the Huawei bandwagon somewhere in 2024.
if you look at Samsung's timeline, they first started production of 12 GB LPDDR5 DRAM in July 2019. So, CXMT is about 4 to 5 yrs behind here
Now Samsung did this using 2nd gen 10nm process (so D1y). Maybe this is CXMT's 17nm process, who knows. next step is 16gb PDDR5.
Since Micron actually got to D1b without EUV, there is actually nothing preventing CXMT & domestic tool makers to achieve D1z
Dinglong Shares: The current domestic CMP polishing pad market space is approximately more than 2 billion yuan
Dinglong Co., Ltd. (300054.SZ) stated on the investor interactive platform on November 22 that Dinglong is the first company in the world that can produce all types of CMP polishing pads and has the full process technology capabilities of CMP polishing pads from raw materials to finished products. . At present, the company's CMP polishing pad products cover two categories: hard pads and soft pads. Among them: (1) CMP hard polishing pads are mainly used for rough polishing in the CMP process of integrated circuit chip manufacturing. At present, the company is the only company in China that fully masters the entire process of polishing hard pads. A domestic supplier of process core R&D and manufacturing technologies, its products have deeply penetrated into the domestic mainstream wafer factory supply chain, and it has become the first supplier to some customers. Domestic substitution has obvious leading advantages; (2) CMP cushions have two application fields. One is the precision polishing of the CMP process for integrated circuit chip manufacturing, and the other is the CMP process for large silicon wafer manufacturing. The company now has the world's first soft polishing pad factory with a full range of models and a highly automated production line. It has achieved self-research and production of polyurethane resin, the core raw material of soft polishing pads, and has the ability to customize and develop polishing pad products for customers with specific needs. In terms of market size, the current domestic CMP polishing pad market is about more than 2 billion yuan, of which CMP hard polishing pads account for more than 65%.
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