Chinese semiconductor industry

Recently, Yaoguang's semiconductor laser annealing equipment has been debugged and verified by the customer's new production line and confirmed to meet mass production requirements. The yield exceeded expectations and successfully passed the acceptance inspection!
This equipment has been put into production in the customer's new production line. The production line plans to produce 100 million power chips and 10,000 6-inch SiC epitaxial wafers annually , including "100,000 silicon carbide epitaxial wafers and JBS and MOSFET power integrated circuits." " .

The SiC/Si-based laser annealing equipment independently developed by Yaoguang Semiconductor is widely used in multiple processes such as silicon-based IGBT ion doping activation and silicon carbide back electrode coating annealing. Its microsecond-level control system, wafer thickness measurement function and excellent optical shaping device provide an efficient solution for the wafer annealing process.

This equipment acceptance marks that the "Yaoguang Semiconductor Laser Annealing Project" has passed the last milestone (PP valve point) of the development process ESDP. From the perspective of equipment industrialization, the effectiveness and reliability of the ESDP forward development process are further verified. At the same time, it also provides a reliable R&D theoretical basis for the forward development of new projects such as Yaoguang Semiconductor's MOCVD and RTP rapid annealing. In the future, the company will continue to increase investment in research and development to help achieve my country's goal of "overtaking around the corner" in the semiconductor industry.​

Walking into the project construction site, material transport trucks shuttled in an orderly manner, and curved-arm self-propelled lift trucks moved up and down along the wall. As the operator's instructions were issued, the large crane waved its arms to steadily transport the huge rock wool sandwich panels to the designated location. “Since construction started on August 12 this year, the East District A05 third-generation semiconductor technology innovation center test verification center with a construction area of 17,000 square meters and the A10 comprehensive warehouse with a construction area of 5,000 square meters were completed in just over three months. For the construction of the main structure, the installation of the metal enclosure structure on the wall and the spraying of internal fireproof coatings have begun." The on-site construction leader of Eleven Technology, the construction unit, introduced that the project department, on the premise of doing a good job in safe production, based on the actual winter construction conditions , provide logistical support for more than 100 workers working hard at the construction site in the east and west districts, and equip outdoor workers with cold-proof equipment to ensure the smooth progress of the project.

China Electronics Technology (Shanxi) Third Generation Semiconductor Technology Innovation Center is located in Xiaohe Emerging Industrial Park, Shanxi Comprehensive Reform Demonstration Zone, and is implemented by China Electronics Technology Second Institute. Including the third-generation semiconductor technology innovation center test verification line and supporting projects covering an area of 203 acres in the east district, and the microelectronics intelligent manufacturing industry base project covering an area of 312 acres in the west district. The total planned investment is 1.27 billion yuan and will be constructed in two phases. After the completion of the first phase of the project, it will have the ability to produce 600 units/set of intelligent manufacturing equipment and 24,000 pieces/year of ceramic substrates and circuit modules. It will also build a 6-inch wide bandgap semiconductor manufacturing equipment process verification platform and a common technology research and development platform.​

As the world's leading chip manufacturing service provider, Changdian Technology has created complete advanced millimeter wave radar packaging solutions and accumulated rich mass production experience to meet the diverse needs of customers in various fields such as autonomous driving, intelligent transportation, and smart homes. need.
Millimeter-wave radar has become a popular technology in many intelligent application fields in recent years due to its advantages such as small size, easy integration, high spatial resolution, and strong anti-interference ability, and has broad market prospects. Guosen Securities predicts that the global millimeter wave radar market will reach 38.4 billion yuan by 2025, with a compound growth rate of 25.5% from 2021 to 2025.
The hardware core of millimeter wave radar includes MMIC and antenna. The system architecture consists of antenna, transceiver module, power management, signal processing and other parts. Chip packaging methods mostly use flip-chip packaging, fan-out packaging, and AiP (Antenna in Package) packaging that integrates antenna and radar transceiver chips.
In the high-precision millimeter-wave radar market, Changdian Technology cooperates with many leading millimeter-wave radar chip customers at home and abroad to develop, using packaging technologies such as eWLB and FC flip-chip to meet the needs of customer products with multiple transceiver channels, integrated antennas, and low power. consumption needs and help customers enrich their product lines. At present, Changdian Technology has achieved large-scale mass production of millimeter wave radar products.
The industry's leading millimeter-wave radar chip provider Aanda Technology has maintained a long-term cooperation with Changdian Technology to provide the market with millimeter-wave radar solutions that are easy to integrate, low energy consumption and highly cost-effective. Based on Antenna Technology's CMOS millimeter wave radar SoC chip, the newly launched 60GHz AiP (Antenna in Package) and 77GHz AiP series of millimeter wave radar chips further reduce the complexity and cost of millimeter wave radar systems. During the cooperation process, Changdian Technology has provided complete flip-chip (FCCSP) integrated antenna AiP and other packaging products in view of the multi-scenario application characteristics of the product, achieving small size, high yield, high reliability and low cost of the product, which can meet the needs of Application needs in multiple fields such as automotive intelligent driving, intelligent cockpits, smart homes, drones, and intelligent transportation.

Liande Equipment stated on the investor interaction platform on November 27 that the company is actively deploying in the semiconductor field and has successfully entered the semiconductor packaging and testing industry with the successful development of semiconductor IC packaging equipment. At present, eutectic, soft solder and other die bonding machines and equipment such as QFN lead frame coating and lead frame inspection have been delivered to customers for mass production. The company will actively create and seize development opportunities in the field of semiconductor equipment, accelerate technology research and development and market development in the field of semiconductor equipment, and strive to achieve rapid business development.

Liande's die-bonding machine equipment can be used in the field of advanced packaging, mainly semiconductor die-bonding machines, including display driver chip COF flip-chip machines, semiconductor flip-chip machines, soft solder die-bonding machines, eutectic die-bonding machines, etc.

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