Chinese semiconductor industry
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Just for some laughs.
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in case others don't get the joke. The second one is referring to the HEPS by Tsinghua
As for memory chips, i don't think it really matters whether or not YMTC is able to ramp up 232 layer production right now since they already have the technology. From what I hear, they aren't that far from domestic + ASML for it. Again, word from street. Take for what you will. Even if they can only expand 128-layer production next yr, the performance is fine based on reports others have done.
Bigger concern is with DRAMs. I would suggest that everyone keep their mouth shut about this, because Huawei will need to source a bunch from 3rd party here and use up its stash.
Well, it will be nice for CXMT to get to 1y node. It would be really nice if they can at least get de-americanized 1x working next yr. looks like AMEC at least have tools for everything now
As for memory chips, i don't think it really matters whether or not YMTC is able to ramp up 232 layer production right now since they already have the technology. From what I hear, they aren't that far from domestic + ASML for it. Again, word from street. Take for what you will. Even if they can only expand 128-layer production next yr, the performance is fine based on reports others have done.
Bigger concern is with DRAMs. I would suggest that everyone keep their mouth shut about this, because Huawei will need to source a bunch from 3rd party here and use up its stash.
Well, it will be nice for CXMT to get to 1y node. It would be really nice if they can at least get de-americanized 1x working next yr. looks like AMEC at least have tools for everything now
I have the feeling that both DRAM and NAND chips Huawei stockpiled in significant numbers, not to mention just recently the entire sector was in a significant slowdown so it was very cheap to buy a lot of the chips.
I remember just a few years ago, Huawei had a lot of Kirin chips stockpiled just before the sanctions hit, and Huawei was able to sell phones and other consumer wearables for a 1 year+.
Maybe domestic alternatives will be good enough for Huawei when the stockpiled chips finish. I have the feeling that NAND will be for sure available, not sure about DRAM.
I can’t imagine the sheer number of meetings they must have had as they designed, manufactured, and then started to market this thing.
I refuse to believe no one asked the question… wait what about the DRAM? I’m sure they have a fix for something this obvious, at least for the next 12 months.
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Dude is duious that SSMB-EUV can work, and he is really positive on Chinese semiconductor development.
this guy is good at following others account, but he doesn't have any personal sources.
From what I can see, Huawei already has the CMOS supply chain domesticated, but DRAM is clearly an issue here. Saying that CXMT has it figured out doesn't make it so
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