Chinese semiconductor industry

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tokenanalyst

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Semiconductor equipment manufacturers are "posting orders". The contract size of Shengmei Shanghai in hand is nearly 6.8 billion yuan.​


Against the backdrop of cyclical adjustments in the semiconductor industry, semiconductor equipment has become one of the few contrarian growth tracks, but the market has begun to worry about the sustainability of rapid growth.
A-share semiconductor equipment giant Shengmei Shanghai (688082) "released orders" on the evening of September 27. The company currently has a total order amount of about 6.8 billion yuan, more than twice last year's revenue.
Shengmei Shanghai is engaged in the development, manufacturing and sales of cleaning equipment, electroplating equipment, stress-free polishing equipment, vertical furnace tube equipment, front-end coating and development equipment and plasma-enhanced chemical vapor deposition equipment. As of September 27, 2023, the company's total order amount on hand was 6.796 billion yuan, of which the total amount of signed contract orders was 6.526 billion yuan, a year-on-year increase of approximately 40%, and the bid-winning unsigned contract orders were 270 million yuan, a year-on-year increase of nearly 16%. times.
For orders that have won the bid but have not signed a contract, Shengmei Shanghai stated that due to the relevant procedures involved, as of the announcement date, the company has not yet signed a formal contract with the bidder for this project, including the contract signing time, performance arrangements, performance terms and There is still uncertainty about the final amount, and the company will recognize project revenue based on contract execution and revenue recognition policies; orders on hand include equipment orders that have been delivered to customers but have not yet received customer confirmation of receipt in accordance with Chinese accounting standards, and orders that will be received in the future. Delivery of equipment orders. In addition, the above data on orders on hand are derived from the company's internal statistics. Without auditing, the company's annual operating income, net profit and other financial data cannot be directly derived from this.
Benefiting from the increasing demand for equipment in the domestic semiconductor industry and the continued growth of sales orders, Ame Shanghai achieved operating income of 1.610 billion yuan in the first half of this year, a year-on-year increase of 46.94%. The company achieved attributable net profit of 439 million yuan, a year-on-year increase of approximately 80%. However, Compared with the 1.64-fold year-on-year increase in attributable net profit in the first half of last year, the growth rate of the company's performance has slowed down in the same period this year.​

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This is what happens when someone gives a humanities major non-minimum wage job out of the goodness of his or her heart.
I don't have a gripe about their earnings, diplomats make a lot of money. My issue is how someone who graduated in East Asian Studies all the sudden has so much influence over a 600 billion dollar industry?
The semiconductor industry like many industries has always had their superstars-legends, people who have shifted the industry, like for example Morris Chang or Federico Faggin, this people grinded their entire lives in that industry but this could be probably the first time that people unrelated to the semiconductor industry have such influence.
 

tokenanalyst

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Anhui's over 700 billion yuan project has been mobilized, including the Hefei Jinghe 12-inch wafer manufacturing project​

On October 7, Anhui Province held a mobilization meeting to start the fourth batch of major projects in the province in 2023.
Xinhua News Agency reported that 1,089 projects in Anhui Province have started mobilization, with a total investment of 707.46 billion yuan. Among them, there are 31 projects worth more than 5 billion yuan, and the number of newly started major projects has increased.
The report pointed out that a total of 670 manufacturing projects were mobilized in the fourth batch, with a total investment of 415.28 billion yuan. There are 22 new manufacturing projects with a total investment of more than 5 billion yuan, such as the Hefei Jinghe Integrated Circuit 12-inch wafer manufacturing project with a total investment of 21 billion yuan, and the Wuhu Tianchen Energy Optical Storage Integrated New Energy Industry Base Project with a total investment of 11.6 billion yuan. wait.
In the list of key projects in Anhui Province in 2023 (the first batch), the Jinghe Phase II Project and the Hefei Jinghe Integrated Circuit Advanced Technology R&D Project are on the list as continuation projects.

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tokenanalyst

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2.5D&3D Advanced Packaging Etching Technology Difficulties and Solutions" - Li Guorong, Director of 12-inch Etching Product Line of Beijing North Huachuang Microelectronics Equipment Co., Ltd.

Director Li introduced that the etching process is the key and difficult point in the entire advanced packaging technology. The main difficulty is on the one hand the morphology control of high aspect ratio (AR greater than 30:1) etching; on the other hand the difficulty is the etching technology for backside leakage after Cu filling in TSV, which involves particle contamination control, cost control and quantity. production stability and other challenges. At present, Northern Huachuang has achieved stable mass production of TSV process, backside Cu leakage process and other multi-channel etching processes at many customers.
 

tokenanalyst

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"Application of in-line sputter in EMI" - Dai Tianming, Vice President of R&D Center of Guangdong Honghao Semiconductor Equipment Co., Ltd.

During the speech, Mr. Dai described the application, basic requirements and design essentials of EMI PVD electromagnetic shielding in SIP or other packages; he also introduced the development status, equipment specifications and advantages of Honghao EMI PVD; and other applications of Honghao EMI PVD.

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tokenanalyst

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"Progress in Yuntian Glass-based IPD Manufacturing and Advanced Packaging Development" - Ruan Wenbiao, R&D Director of Xiamen Yuntian Semiconductor Technology Co., Ltd.

Director Ruan introduced that Yuntian has successfully developed TGV and IPD manufacturing technologies and has reached the international advanced level. In addition, Yuntian has developed TGV adapter boards including high aspect ratio glass through-holes, metal filling and multi-layer RDL, which can be used for chiplet system-level packaging. At the same time, multi-chip integration technology is studied, the wafer-level fan-out packaging (WL-FO) process is developed, and progress is made in molding compound FO and glass substrate FO.

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sunnymaxi

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Students from China's School of Electronic Science and Engineering in Xiamen wins the first prize in the 2023 IEEE ICEPT Best Student Paper Award​


A master’s student of Xiamen University’s School of Electronic Science and Engineering won the first prize in the 2023 IEEE ICEPT Best Student Paper Award recently,. The paper is entitled “Fine Pitch Wafer-to-Wafer Hybrid Bonding for Three-Dimensional Integration” by Jiang Xiaofan..

The conference received a total of 750 paper submissions and accepted 499 papers, setting a record for the highest number of submissions and acceptance rate in all previous ICEPTs.

Contributed papers come from researchers from Chinese and international scientific research institutes and IC companies.

The School of Electronic Science and Technology of Xiamen University said hybrid bonding technology has received significant attention from the industry because it can achieve ultra-high-density chip stack interconnection. Jiang’s paper investigates a fine-pitch hybrid wafer bonding technology designed for heterogeneous integration applications to achieve high-density interconnects and improve electrical performance through the bonding of copper and SiO2 wafers.

ICEPT has been recognized as one of the top four electronic packaging academic conferences, which is hosted by the Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS) and Shihezi University. It’s co-organized by the IEEE Electronics Packaging Society (IEEE-EPS) and has been held in China every year since its inauguration in 1994.

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