Chinese semiconductor industry

Debon Technology released the survey minutes, which mainly introduced the company’s latest progress and future plans in the field of chip-level packaging materials. The four materials include die-hard adhesive film (DAF/CDAF), AD adhesive, underfill adhesive, and chip-level thermal interface material (TIM1). The verification is progressing smoothly in cooperation with multiple design companies and packaging and testing factories.

As a leading domestic supplier of chip-scale packaging materials, Deppon Technology's products have broad application prospects in the domestic market. Die bonding adhesive film (DAF/CDAF) is one of the most popular products on the market currently. In addition to die bonding adhesive film, Deppon Technology's other chip-level packaging materials are also progressing smoothly. AD glue and underfill glue have been verified by some customers and received small batch orders. These products have reached the domestic leading level in terms of performance and quality and have high market competitiveness.

In addition, Deppon Technology is also actively promoting customer verification of chip-level thermal interface materials (TIM1). This product is a high-performance thermal conductive material newly developed by Debon Technology. It has the advantages of high thermal conductivity and high reliability, and is suitable for heat dissipation problems of various electronic devices. Currently, this product is being actively promoted and is expected to become an important growth point for the company in the future.

Although its UV film series, die-hardening adhesive series, thermal conductive series materials and other products are currently not large in scale, with a scale of tens of millions, and other new products are still in the introduction and verification stage, Deppon Technology has been making steady progress.

In the last decade and half I hear-read everything from the shifting narrative of the think tankers in D.C. from 5G to chips and what to do.
- Ban the chips, allow fabbing abroad and domestic.
- Let them buy the chips, allow abroad fabrication, ban the tools for domestic fabrication.
- Let them buy the chips, ban abroad fabrication, ban the tools for domestic fabrication.
- Ban the chips, ban abroad fabrication, ban the tools for domestic fabrication.

Due how expensive export controls is and has always been for US companies, the Obama administration adopted the concept of "small yard high fence" approach for export controls but this is not "the small yard high fence" that the current stooges in the White House are telling everyone or the one they hoped for.
The stakes have never been this high, is not just Huawei, this is probably forcing Chinese companies that otherwise would have not even consider the idea of investing and even getting in, not just into chip design but way deep into semiconductor manufacturing itself including in wafer processing equipment <like my last Lenovo post>. For example the pressure for developing a high end lithography supply chain have grown to stratospheric levels, is not now just the government lab project aimed mainly for defense-aerospace production but now has become a matter of survival for a trillion dollar sector. Is pretty grim for ASML who doesn't want more competition in a pretty niche area especially if they are going to have their hands tie to their backs by Western governments.​