Chinese semiconductor industry

tokenanalyst said:

YMTC CEO was who said "That fair thing is to US companies to buyback the tools" and Gina said " they have the ability to shutdown China semi industry". SMIC had found workarounds to the restrictions and that has huge implications for the entire semiconductor industry and if they are using mostly domestic tools? is over.

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Mainland memory chip leader Yangtze Memory reportedly seeks to replace U.S. components in manufacturing equipment

According to the South China Morning Post, citing two people familiar with the matter, mainland memory chip leader Yangtze Memory is establishing closer relationships with domestic equipment manufacturers and seeking to replace American parts in its manufacturing equipment.

According to sources, Yangtze Memory has recently deepened cooperation and discussions with mainland semiconductor production equipment manufacturers, including a large enterprise based in Beijing, to develop and produce products used to replace the U.S. Lam Research (LRCX.US) -10.500 (-1.652%) key components for manufacturing.

Since October last year, Lam Research has stopped supplying to China due to the new round of U.S. export restrictions on the semiconductor industry.

Reports indicate that many semiconductor production equipment require regular maintenance and replacement. Among those that need to be replaced are electrostatic wafer holders (ESCs), which use electrostatic attraction to hold wafers in place during multiple production processes.

據報內地記憶芯片龍頭長江存儲尋求置換製造設備中的美國零部件

據《南華早報》引述兩名知情人士指，內地記憶芯片龍頭長江存儲正與國內設備生產商建立更緊密關係，尋求置換其製造設備中的美國零部件。

消息稱，長江存儲近期與內地半導體生產設備商深化合作及討論，包括一家以北京為基地的大型企業，以開發及生產用於置換由美國Lam Research(LRCX.US) -10.500 (-1.652%) 製造的關鍵零部件。

自去年10月起Lam Research因為美國新一輪針對半導體行業的出口限制，停止向中國供貨。

報道指，許多半導體生產設備需要定期維護及置換。當中需要置換的包括靜電式晶圓座(ESC)，在多個生產過程中利用靜電吸附力來固定晶圓。

Link:

Huawei announced Atlas 900 SuperCluster.
The Atlas 900 SuperCluster comes packed with Huawei's state-of-the-art Xinghe Network CloudEngine XH16800 switch. With high-density 800GE ports, the SuperCluster's two-layer switching network can connect up to 2,250 nodes per cluster – equivalent to 18,000 NPUs – without oversubscription.

以三年为期，三年后你们会见证某流氓，如何搬起石头砸自己脚的

半导体比我想象的快这么多，有点牛批了

这趟上海没白来

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btw, this is from Huawei whisper. He is saying that China will catch up completely in 3 years and no more hiding needed and this exceeded his expectations

To me, someone in Shanghai must have told him EUV will likely be ready for production in 3 years.

I think this basically matches @latenlazy and my expectations right now.

LPP EUV seems to be progressing faster than what I expected

liospopo said:

Huawei announced Atlas 900 SuperCluster.
The Atlas 900 SuperCluster comes packed with Huawei's state-of-the-art Xinghe Network CloudEngine XH16800 switch. With high-density 800GE ports, the SuperCluster's two-layer switching network can connect up to 2,250 nodes per cluster – equivalent to 18,000 NPUs – without oversubscription.

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yeah, Atlas 900 is pretty great. In huawei's own presentations, it indicated that next gen Atlas 900 is superior performing to even H100 cluster

KYli said:

Huawei is back for providing security camera chips.

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this is part of it. They are going to be making chips for every sector. People should not be surprised. Also for things like security camera chips, they can probably fab it themselves once they get 28/40nm production going or they can work with SMIC

vincent said:

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China's exports of germanium and gallium products in August plunged to zero，customs data showed on Wednesday, due to new export controls on the two chipmaking metals.

Beijing exported no wrought germanium products last month, compared to 8.63 metric tons in July when volumes more than doubled from June as overseas buyers rushed to lock in supply ahead of the curbs.

There were also no exports of wrought gallium products in August. In July, exports were 5.15 tons and 7.67 tons in the same month in 2022, the data showed.

...

Permit applications take around 45 working days to process, said a Chinese germanium trader and a germanium producer, who declined to be named because of the sensitivity of the matter.

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let's see how this works out. I think they will allow permits to go through. The question is just how many. Certainly, there are political sides to this.

Huawei Ranks Second in the Chinese Smartphone Market with A 17% Sales Share​

Huawei captured the second position in the Chinese smartphone market with a sales market share of 17% during W36 (September 4th to September 10th), trailing only behind Honor (17.2%) by a mere 0.2%.

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shipment volume for the second half of this year being increased to 6 million units, a 20% increase. According to the supply chain, Mate 60 Pro has been ordered for a total of 15-17 million units.

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At least 6 million Kirin 9000s chips produced and delivered within this year. Impressive.

According to @hvpc, SMIC 7nm capacity is at 20K wpm right now....but maybe it will be more very soon. Ongoing localization efforts below 14/16nm currently are hidden behind the fog of war.

