Chinese semiconductor industry

the 25th China Integrated Circuit Manufacturing Annual Conference and Supply Chain Innovation and Development Conference

"Microsystem Reliability Design Based on Chip Integration Technology".

The 58 Institute has a platform for the entire industrial chain in the field of integrated circuits, including a 7-nanometer design platform, a 65-nanometer mask platform, a national ceramic packaging center, a microsystem center line, etc., and has rich experience in the microsystem field. It has successively established 8-inch and 12-inch mid-way lines, and released the PDK of wafer-level fan-out packaging. A service platform for testing reliability, including 3D X-ray testing, scanning acoustic microscopy testing, etc.

A team from Tianjing University created the world's first "multi-bind multi-standard 5.5G/6G mmWave fused chip module".

In the relevant fields, members of this team has published 15 articles on the top journals so far. The team has 16 patents granted or pending in China, one in the US. They have incorporated in Aug, 2023 to turn this R&D into commercial products.

天津大学成功研发5.5G/6G多频段多标准兼容毫米波芯片套片​

日前，天津大学微电子学院博士生创业团队“芯灵科技团队”成功研发高性能5G多频段多标准兼容毫米波芯片套片。该芯片套片国际上率先实现多频段多标准融合，实现5.5G/6G国际通信标准中主流通信的多频段多标准覆盖（n257/n258/n259/n260/n261）。在相关研究领域，团队成员已发表国际权威期刊15篇，已授权或受理中国发明专利16项、美国发明专利1项。

5G通信正成为人们生活重要组成部分，面向未来5.5G/6G基站和手机而言，高速率、高容量、低延时的毫米波芯片是不可或缺的技术“心脏”，其巨大的市场前景引起了业界广泛的布局和投入。然而，目前我国毫米波芯片大多依赖国际进口，国际主流毫米波芯片无法满足全频段覆盖、仅能覆盖全部5个频段中的1-2个，这导致毫米波通信大带宽大容量的优势无法充分发挥、极大限制了毫米波相关产业的发展和演进。因此，研制出一种低成本、高性能且多频段覆盖的国产毫米波芯片，将对我国通讯、基建等国计民生领域具有重大意义。

天津大学微电子学院博士生创业团队“芯灵科技团队”基于标准商用硅工艺，成功研制高性能5.5G/6G全频段毫米波芯片套片。该芯片套片突破多项关键技术：如2倍/3倍频率可重构注入锁定倍频器技术，在相同注入功率情况下，该倍频器的锁定带宽、输出功率、面积以及谐波抑制等指标均处于国际领先水平，相关研究成果发表在《IEEE固态电路学报》（IEEE Journal of Solid-State Circuits, JSSC）上；再如基于变压器的并联-串联混合型负载调制的功率放大器技术，相比主流的毫米波CMOS功率放大器芯片，该设计在更加紧凑的尺寸下，获得了更高的线性输出功率和更高的功率回退效率，相关研究成果发表在微电子学与集成电路领域国际顶级会议ISSCC（IEEE International Solid-state Circuits Conference）上。

“芯灵科技团队”是一支长期致力于研发射频毫米波芯片与微系统的团队，依托马凯学教授牵头的“天津市成像与感知微电子技术重点实验室”和天津国家芯火双创平台，完成科研成果转化。核心成员由来自天津大学与电子科技大学的三名博士和七名硕士及企业辅助团队组成，拥有7年以上的集成电路研发、设计、量产与管理经验积累，已推出多款芯片系列产品与整体解决方案。团队已经在2023年8月份注册成立公司，将以更加企业化、标准化、流程化的方式完成科研到产业落地转化。

“这一系列引领性技术创新和研发成果，将有助于我国在5.5G/6G毫米波通信领域摆脱依赖进口的局面，以国际引领的多频段多标准融合技术优势和芯片套片实现从跟跑到领跑的突破。”据团队学生负责人王志鹏博士介绍，“我们团队将通过持续的技术创新引领国内外低成本高性能毫米波通信集成电路产业的发展，大力推动各类毫米波通信射频芯片的国产化，为未来毫米波应用领域提供更多可能性。”

from huawei whisper

华为这次发布会除了手机之外，可能还会有新款耳机，新手表，新平板和新智慧屏这些。

如果有这些新产品，大家记得准备好钱包，可能都是你们想要的

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aside from 5g phone, also expect new ear bud, watch, pad & smart screen

All things that require new kirin chips, RF chips/modules. So much additional business for local fabs

People outside of China are just not getting it

SanWenYu said:

A team from Tianjing University created the world's first "multi-bind multi-standard 5.5G/6G mmWave fused chip module".

In the relevant fields, members of this team has published 15 articles on the top journals so far. The team has 16 patents granted or pending in China, one in the US. They have incorporated in Aug, 2023 to turn this R&D into commercial products.

