Basically Huawei and Huawei's prodigal son hold the top two positions. Obviously, the King is back.
And so is China's semicon industry. Can't wait to see what is coming in the next five years!!!
Chinese semiconductor industry
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Basically Huawei and Huawei's prodigal son hold the top two positions. Obviously, the King is back.
And so is China's semicon industry. Can't wait to see what is coming in the next five years!!!
Hua Hong Semiconductor plans to use more than 12.6 billion yuan of raised funds to increase investment in Hua Hong Grace, and the fundraising project is progressing steadily
Hua Hong Semiconductor (stock abbreviation "Hua Hong Company", stock code: 688347.SH) announced that the board of directors reviewed and approved the "Proposal on Using Raised Funds to Increase Capital in Wholly-Owned Subsidiaries" and agreed. The company used the raised funds to increase the capital of its wholly-owned subsidiary Huahong Grace by RMB 12.63235 billion.
According to the announcement, part of the funds raised from this capital increase will be used by Huahong Grace to increase capital in Huahong Semiconductor Manufacturing (Wuxi) Co., Ltd., the implementation entity of the Huahong Manufacturing (Wuxi) project, and the rest will be used for the 8-inch factory optimization and upgrading project, Characteristic process technology innovation research and development projects, etc., are in line with the use plan of the raised funds.
This capital increase is a manifestation of Huahong Semiconductor's continuous enhancement of its core competitiveness and improvement of the company's production capacity. In recent years, Hua Hong Semiconductor has always maintained high R&D investment. In the first half of this year, the company's research and development expenses reached 671 million yuan, a year-on-year increase of 17.37%. With the expansion of scale and the commissioning of new production lines in the future, the company's R&D strength will be further enhanced to ensure the company's advantageous position in terms of technology level and business scale on the diversified characteristic process platform.
According to the announcement, part of the funds raised from this capital increase will be used by Huahong Grace to increase capital in Huahong Semiconductor Manufacturing (Wuxi) Co., Ltd., the implementation entity of the Huahong Manufacturing (Wuxi) project, and the rest will be used for the 8-inch factory optimization and upgrading project, Characteristic process technology innovation research and development projects, etc., are in line with the use plan of the raised funds.
This capital increase is a manifestation of Huahong Semiconductor's continuous enhancement of its core competitiveness and improvement of the company's production capacity. In recent years, Hua Hong Semiconductor has always maintained high R&D investment. In the first half of this year, the company's research and development expenses reached 671 million yuan, a year-on-year increase of 17.37%. With the expansion of scale and the commissioning of new production lines in the future, the company's R&D strength will be further enhanced to ensure the company's advantageous position in terms of technology level and business scale on the diversified characteristic process platform.
The core-increasing 12-inch wafer manufacturing line project has been capped and is expected to be put into production in Q2 next year
The Guangzhou Zengcheng Intelligent Sensor Industrial Park release and Zengxin project capping event was held at Zengcheng Development Zone Zengxin Industrial Project Park. The full name of the Zengxin project is the Zengxin 12-inch advanced smart sensor and specialty process wafer manufacturing mass production line project. It has attracted much attention since the day it settled in Zengcheng.
Zhang Liang, general manager of Zengxin Technology, said in his speech that the capping event held today marks that the civil construction of the Zengxin project is about to enter the electromechanical installation stage, and is another important milestone in the construction of the Zengxin project. We have completed the purchase of key equipment such as photolithography machines, etching, and measurement, ensuring that the first equipment will be moved in by the end of the year. We will strive to complete the completion acceptance in the first quarter of next year and put it into production in the second quarter, so as to contribute to the development of the integrated circuit industry in the Greater Bay Area as soon as possible.
It is reported that the new core 12-inch advanced MEMS sensor and specialty process wafer manufacturing mass production line project has a total investment of 7 billion yuan in the first phase. After the project is completed, it will have an annual production capacity of 240,000 12-inch wafers. The main applications of the product In the fields of automotive electronics, Internet of Things, quasi-industrial, consumer electronics and other fields, it is one of the determinants of product performance in related fields. At the same time, it will also form a linkage and agglomeration effect with the upstream and downstream industry chains such as IC design, packaging, and testing, which will help promote independent innovation breakthroughs in key semiconductor fields and core technologies such as domestic chip manufacturing and integrated circuit manufacturing, and meet the needs of the Greater Bay Area as a national Even the world's largest production base of Internet of Things, consumer electronics, industrial automation and intelligent connected automobile products has huge and urgent market demand for MEMS sensors and related semiconductor products.
MEMS refers to a micro-integrated system that uses integrated circuit manufacturing technology and micromachining technology to manufacture micro-sensors and micro-actuators on a chip. With the rapid development of new generation information technologies such as the Industrial Internet, Big Data, and the Internet of Things, advanced smart sensor chips have great potential.
