Chinese semiconductor industry

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olalavn

olalavn

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Interpretation of a solution for Huawei phase change memory

Note: Phase change memory, referred to as PCM (Phase Change Memory)

Structure and composition
PCM includes multiple phase change memory cells, each unit including an upper electrode, a lower electrode and two phase change layers between the two electrodes (as shown in the figure, the upper and lower structures, from the upper electrode to the lower electrode will pass through the two phase change layer, that is, the second phase change layer and the first phase change layer in the figure).

physical properties
·The cross-sectional area of the upper electrode < the cross-sectional area of the lower electrode
·The cross-sectional area of the phase change layer close to the upper electrode ≤ the cross-sectional area of the phase change layer close to the lower electrode
·The melting temperature of the phase change layer close to the upper electrode < the melting temperature of the phase change layer close to the lower electrode

Solution advantages
This solution can accelerate the crystallization process, effectively increase the phase change speed, and accelerate the storage writing speed.

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mrandolph

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hvpc said:
CXMT is still trying to work on offering the DDR5 and LPDDR5 DRAM for PC/mobile applications. They are far from offering HBM for more advanced applications like GPU. Huawei will not be able to officially acquire LPDDR5 for their iPhone until CXMT is able to produce e them in mass.
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If this is what it looks like: Huawei selling 20 mio. new 5G phones then this is also a sign that Chinese DDR5 chips are just around the corner. Otherwise Huawei would have designed around it using older or alternative RAM types.
 
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hvpc

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mrandolph said:
If this is what it looks like: Huawei selling 20 mio. new 5G phones then this is also a sign that Chinese DDR5 chips are just around the corner. Otherwise Huawei would have designed around it using older or alternative RAM types.
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No. It means Huawei is still between a rock and a hard place. Supply chain management, at least for memory chips, would be a challenge.
 
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measuredingabens

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hvpc said:
CXMT and YMTC are behind the memory leaders.

CXMT’s leading edge DRAM has about half the bit density of the current leading edge DRAM. CXMT offers only DDR4 and LPDDR4 while the big-3 of memory fabs offers DDR5, LPDDR5, GDDR6, and HBM3. LPDDR5 supports larger capacity at higher voltage while having way faster data rate than LPDDR4.

YMTC never mass produce the 232L 3D-NAND. Last October’s US sanction pretty put a stop to them pulling even or go ahead of the leaders. They are stuck producing mostly 128L 3D NAND UFS3.1 while others have all made more progress /pulled ahead producing 2xxL 3D NAND with UFS4.0. UFS4.0 is twice as fast as UFS3.1.

the faster and larger capacity DRAM and Flash offered by non-indigenous fabs are why Huawei had to use Hynix DRAM and Flash memory.

this may not be what people want to hear or wants to admit, but this is the reality we have to face at the moment.

CXMT is still trying to work on offering the DDR5 and LPDDR5 DRAM for PC/mobile applications. They are far from offering HBM for more advanced applications like GPU. Huawei will not be able to officially acquire LPDDR5 for their iPhone until CXMT is able to produce e them in mass.
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If this is the current situation, what is the status of YMTC's progress using domestic tools at the moment?
 
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hvpc

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measuredingabens said:
If this is the current situation, what is the status of YMTC's progress using domestic tools at the moment?
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The last heard, YMTC was pretty positive about the progress of qualifying domestic equipment. But their target completion date had been end of 2024, not sure if this means we can expect to pull in the completion target date or if it simply means we can meet the target. They are definitely more bullish on this front than CXMT on theirs.

progress update by Gerald Yiin of AMEC (that someone had shared on SDF) seemed to be consistent with what I heard from YMTC and CXMT.
mrandolph said:
So in couple of weeks they will go: "Oops. We are out of memory chips. Sorry about that. Sanctions are a bitch.".

Maybe. It is all speculation on my part.
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I’m sure Huawei will figure it out. I think it’s difficult for Huawei, but it’s definitely not impossible.

we got to trust Huawei’s capability to resolve this.
 
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