Chinese semiconductor industry
- Thread starter Hendrik_2000
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let's see what the numbers look like in November. If they actually keep export is like under 25% of what they exporting before, I will be satisfied. The Chinese authorities are too concerned about how other countries view them.
Maybe with these export curbs, they can at least figure out the international supply once the metals leave China.
Some of the partners from what I can see
Gigadevice - memory chip, MCU
OnMicro - RF modules/chips
Realtek (瑞昱) - Tw based company on network/multimedia IC
BouffaloLab (博流智能) - IOT, Wifi, bluetooth & other wireless chip
Allwinner Tech(全志) - Mixed signal SoC, looks like they have an IoT series
Ambiq - ultra low power SoC for wearable devices
Actions Semi (炬芯) - AIoT acoustic Soc
NXP
BesTechnic (恒玄科技) - Wearable SoC mostly for smart earbud, BES2700 is used in several products I think
Suunto - Finnish company for sports watches, dive products
Telink (泰凌微电子) - bluetooth LE chip, wireless connectivity SoC
Just wondering.
Is the 3A6000 comparable to Intel i7 in terms of performance and price ?
Also is it using 14 or 10 nm techology ?
China's first independent command printer main control chip, Loongson 2P0500 released
According to reports, this is the first domestic printer main control chip based on an independent command system. As the core control component of the printing/scanning machine, the successful development of Loongson 2P0500 will help promote more domestic printers to the market.
According to reports, Loongson 2P0500 is a main control SoC chip suitable for single/multi-function printers and is the core control component in the printing/scanning machine . This chip is mainly used for printing data reception, analysis and processing, print engine control, scanning timing control, scanning data, image processing and motor control, etc.
The chip adopts a heterogeneous core structure, with built-in one Loongson LA364, two Loongson LA132 processor cores and 512KB shared L2 cache . It integrates DDR3, GMAC, OTG, USB, printing interface, scanning interface, image unit, PMIO, AD/ DA, eMMC, SDIO, SPI, PWM and other functional modules, and implement power consumption management control module, a single chip can meet the needs of various typical applications such as printing, scanning, copying and so on
In addition, Loongson officials stated at the conference that Loongson has also carried out adaptation work on printer drivers, and the Dragon-architecture Linux platform can drive more than 95% of printers .
Network printers have always been a critical concern for information security. With domestically controllable printers, there is now more assurance in terms of security...
Finally，CXMT's LPDDR5 has arrived. And according to CXMT，it has been verified on Xiaomi and Transsion already
On November 28, 2023, CXMT officially launched the LPDDR5 series of products, including 12Gb LPDDR5 particles, POP-packaged 12GB LPDDR5 chips and DSC-packaged 6GB LPDDR5 chips. The 12GB LPDDR5 chip has been verified on models of mainstream domestic mobile phone manufacturers such as Xiaomi and Transsion. LPDDR5 is a product launched by CXMT for the mid-to-high-end mobile device market. Its marketization will further improve the product layout of CXMT's DRAM chips.
On November 28, 2023, CXMT officially launched the LPDDR5 series of products, including 12Gb LPDDR5 particles, POP-packaged 12GB LPDDR5 chips and DSC-packaged 6GB LPDDR5 chips. The 12GB LPDDR5 chip has been verified on models of mainstream domestic mobile phone manufacturers such as Xiaomi and Transsion. LPDDR5 is a product launched by CXMT for the mid-to-high-end mobile device market. Its marketization will further improve the product layout of CXMT's DRAM chips.
Now CXMT's DDR5 has arrived，do you think they can make HBM3 now？
Seven projects including BGI Jiutian Xi'an R&D Base signed contracts with Xi'an High-tech Zone.
Xi'an High-tech Zone signed seven industrial projects on site, covering areas such as integrated circuits, digital economy, and network security, with a total investment of nearly 1 billion yuan. Among them, the BGI Jiutian Xi'an R&D base project will be built into the largest R&D base center in the northwest, providing strong technical support to solve the problem of domestic stuck necks; the Weilan Group's headquarters production R&D base project with a total investment of 500 million yuan will create a domestically leading product research and development center and environmentally friendly big data intelligent platform development laboratory; Hollysys and Tuoer Microelectronics each invested nearly 200 million yuan this time to build a new intelligent manufacturing demonstration factory project and an integrated circuit research center and innovation demonstration base. project.
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