Chinese semiconductor industry

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olalavn

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Anh chàng này có đáng tin cậy ở đâu không, hay anh ta chỉ đang bắt nạt? Khẳng định rằng Trung Quốc sẽ không chỉ giới thiệu mà còn thương mại hóa XRL trong 10 năm tới để nối tiếp EUV, v.v.

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jfcarli

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Kirin 9000s reveals SMIC can mass produce commercial 7nm chips. Having released the Huawei Mate 60 family without any publicity whatsoever and specially during Gina Raimondo's "visit" to China was a master marketing stroke and a furious slap in the face of the US sanctions.

This has profound geopolitical repercussions and I am pretty sure Huawei got the green light from very high up to let Huawei slap the US in the face.

One can expect fierce reaction from US and friends, possibly forbidding any DUV supplies by ASML to China.

I don't think Huawei would risk such a reaction from the "West" UNLESS China is now capable of mass producing litography machines, at least as good as ASML's 28nm.

It is amazing how quiet SMEE and AMEC have been regarding their achievements.

28nm already accounts for most of the $$$ in chip manufacturing. If you include 14 and 7nm in your manufacturing weapons cartridge, specially if you advance even further with 3D stacking, I am pretty confident China can bankrupt most of the "Western" chip companies by flooding the market with cheaper chips within the next 10 years.

It won't be long before China will do to chips what it did to solar panels.
 

Schmoe

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Kirin 9000s reveals SMIC can mass produce commercial 7nm chips. Having released the Huawei Mate 60 family without any publicity whatsoever and specially during Gina Raimondo's "visit" to China was a master marketing stroke and a furious slap in the face of the US sanctions.

This has profound geopolitical repercussions and I am pretty sure Huawei got the green light from very high up to let Huawei slap the US in the face.

One can expect fierce reaction from US and friends, possibly forbidding any DUV supplies by ASML to China.

I don't think Huawei would risk such a reaction from the "West" UNLESS China is now capable of mass producing litography machines, at least as good as ASML's 28nm.

It is amazing how quiet SMEE and AMEC have been regarding their achievements.

28nm already accounts for most of the $$$ in chip manufacturing. If you include 14 and 7nm in your manufacturing weapons cartridge, specially if you advance even further with 3D stacking, I am pretty confident China can bankrupt most of the "Western" chip companies by flooding the market with cheaper chips within the next 10 years.

It won't be long before China will do to chips what it did to solar panels.
"I don't think Huawei would risk such a reaction from the "West" UNLESS China is now capable of mass producing litography machines, at least as good as ASML's 28nm"
I have had the same reaction and wonder how many ASML lithography machines are now scheduled but pending delivery or final installation. Not waiting for these machines to be delivered or installed would be incredibly short-sighted, and unlike the US, China rarely makes impetuous decisions.
There was a recent comment that SMEE's DUVi is close to 2000i performance metrics and that workbench issues were resolved. If that was true, that would partially explain this. But what about photoresists?
 

tokenanalyst

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It is amazing how quiet SMEE and AMEC have been regarding their achievements.
SMEE? Yes.
AMEC? They have been pretty vocal of their achievements as you can read in this thread, they are a stock company so they have an incentive.

Zhongwei Company launched a 12-inch thin film deposition equipment!​


Recently, AMEC Semiconductor Equipment (Shanghai) Co., Ltd. (hereinafter referred to as "AMEC", Shanghai Stock Exchange Stock Code: 688012) launched the self-developed 12-inch low-pressure chemical vapor deposition (LPCVD) equipment Preforma Uniflex™ CW. This is a new breakthrough made by China Microelectronics in the field of semiconductor thin film deposition, which has been deeply involved in high-end micro-processing equipment for many years, and it is also a new momentum to realize the diversified growth of the company's business.

As a 12-inch LPCVD equipment with high output efficiency and excellent performance independently developed by AMEC, Preforma Uniflex™ CW can flexibly configure up to five double reaction chambers (ten reaction chambers), and each reaction chamber can process simultaneously Two wafers, while ensuring lower production costs and chemical consumption, achieve higher production efficiency.

Preforma Uniflex™ CW, as an LPCVD equipment independently developed by AMEC, is equipped with an optimized gas mixing solution and heating stage with completely independent intellectual property rights. It has excellent film uniformity, filling ability and process adjustment flexibility. Large wafers, it also has good process capabilities. And its excellent step coverage and filling ability can meet the application requirements of filling contact holes and metal tungsten lines in advanced logic devices, DRAM and 3D NAND.

The Preforma Uniflex™ CW launched by AMEC is another milestone in the company's road to innovation. "This LPCVD equipment not only has complete and independent intellectual property rights, but also created a new record for the speed of research and development of new equipment in China Microelectronics." Said Tao Heng, Vice President of China Microelectronics Group, General Manager of LPCVD Product Department and Public Platform Engineering Department: "Since the establishment of this LPCVD equipment research and development project, we have completed product design, production prototype development and laboratory evaluation in less than half a year, and have successfully imported it to the client for production line approval."

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tphuang

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SMEE? Yes.
AMEC? They have been pretty vocal of their achievements as you can read in this thread, they are a stock company so they have an incentive.


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yeah, AMEC is public company and is the most vocal about their successes

some note from research on them
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CCP 刻蚀设备。在逻辑器件方面,公司 CCP 刻蚀设备在 5 nm 及以下芯片生产线 实现批量销售。在存储器件方面,公司 CCP 刻蚀设备在 3D NAND 生产线被广泛应用,通 过了多个动态存储器的工艺验证并取得重复订单。2022 年,公司共付运 475 个 CCP 刻蚀设 备反应腔,同比增长 59%。
ICP 刻蚀设备。公司的 ICP 刻蚀设备涵盖 7nm 及以下的逻辑芯片、17nm 及以下的 DRAM 芯片和 3D NAND 存储芯片的刻蚀应用,已在超过 20 家客户的生产线上进行了 100 多个工艺验证。8 英寸和 12 英寸深硅刻蚀设备在晶圆级先进封装、2.5 维封装和微机电系 统芯片生产线等市场取得重复订单。300mm 的 3D 芯片的硅通孔刻蚀设备已验证。
says here for ICP, it's being used in 17nm and under DRAM processes. I assume it must have entered samsung & SK supply chain

LPCVD 设备。2023 年公司推出 12 英寸低压化学气相沉积设备 Preforma UniflexTM CW,可满足先进逻辑器件、DRAM 和 3D NAND 中接触孔以及金属钨线的填充应用需求。
looks like its LPCVD product also met requirements

Its CCP product can be used in 5nm logic process and 200+ layer 3D Nand process
 
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