Huahai Chengke: Self-developed products such as granular epoxy plastic sealants can be used for fan-out wafer-level packaging
Huahai Chengke recently stated in an institutional survey that the main share of the domestic market in the field of high-performance epoxy plastic sealants is occupied by Japanese companies, and only a few domestic companies can achieve batch supply. Huahai Chengke's revenue from high-performance epoxy molding compounds accounts for more than 50% of its total revenue. Domestic substitution is gradually being realized.
In addition, Huahai Chengke said that the company's granular epoxy molding compound (GMC) can be used for HBM packaging. The relevant products have passed customer verification and are now in the sample delivery stage.
In terms of fan-out wafer-level packaging (FOWLP), Huahai Chengke said that FOWLP packaging began in the first decade of the 21st century. Because of its asymmetric packaging form, new requirements such as warpage control of epoxy plastic encapsulation materials have been put forward. , and at the same time, the epoxy molding compound is required to not show any delamination and maintain good electrical properties of the chip after a series of more stringent reliability assessments. At present, the granular epoxy molding compound (GMC) EMG-900-C product series and liquid molding compound (LMC) independently developed by Huahai Chengke can be used for fan-out wafer-level packaging.
An investor asked whether Huahai Chengke's business is involved in the optical module market. Huahai Chengke responded that optical modules are one of the core components of optical fiber communication systems. The packaging materials and packaging forms involved are relatively diverse. At present, Huahai Chengke does not have direct business dealings with companies in this field.
