Chinese semiconductor industry

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tphuang

tphuang

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looks like Zensemi's (增芯科技) new 12-inch fab for MEMS hs been roofed and now will start moving in equipment. Production to start in June of 2024

Other MEMS fab I've seen from sai micro and SMEC are all 8-inch, so 12-inch part surprised me a little bit and so did its size

7B RMB for 20k wpm of production for auto electronics, IoT, consumer electronics and industrial. So not a small project at all
 
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Alb

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tphuang said:
rumor here that YMTC's production for first 6 months of 2024 has all been snapped up
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I have no idea how close to reality this actually is. However, if they are this fully booked, it would also tell me they need to expand production fast.
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Not sure this has been shared before but I think it's worth reading.
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theorlonator

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Alb said:
Not sure this has been shared before but I think it's worth reading.
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This made me laugh:

“Proving that U.S. technology was used to produce the Kirin 9000s will be impossible to do using a technical teardown. It has always been problematic how the Commerce Department would determine a violation of the foreign direct product rule [FDPR], given the complexity of semiconductor manufacturing, vague definitions of what exactly constitutes U.S. technology and the rapidly evolving nature of technologies and production processes.”

Well yeah, SMIC and other fabs aren't going to tell you what equipment they're using lol.
 
tphuang

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tphuang said:
still not clear what process this uses, but Huawei will have its product unveiling party next week

and there are more smart screens
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So a lot more V811 is needed. At the pace this is going, HW is going to need 50% of SMIC's 14nm production also (on top of the 99% 7nm production)
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LeTV will be unveiling new projector on 25th. The entire series will be using Hisilicon chip. Unclear if this will be using V811 or something else. But given the same date as Huawei unveiling, I get the sense that it will use the same chip that the Huawei screens will be using.

I wonder if it's taken them this long to announce this projector (originally rumored in May), because it took a while for Huawei to get its production up for chips supporting screens and such
 
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tokenanalyst

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Xpeng G9 launched, list of new models equipped with silicon carbide in September​


The new G9 relies on the Fuyao architecture. Based on the standard intelligent driving and global 800V high-voltage silicon carbide platform, it is equipped with the ultimate design concept of domain control intelligent chassis, making the G9 in intelligence and performance. , comprehensive innovation in the "three energy strategies" of electric energy.

When the old G9 was first launched last year, it was the first mass-produced car in China based on the 800V silicon carbide platform. The new car is also equipped with an 800V high-voltage silicon carbide platform, which can quickly charge within the power range of 10%-80% in only 20 minutes. The maximum peak power is 315KW. Why can Xpeng G9's 800V high-voltage silicon carbide platform achieve such fast charging life? Today we will talk about the 800V high-voltage platform using silicon carbide devices. Aibang has newly established a WeChat group for the silicon carbide power semiconductor industry chain, and welcomes industry friends from silicon carbide front-end materials and processing equipment, back-end device production and module packaging to join the discussion .

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tphuang

tphuang

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another article pointing to YMTC fully booked for 6 months next year. I assume this source, but I'd take this as the source being pretty good

Which also to me means YMTC capacity unlikely to change much in first half of next year and that it's growth in Fab 2 most likely start in middle of the year. Maybe it's needs to do more validation of domestic tools + ASML thru the full process.

Now if you remember the AMEC slides, there was more items where DRAMs need customer validation. That to me indicates domestic + ASML to be operational at end of next year. Now, CXMT is not only entity list, so maybe it can still expand a little w/ American tools. Maybe @hvpc can guess us a rough idea here.

And my guess is that 14nm logic using domestic tools + SML gets validated first. It just seems to me that specially for etching tools, the requirement for 1x DRAM is higher than 14nm logic
 
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OppositeDay

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tphuang said:
View attachment 119058

LeTV will be unveiling new projector on 25th. The entire series will be using Hisilicon chip. Unclear if this will be using V811 or something else. But given the same date as Huawei unveiling, I get the sense that it will use the same chip that the Huawei screens will be using.

I wonder if it's taken them this long to announce this projector (originally rumored in May), because it took a while for Huawei to get its production up for chips supporting screens and such
Click to expand...

Speaking of projectors, are there domestic alternatives to TI's DMD chips? I assume TI has a big patent wall around it but some important patents must already have expired right? Are DMD chips manufactured in a way similar to normal chips?
 
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tokenanalyst

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With an investment of 240 million yuan, Nantong Weiteng Semiconductor Special Materials Project started construction​

Nantong Weiteng Semiconductor shows that the project plans to invest a total of 240 million yuan, with a new factory building and ancillary buildings of 34,000 square meters. The project is expected to reach full production in 2026, with an annual output of 1.2 million wafer-level dicing knives.
In 2021, Nantong Weiteng settled in Rugao. It focuses on providing supporting products and services for precision cutting processes such as various IC wafers, optical devices, and various sensors. The DZY dicing knife developed and produced can achieve dicing within 15 microns. The ultra-thin thickness and product performance have reached the level of similar foreign products, filling the domestic gap in the application of ultra-narrow dicing wafers.

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