According to @hvpc, SMIC has enough ASML machines to reach 35K wpm when AMEC and NAURA will replace AMAT and LAM. If Huawei will really ramp up in this way, it means localization has been successful.

IGBT mounting and SiC module silver sintering equipment: Silicon Cool Technology​

Based on its own core underlying operation control algorithm technology, Silicon Cool Technology develops, produces and sells intelligent high-speed and high-precision patch equipment, serving leading customers covering power semiconductors, advanced packaging and other fields. The goal is to become a world-class, high-speed, high-precision and high-stability solution provider in the semiconductor multi-scenario packaging industry.



Fully automatic IGBT module placement equipment
Fully automatic IGBT module placement equipment has received tens of millions of orders from leading companies. Different from the traditional DIE BOND, in order to cater to the power semiconductor market, it is equipped with a more powerful BONDHEAD system, equipped with carrying modules for a variety of chip materials, and more intelligent materials/ The module conversion and human-computer interaction system realizes perfect adaptation to the placement work of various mixed materials in the industry. This product has wide applicability and its modular design can be flexibly configured according to customer needs. A single machine can process a variety of materials and can also be connected for production to meet customers' flexible deployment needs for production capacity.

◆ Equipped with high-precision BONDHEAD system, the accuracy can reach 7 u m
◆ Carrying module for various chip materials, perfectly adapted to placement of various mixed materials
◆ Modular customization according to customer needs, can be produced online
◆ Has received tens of millions of orders from leading companies



Fully automatic pre-sintering equipment
SW1000 breaks the European and American monopoly and enters mainstream car companies and leading silicon carbide IDM customers. It is the leading certified pre-sintering equipment in China. Supports silver paste and silver film processes. Adopting the latest Bond design, the production efficiency is 20% ahead of overseas competitors, and the maximum equipment accuracy can reach ±7um. It supports various forms of automatic loading and unloading of wafers, waffle trays, and tapes of various sizes, fully meeting the application scenarios of multiple materials.

◆ Supports silver paste and silver film processes to fully meet multiple material application scenarios
◆ Supports multiple loading methods of waffle tray, wafer and tape
◆ Equipped with high-precision BONDHEAD system, the accuracy can reach 7 u m

As usual, MSM is slow to understand significance. But at least I give props to FT for figuring out some basic stuff


they noted custom core based on HW experience with Server CPU as well as GPU and presence of its own NPU.

Of course, not understanding how much designing mini NPU could aid them in other aspects of AI chip development

Or as I said before, having your own GPU allows HW to get into desktop GPUs or other rendering focused GPUs in the future.

This is why i found the entire Kirin 9100 speculations quite ridiculous. Why would you design a new SoC when 9000S has not been widely used or tested? I've seen clips from LoongSon talking about all the testing & benchmarking they do in developing their ISA & cores. This is often a very long process. Data from Mate 60/5X usage will help them make improvements & refinement on next SoC

Are the usage of LAM or apploed

tphuang said:

As usual, MSM is slow to understand significance. But at least I give props to FT for figuring out some basic stuff

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they noted custom core based on HW experience with Server CPU as well as GPU and presence of its own NPU.

Of course, not understanding how much designing mini NPU could aid them in other aspects of AI chip development

Or as I said before, having your own GPU allows HW to get into desktop GPUs or other rendering focused GPUs in the future.

This is why i found the entire Kirin 9100 speculations quite ridiculous. Why would you design a new SoC when 9000S has not been widely used or tested? I've seen clips from LoongSon talking about all the testing & benchmarking they do in developing their ISA & cores. This is often a very long process. Data from Mate 60/5X usage will help them make improvements & refinement on next SoC

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9100 could have the same identical architecture but with a better production process or more cache on the chip.

Is it true that lam and applied material still know how the existing equipment on china are being used for?

pbd456 said:

Are the usage of LAM or apploed

9100 could have the same identical architecture but with a better production process or more cache on the chip.

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then it wouldn't be the same architecture anymore. More cache would require a larger die. 9000S was the best compromise they can find at the time. I don't know why all the fanboys are so eager for them to move away from that. Designing a new SoC with an older process take a lot of engineering & testing & benchmarking.

pbd456 said:

Is it true that lam and applied material still know how the existing equipment on china are being used for?

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i mean US companies stopped servicing SMSC since October. Since then, they have probably been able to get most of the tools to operate while subbing some with TEL equipment & some domestic equipments (in the cases where those tools break down or something)

Whether or not they have a fully de-americanized 14nm line by now is impossible for someone like me to know. But my guess has always been they get there by early 2024, since that's when the large NAURA order from May should have been delivered & the line with it fully tuned up. And SN2 operation start in probably late Q3.

As for last Q, that's a @hvpc question. I don't know to what extent they know, but I assume they will have some answers.

liospopo said:

Huawei announced Atlas 900 SuperCluster.
The Atlas 900 SuperCluster comes packed with Huawei's state-of-the-art Xinghe Network CloudEngine XH16800 switch. With high-density 800GE ports, the SuperCluster's two-layer switching network can connect up to 2,250 nodes per cluster – equivalent to 18,000 NPUs – without oversubscription.

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I wonder what else Huawei can't do