Zhang Liang, general manager of Zengxin Technology, said in his speech that the capping event held today marks that the civil construction of the Zengxin project is about to enter the electromechanical installation stage, and is another important milestone in the construction of the Zengxin project. We have completed the purchase of key equipment such as photolithography machines, etching, and measurement, ensuring that the first equipment will be moved in by the end of the year. We will strive to complete the completion acceptance in the first quarter of next year and put it into production in the second quarter, so as to contribute to the development of the integrated circuit industry in the Greater Bay Area as soon as possible.
It is reported that the new core 12-inch advanced MEMS sensor and specialty process wafer manufacturing mass production line project has a total investment of 7 billion yuan in the first phase. After the project is completed, it will have an annual production capacity of 240,000 12-inch wafers. The main applications of the product In the fields of automotive electronics, Internet of Things, quasi-industrial, consumer electronics and other fields, it is one of the determinants of product performance in related fields. At the same time, it will also form a linkage and agglomeration effect with the upstream and downstream industry chains such as IC design, packaging, and testing, which will help promote independent innovation breakthroughs in key semiconductor fields and core technologies such as domestic chip manufacturing and integrated circuit manufacturing, and meet the needs of the Greater Bay Area as a national Even the world's largest production base of Internet of Things, consumer electronics, industrial automation and intelligent connected automobile products has huge and urgent market demand for MEMS sensors and related semiconductor products.
MEMS refers to a micro-integrated system that uses integrated circuit manufacturing technology and micromachining technology to manufacture micro-sensors and micro-actuators on a chip. With the rapid development of new generation information technologies such as the Industrial Internet, Big Data, and the Internet of Things, advanced smart sensor chips have great potential.
"Huawei is emulating Apple in developing the processors that power its latest smartphone, a breakthrough that will help the Chinese company to reduce its reliance on foreign technology as it confronts US sanctions.
Analysis of the main chip inside the Mate 60 Pro smartphone, which launched at the end of last month and immediately sold out, reveals that Huawei has joined the elite group of Big Tech companies capable of designing their own semiconductors."
What is this though? The author doesn't know that Huawei had been designing its own chips pre-sanctions.
Too many things to list and I would appreciated if people stop putting Huawei on some saviour status level
Well, the important part is to see how much of the iphone market share they can take. HW's new phones operate exclusively in apple territory
i wouldn't waste my breathe on any single sentence they put there. You get what you get with MSM. But it is a huge significance for them to be designing their own core and GPU into a smartphone SoC.
pretty good stuff here so another 12.6B RMB. This is the key
Work on it has already started & building will be roofed by Q4 2024 and production to start in 2025. Again 83k wpm expected here on top of the 95k in phase 1 fab (fab 7 i think??)
This is why I think SMSC SN2 will start production in 2024. It looks like the entire facility will be ready for operation by July 2024. Should be able to at least start trial production in 2024
BGI Jiutian and Jiutongfang jointly build domestic EDA solutions
Huada Jiutian Technology Co., Ltd. (hereinafter referred to as "Huada Jiutian") and Hubei Jiutongfang Microelectronics Co., Ltd. (hereinafter referred to as "Jiutongfang") announced a strategic cooperation to jointly commit to building domestic RF Circuit and electromagnetic field collaborative simulation design solution.Based on the RF chip design requirements of silicon -based and compound processes, BGI has developed a RF full-process EDA tool system. The system includes RF model extraction tools (Empyrean Argus®) etc.
BGI Jiutian EDA tools provide a full-process solution for RF chip design, from schematic to layout, from design to physical verification, providing users with complete design process support.
In order to connect the entire process of RF chip design and simulation, BGI Jiutian has opened its partner interface and integrated Jiutongfang’s electromagnetic field simulation tools (eWave & ePCD). eWave's three-dimensional planar electromagnetic simulation tool based on the method of moments can efficiently handle on-chip passive components , such as spiral inductors, baluns, transformers, MIM capacitors, MOM capacitors, RFIC transmission lines, filters, amplifiers and mixed-signal IC designs. Issues such as skin effect, parasitic coupling, multi-layer lossy substrate loss, substrate and interconnect coupling effects, etc. ePCD is the industry's leading passive device design and modeling tool. Through equivalent circuit models and electromagnetic field solving technology, it provides unprecedented simulation accuracy and speed for passive device design.
interesting that so many patents filed long ago on EUV just got published recently.
I'm not sure what other major components still haven't seen these patents. I assume all the components are in there by now even if we haven't seen them published.
Looking through my saved photos, looks like the most recent Filing/application date for all these patents came out around March/April range. So I assume that they've been assembling & integration prototype for much of past few months.
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