Chinese semiconductor industry

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tphuang

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I hope China is prepared for this. Sometimes I think the Huawei's P60 announcement has brought new pressure for China now.
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This is only a problem if you think China wants TSMC to expand production further on mainland. Which I'm uncertain of given that TSMC are fighting market share with SMIC for the 28nm segment in China.

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anyone, sharing something so that orders understand what's going on when chips get commoditized. In this case, Silan micro captured some market share by Q2 and caused BYD's IGBT cost to come down 10 to 15%. So, now there is a price war in IGBT market

Since demand for IGBT is still high outside of China and foreign vendors unlikely to drop prices by this market in near term, you will see them lose market share
 

gelgoog

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Here is a link to the article in the South Korean DDaily news that Digitimes is talking about.
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"... the localization rate of Chinese semiconductor equipment exceeded 40%. This figure has more than doubled in two years.

So far, the US, Japan, and Europe have led the semiconductor equipment market. The Chinese semiconductor industry was also highly dependent on that country. However, as the United States experienced a trade conflict with China and began to 'kill semiconductors', procurement of essential equipment became difficult. With Japan and the Netherlands joining in, it became virtually impossible to establish a new semiconductor line.

In response, the Chinese government took action directly. Through trillion-dollar funding support, domestic equipment companies such as Zhongwei Semiconductor, Beifang Huachang, and Shanghai Microelectronics were fostered and the proportion of internalization was rapidly increased.

Overall investment in research and development (R&D) also increased significantly. According to Japan's Nikkei Shimbun, 80% of semiconductor companies listed on the Chinese stock market in the first half of this year increased R&D expenses compared to the previous year. SMIC, China's largest semiconductor foundry company, saw its R&D spending increase by 5% even though its net profit during this period fell by more than 50% compared to last year.

In addition, it is evaluated that the government's semiconductor development strategy has become more detailed. An official in the semiconductor industry said, “In the past, we would have given money to local governments and let companies take care of it, but as there were many failures and growth was slow, we changed our method. We used a limited company to purchase equipment directly and distribute it to places where it is needed.” explained.

However, in the exposure sector, which accounts for the largest proportion of the eight major semiconductor processes (approximately 60% of time and 35% of cost), the self-sufficiency rate is only in the single digit range. Exposure is the process of engraving circuits on a wafer by emitting light, but the technical difficulty is very high.

In a situation that is difficult to overcome in a short period of time, China is using existing deep ultraviolet (DUV) equipment to perform 'multi-patterning' (a process technology that projects light multiple times) or secure a large number of expensive equipment in the relatively less regulated post-process field to process cutting-edge processes. It is said that it makes up for the shortcomings. The result is the 7-nano application processor (AP) ‘Kirin 9000s’ installed in Huawei’s ‘Mate 60 Pro’.

Insufficient facilities are sometimes made up of using used equipment. It is rumored that the Chinese side is sweeping up used equipment in 2020. It is known that they are also using the expedient method of importing equipment that has not been used a few times and accounting for it as used.

An official from another company said, “China has been putting a lot of effort into recruiting overseas semiconductor talent since the past. Every year, tens of thousands to hundreds of thousands of master's and doctoral degrees are produced. “This talent pool will be making a significant contribution to China’s semiconductor growth,” he analyzed.

Recently, China is said to have given verbal instructions to its electric vehicle manufacturers to use only Chinese semiconductors. In this way, it is expected that the government-level semiconductor drive will become more and more explicit in order to expand its own ecosystem."
 
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tphuang

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CRRC just did environmental study on its project for SiC MOSFET in Zhuzhou. Goal here is to produce 20k wafers per year of SiC

Looks like construction finished in May & production should start soon.

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中科汉韵 (SiCChip) has delivered 500 auto grade SiC MOSFET wafers for 1200V and 750V used in Electric motor of EVs. Clearly, they've started to deliver SiC chips to customers by this point. Not sure about production capacity, but they did create one in May 2021. I'm sure if they want to supply more, they need to also produce more

i think the general trend here is that domestic SiC producers are finally getting qualified with automakers. Major power chip makers have already experienced the commoditization of IGBTs after chinese power chip makers ramped up production.

SiC is probably 2 years behind, so we are going to really see SiC production from Chinese chipmakers take over supply chain by 2025 imo. Even if they are a little behind technology wise, it doesn't matter
 

tokenanalyst

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Han's Laser: launches new silicon carbide laser annealing equipment product​

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According to micronet news, Han's Laser recently stated in an institutional survey that in the field of Micro-LED, the company has simultaneously promoted the layout of MIP and COB packaging routes, and has developed Micro-LED mass transfer and Micro-LED mass welding. , Micro-LED repair and other equipment, the market verification reflects well. In terms of third-generation semiconductor technology, the silicon carbide laser slicing equipment developed by the company is continuing to promote cooperation with leading industry customers to prepare for large-scale production, and has launched a new product of silicon carbide laser annealing equipment.
Han's Laser's downstream industries include consumer electronics, PCB, new energy, semiconductor and other industries. From January to June 2023, it achieved operating income of 6.0867957 million yuan, operating profit of 381.8841 million yuan, and net profit attributable to the parent company of 423.8498 million yuan, excluding non-recurring items. Net profit after profit and loss was 197.5134 million yuan, a decrease of 12.25%, 44.01%, 32.88% and 67.44% respectively compared with the same period last year.
Han's Laser disclosed that the company's operating performance in the first half of the year declined compared with the same period last year. The main reason was that under the influence of complex factors such as macroeconomic downturn and industry cycle changes, downstream customers became more cautious in investment and the company's orders declined.
In recent years, Han's Laser has increased its resource investment in new energy indus​

