Chinese semiconductor industry

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supersnoop

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The indecision is palpable.

You'd expect under 'national security' premise that any yield >0% on small-scale unprofitable nodes <14nm to auto-trigger increasingly stricter sanctions, as even small-scale production can satisfy most military application imaginable.

But the cope is from a commercial -scale economic angle, which belies the constant moaning about stopping further military modernization. This strategy is incoherent and unmeasurable.

Most military chips in the US are fabbed at 90nm. No reason to think China would be drastically different.

There are no military considerations other than thinking at some distant point in the future. As I understand, radiation hardening (which many military chips are) becomes more difficult with smaller feature sizes. I am not an expert, so please correct me if I'm wrong.

The cope is purely political. Intel does not want new competition, same with Micron, same with Qualcomm. Commercially, they want to sell whatever they want to China because the demand is there. If a Chinese competitor comes up, then they will deal with it. However, with the US Government's divine intervention, it is not "if" but "absolutely yes" and with full state-backing. US private companies hate full state backing (for obvious reasons). Not only that, with the sanctions, you are fighting this with less revenue from China. It is not just an incoherent strategy, but almost the worst strategy. However, first Trump, now Biden administrations must look "tough on China" and so here we are.
 

siegecrossbow

General
Staff member
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Most military chips in the US are fabbed at 90nm. No reason to think China would be drastically different.

There are no military considerations other than thinking at some distant point in the future. As I understand, radiation hardening (which many military chips are) becomes more difficult with smaller feature sizes. I am not an expert, so please correct me if I'm wrong.

The cope is purely political. Intel does not want new competition, same with Micron, same with Qualcomm. Commercially, they want to sell whatever they want to China because the demand is there. If a Chinese competitor comes up, then they will deal with it. However, with the US Government's divine intervention, it is not "if" but "absolutely yes" and with full state-backing. US private companies hate full state backing (for obvious reasons). Not only that, with the sanctions, you are fighting this with less revenue from China. It is not just an incoherent strategy, but almost the worst strategy. However, first Trump, now Biden administrations must look "tough on China" and so here we are.

This is changing with the advent of AI though. I think F-35 TR 4 will start incorporating 28nm chips.
 

tokenanalyst

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Tuojing Technology: Good results and orders!​

As a leader in the domestic thin film deposition industry, Tuojing Technology's product lines include three series of plasma enhanced chemical vapor deposition (PECVD) equipment, atomic layer deposition (ALD) equipment and sub-atmospheric pressure chemical vapor deposition (SACVD) equipment. Products have been widely used in the production lines of mainstream domestic wafer fabs such as SMIC, Huahong Group, Yangtze Memory, Changxin Memory, Xiamen Lianxin, and Yandong Microelectronics.

According to recent surveys, the company's several major product lines have made varying degrees of progress. Among them, the ALD equipment series (including PE-ALD equipment and Thermal-ALD equipment, PE-ALD equipment) have achieved mass production and can deposit dielectric film materials such as SiO2 and SiN. The Thermal-ALD equipment has been shipped to different clients for verification. , can deposit Al2O3 and other metal compound films; SACVD and HDPCVD equipment have been industrialized.
In terms of the progress of hybrid bonding equipment, Tuojing Technology stated that its wafer-to-wafer bonding product (Dione 300) has passed customer acceptance and received repeat orders, and its chip-to-wafer bonding surface pretreatment product (Pollux) has Shipped to client for verification. The size of the bonding equipment market is currently difficult to quantify, and the potential market demand and future growth space are large.

Judging from the performance in the first half of this year, Tuojing Technology's revenue in the first half of the year was 1.004 billion, a year-on-year increase of 91.83%, and net profit was 125 million, a year-on-year increase of 15.22%. Tuojing Technology said that the company remains optimistic about the second half of the year. Currently, the factory is basically operating at full capacity and has full orders on hand. The specific order signing depends on customer demand.

In terms of production capacity, Tuojing Technology's headquarters in Shenyang has an annual production capacity of about 300-350 sets. The renovation of the first phase of Shanghai Lingang's R&D and industrialization base construction plant has been completed and put into use, and R&D and production-related work has begun. Shanghai Lingang The second phase of the R&D and industrialization base is under construction. Once completed and put into use, the company's total annual production capacity will approximately double.

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tokenanalyst

Brigadier
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Xintou Microelectronics Filter R&D and Production Headquarters Project has a capped total investment of 5.5 billion yuan​

on September 16, the capping ceremony of the Xintou Microelectronics Filter R&D and Production Headquarters Project was held grandly. It is reported that the project has a total investment of 5.5 billion yuan and is located in Anhui Province.
According to the official Weibo account of Xintou, on September 16, the capping ceremony of the Xintou Microelectronics Filter R&D and Production Headquarters Project was held grandly. It is reported that the project has a total investment of 5.5 billion yuan and is located in the High-tech Industrial Development Zone in Hefei City, Anhui Province. Construction will officially start in December 2022, and it is planned to be put into operation in 2024. In the initial stage of completion, the project will focus on RF filter design, R&D, and production business, giving full play to the advantages of internationalization and Hefei's integrated circuit industry cluster, and is committed to providing customers with high-performance, low-power consumption and high-reliability SAW products. After the project is fully completed, the clean room area of Class 1,000 and above and meeting the requirements of various anti-microvibration levels will exceed 20,000 square meters, which will effectively support the company's research and development, production and business expansion of various types of products.
 

horse

Colonel
Registered Member
Looks like Dylan Patel stuff is getting to US policy makers. Few weeks ago he made the comment that TSMC Arizona fab is effectively a Paperweight because the chips fabbed there would need to be taken to Taiwan for advanced packaging. Lots of western newspapers picked on his quote and have been running that story.

That is how influential this place this thread really is.

edit ...

Kudos, always, to the mod.

Take the high road.

:D
 
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tinrobert

Junior Member
Registered Member
That is how influential this place this thread really is.

edit ...

Kudos, always, to the mod.

Take the high road.

:D
Until SMEE introduces its <7nm node lithography system, ASML rules. Here's an article I just published on ASML taking over the lead from Applied Materials in 2023 global semi cap market. You can find it here:
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tphuang

Lieutenant General
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SSMB at Xiongan
View attachment 109655
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this article was from January regarding their new facility to be built in XiongAn

And then in March, looks like the construction started?
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here is another rundown on the project for SSMB. Looks like it started in 2017
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Tsinghua university published their entry on Nature back in 2021
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