You have a story for that? Haven't heard of us threats to Oppo
Chinese semiconductor industry
- Thread starter Hendrik_2000
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I feel that theory was just online rumor. I think the real reason is they couldn't get a good 5g modem working. Developing full features 5g soc isn't easy. I doubt Qualcomm would give them x70 modem
There's a joke story ^^
U.S: I will cut BBK's chip supply and GMS ... like Huawei
Oppo: ok I will dissolve team Zheku
US: ok good one
TBH, reading this, I kinda feel a bit of deja vu here.
That is, similar to the automotive industry in China - Only the strong-willed, exceptionally-innovative and determined-to-survive ones in the smartphone (or high-tech) industries (in-general) deserve to survive. Those weaker ones should be left to their own devices, i.e. either to be completely absorbed by the stronger ones, or be left to wilt and die in the abyss.
If other smartphone companies in China couldn't stand firm against the already long-anticipated pressure of sanctions and bans by the US&LC upon them like how the US&LC had treated Huawei for the last couple of years (mainly due to them being entirely dependent on the whims of the US&LC to survive, and/or being reluctant to innovate and transform in order to adapt to newer, harsher realities), then there should be no place left for them after the storm has passed.
Only those who can survive in the Chinese market on their own will and brute can thrive overseas and then worldwide. China doesn't need zombie companies to sap away precious investment fundings and government support, such as those in Japan after their bubble burst in the early-1990s.
Shengmei Shanghai: Currently, two ALD products have entered client verification
Shengmei Shanghai disclosed the latest research minutes saying that ALD is indeed a trend in future technological development. In particular, the company pays more attention to furnace tube ALD, mainly because of its large output and can produce at least 50 or 100 pieces at the same time. Even more, the craft is broader. However, the difficulty is also relatively high, mainly because it is difficult to control uniformity and chemical carriers. ALD is widely used in storage, advanced manufacturing processes, etc. At present, the company has two products that have entered client verification.
In the future, the company will compete in the market through differentiated technical products. For example, in terms of furnace tubes, the company has a special furnace tube design to improve ALD in terms of uniformity, granularity and usage efficiency. While the company's ALD products continue to expand the domestic market, it also attaches great importance to the international market. It hopes to introduce the company's differentiated furnace tube ALD technology to foreign customers, so the company is doing it both at home and abroad.
Regarding cleaning equipment, Shengmei Shanghai said that three years ago, the company's cleaning equipment mainly focused on single-chip equipment. In recent years, as the company has continued to invest in research and development of trough equipment, the company's trough equipment has basically achieved full process coverage at this stage, including cleaning, degumming and some more advanced trough equipment for 3D packaging.
He further pointed out that in the future, the company will maintain two-way development and develop supercritical CO2 drying and cleaning while expanding single-chip equipment. This technology is currently owned by only three companies in the world, and the company has independent IP and unique technology that can save 40% of CO2 usage. In the future, the company will promote this equipment to the domestic and international markets, especially CO2 drying and company mega. The combination of sonic cleaning equipment can clean small structures without damaging them and dry them at the same time.
The Track device was launched at the end of last year and is currently making good progress. However, since it is the first device, there are some common problems in the early verification process. The Shengmei Shanghai team is actively working with customers and cooperative manufacturers to solve these problems.
In terms of PECVD equipment, Shengmei Shanghai has also made a lot of progress in joint research and development with clients, and some basic problems have been solved. He said that the company will consider two types of customers in the future, one is logic circuits and the other is storage. At the same time, the company's PECVD equipment has a characteristic that is different from the world's first-class equipment structure. Therefore, in the future, the company will use the company's differentiated technology in PECVD to meet the higher requirements of customers and achieve a balance in uniformity, granularity, film stress and output
Regarding the company's Lingang project, Shengmei Shanghai said it is currently divided into two parts. The first production plant is currently the focus and should be put into trial production before the year. The project will be fully constructed by the end of the year, including the R&D laboratory, second production plant, etc., which will be put into use one after another.
In addition, a R&D clean room will be renovated this year and is expected to be put into use in the first quarter of next year. In this way, the company will have a clean room of the same level as the client, which will greatly improve the company's R&D conditions. Some new products and improved technologies can be sent to clients after verification by the company, and the progress of research and development will be greatly enhanced.
Sir will Huawei let OPPO and Xiaomi use its Kirin chip?
they have their own chip R&D team...
AssassinsMace
Lieutenant General
Wrong thread.
They just made up that 50% number.
If you go back in this forum, I predicted this phenomenon earlier. A lot of people in the industry think the same. The problem is the prices has been increasing fast for the last 10 years. And benefits has been decreasing. The days you got 120% higher performance per Watt for less cost per 1000 gates are long gone. Every node from this point require a major change either in materials, equipment, architecture, transistor shape, etc...
At some point new nodes will become hard to justify monetarily. Not all customers have to shy away. Research and fab construction for new nodes became incredibly expensive. Breaking even will require more and more customers, whose numbers will be decreasing. This is BTW what happened with 450 mm wafers. Nobody wanted to fund it so the tech never emerged. SME manufacturers had prototypes but fabs didn't want to fund it.
We are actually still quite far away from physical limits but economics is an hard limit too. A lot of people say it will be economics which will stop further miniaturization, and I agree with them.
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