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tokenanalyst

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To assist in advanced packaging of pressure sensors, Zhuoxing Semiconductor launches the third generation of semiconductor placement equipment.​


vision, linear drive and algorithms, and combined with advanced packaging technology, Zhuoxing Semiconductor provides a full range of packaging solutions for silicon controlled pressure sensors. For example , the AS8100 Mingjian series of high-precision placement machines recently developed by Zhuoxing is specially designed for the packaging of thyristor pressure sensors. It can handle tiny chips, achieve parameter sequence control and program pressure control, and achieve high-precision pressure control. , the packaging is more reliable and has the characteristics of high efficiency, high precision and high reliability .

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High precision
SCR pressure sensors require high-precision equipment to handle small and sensitive chips and conduct wire bonding, so the pressure sensors have high requirements on the placement machine. Zhuoxing designs high-precision placement machines specifically for pressure sensor packaging, which can achieve high-precision welding of ±7 μm/3 σ and finely process micro-chip packaging.

high efficiency
Zhuoxing AS8100 Mingjian series chip placement machine adopts a turret multi-station structure to achieve simultaneous placement and photo compensation. The equipment has multiple processes in parallel and the Z/R axis is directly connected. It meets the requirements of high-precision packaging of silicon controlled pressure sensors. At the same time, the efficiency of packaging and patching is improved.

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High reliability

The thyristor pressure sensor chip mainly relies on the pressure difference to deform the sensitive layer on the chip to cause internal resistance changes. The flatness and high consistency of the chip during the packaging process affect the consistency of the final product and the linear relationship of the parameters, which is uncontrollable. Pressure can easily cause chip damage when picking up and placing chips. In addition, the thyristor sensor may generate packaging pressure due to impact, vibration, or thermal expansion, causing device deflection or initial deformation of the pressure sensing film.

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Pressure is the core factor related to pressure sensor packaging . Zhuoxing Semiconductor finally solved the problem of pressure control through its self-developed pressure and position composite control system and its self-developed motor. Zhuoxing's self-developed control system and self-developed motor can perfectly control the glue thickness within ±10um, ensuring the flatness of the chip and the consistency of the glue thickness, and controlling the packaging pressure to ensure the stability and reliability of the chip packaging.

Zhuoxing Semiconductor's thyristor sensor packaging solution achieves high-precision patching technology through technological innovation and process upgrades, and also provides a comprehensive packaging solution for thyristor pressure sensors.

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tphuang

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i thought a while back whether to include this weibo user's snippet, but she is occasionally right and this sounds plausible. We will see
封测厂那边的小道消息,K9000S有5个版本,个人推测会把一些体质差的做降频和核心屏蔽,降级为一些稍低规格的中端芯
你很诧异?举个例子:英特尔CPU i5以及i7,其实就是同一个电路,i5和i7的区别就是因为i5很多电路坏掉,把坏区做封闭与隔离,就成了我们看到的i5...芯片,可以是同一条产线、同一块硅晶片生产出来的产品,但因为部分有瑕疵而降级使用,售价也会调低一点~
says there are 5 versions of 9000S. Some of the ones which have more deformity don't get thrown out, but may end up being used for lower end chip.

This seems plausible or even likely given the higher expectations for Mate 60 phones. You could have more variance in performance for Nova 12 SoC. I think Dylan Patel's article talked about binning. Maybe this is how you get to higher yield. Same process, but lower performing ones end up in medium ranged phone. I believe Nova 12 Pro will use 9000S also.

Huawei Whisper showcased photos taken by iPhone 15 & both Mate 60 and Mate 5X. The difference is huge.
Very few people will notice or care that their phone use up more power playing games on Mate 60 & 5X vs iPhone, but most people will notice if their pictures have lower resolution or their phone signals are worse

And Nova 12 should come out later this year, but October problem too soon. Some components still need work. Will be interesting if they can put satcom on Nova 12. That will just kill the competition imo

another good point by HW former HR
以后华为发布会了,感觉和友商最大的不同就是:

友商不停吹:高通处理器、安卓最新版本,美国大猩猩玻璃、索尼大底、三星屏幕、24G运存,跑分XXX等这些。感觉十年来套路没有啥变化。

华为估计是这种:麒麟处理器、鸿蒙系统4.0,昆仑玻璃2二代、XMAGE影像技术、灵犀通讯技术、卫星通信技术、星闪技术、万物互联、盘古大模型的小艺等等。
product unveiling. Huawei will be boasting about great domestic tech & there are great new tech coming out all the time. competition will talk about just the latest versions of the same product from foreign suppliers. Seems like given this trend, domestic IDMs will have to shift their pitch to more domestic products also
 

tphuang

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006DKHfbgy1hi5as2tm2ej335s2dc1l0.jpg006DKHfbgy1hi5as57au3j34eo3b0u11.jpg
Here is what huawei whisper is talking about Mate 5X vs iPhone side by side. You can see 5X camera captures light a lot better

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now iPhone and Mate 60 side by side. I will let you guess which one is Mate 60 and which one is iPhone

basically, i think people are going to see over time that Chinese suppliers can get you the best product and there is no need to use foreign chip/sensor suppliers. you don't need apple SoC, algo or Nikon camera to get the best photo qualities.
 
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