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天津大学成功研发5.5G/6G多频段多标准兼容毫米波芯片套片​

日前，天津大学微电子学院博士生创业团队“芯灵科技团队”成功研发高性能5G多频段多标准兼容毫米波芯片套片。该芯片套片国际上率先实现多频段多标准融合，实现5.5G/6G国际通信标准中主流通信的多频段多标准覆盖（n257/n258/n259/n260/n261）。在相关研究领域，团队成员已发表国际权威期刊15篇，已授权或受理中国发明专利16项、美国发明专利1项。

5G通信正成为人们生活重要组成部分，面向未来5.5G/6G基站和手机而言，高速率、高容量、低延时的毫米波芯片是不可或缺的技术“心脏”，其巨大的市场前景引起了业界广泛的布局和投入。然而，目前我国毫米波芯片大多依赖国际进口，国际主流毫米波芯片无法满足全频段覆盖、仅能覆盖全部5个频段中的1-2个，这导致毫米波通信大带宽大容量的优势无法充分发挥、极大限制了毫米波相关产业的发展和演进。因此，研制出一种低成本、高性能且多频段覆盖的国产毫米波芯片，将对我国通讯、基建等国计民生领域具有重大意义。

天津大学微电子学院博士生创业团队“芯灵科技团队”基于标准商用硅工艺，成功研制高性能5.5G/6G全频段毫米波芯片套片。该芯片套片突破多项关键技术：如2倍/3倍频率可重构注入锁定倍频器技术，在相同注入功率情况下，该倍频器的锁定带宽、输出功率、面积以及谐波抑制等指标均处于国际领先水平，相关研究成果发表在《IEEE固态电路学报》（IEEE Journal of Solid-State Circuits, JSSC）上；再如基于变压器的并联-串联混合型负载调制的功率放大器技术，相比主流的毫米波CMOS功率放大器芯片，该设计在更加紧凑的尺寸下，获得了更高的线性输出功率和更高的功率回退效率，相关研究成果发表在微电子学与集成电路领域国际顶级会议ISSCC（IEEE International Solid-state Circuits Conference）上。

“芯灵科技团队”是一支长期致力于研发射频毫米波芯片与微系统的团队，依托马凯学教授牵头的“天津市成像与感知微电子技术重点实验室”和天津国家芯火双创平台，完成科研成果转化。核心成员由来自天津大学与电子科技大学的三名博士和七名硕士及企业辅助团队组成，拥有7年以上的集成电路研发、设计、量产与管理经验积累，已推出多款芯片系列产品与整体解决方案。团队已经在2023年8月份注册成立公司，将以更加企业化、标准化、流程化的方式完成科研到产业落地转化。

“这一系列引领性技术创新和研发成果，将有助于我国在5.5G/6G毫米波通信领域摆脱依赖进口的局面，以国际引领的多频段多标准融合技术优势和芯片套片实现从跟跑到领跑的突破。”据团队学生负责人王志鹏博士介绍，“我们团队将通过持续的技术创新引领国内外低成本高性能毫米波通信集成电路产业的发展，大力推动各类毫米波通信射频芯片的国产化，为未来毫米波应用领域提供更多可能性。”

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big deal imo. So China started late on 5G modem & mmw module. Maybe that won't the case for 5.5G/6G RF technology

ansy1968 said:

Translation: We're screwed!

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Article says Chinese firms are still buying from them though, so not sure how they are screwed?

The National Nano Center of the Chinese Academy of Sciences has made progress in the study of the anomalous transport mechanism of monolayer COF membranes​

In recent years, mechanically stimulated ion transport in artificial nanopores has attracted much attention due to its similarity to the mechanoresponsiveness of biological ion channels. At present, pressure-responsive ion channels focus on one-dimensional carbon nanotubes, two-dimensional nanoslits and single nanopores on single-layer graphene membranes. These nanoflow membrane material systems have low ion fluxes due to low pore density or long transport channels. Therefore, on the basis of electric field-driven ion transport, external mechanical pressure leads to an increase in transmembrane ion conductance. On the contrary, due to the difficulty of preparing nanofluidic membranes with both high pore density and short transport paths, kinetic-electrical coupling-driven ion transport in nanofluidic membranes with ultrahigh ion flux has not been reported.

The team explored the ion transport behavior in covalent organic framework monolayer membranes with ultrahigh permeability. The study found that the high pore density and molecular-level thickness of monolayer COF membranes lead to low membrane resistance and excellent ion and water permeation properties, which distinguish them from long nanotubes, gaps, and single nanopores in graphene. This study reveals a novel pressure-induced decrease in transmembrane current independent of external electric field and mechanical pressure. Poisson-Nernst-Planck simulation and calculation results show that, on the one hand, the ultra-high ion and water flux of the monolayer COF membrane greatly reduces the accumulation of ions on the left and right sides of the membrane due to the capacitive effect driven by the electric field On the other hand, the external pressure drives the water flow movement, so that the capacitance layer on the surface of the COF membrane is quickly dissipated. After that, the pressure mainly drives the transmembrane transport of negative (positive) ions in the electric double layer on the surface of the positive (negative) electrode, and the resulting fluid The direction of the current is opposite to that generated by the electric field-driven ion transport. When the two are superimposed, the total transmembrane ion current is lower than the transmembrane ion current generated by the pure electric field drive, showing the effect of pressure "turning off" the ion transport across the COF membrane. This phenomenon is due to a new coupling mechanism between the electric field and external pressure caused by the ultrahigh permeability of the COF monolayer membrane. This study provides a new model for the regulation of membrane conductance by mechanical pressure, which is expected to be applied in the development of smart ionic devices.

Michael90 said:

Article says Chinese firms are still buying from them though, so not sure how they are screwed?

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The article also said that restrictions had been imposed, so you have to pierces thru the double speak to understand that they're in serious trouble.

More on Sanan/ST Micro deal
This we already know about the planned expansion to 10k wpw of 8-inch SiCs

项目在取得各项手续批复后开始建设，2025年完成阶段性建设并逐步投产，2028年达产，规划达产后生产8英寸碳化硅晶圆10000片/周。

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There was a deal signed with Hunan Sanan to supply 8-inch substrate for the JV, solely operated by Sanan itself. Long term production agreement. The 2 side will jointly promote Sic Modules in China market and this allows Sanan to become a dedicated Sic Wafer foundry

为满足该合资厂的衬底需求，三安光电也将利用自有SiC衬底工艺，单独建造和运营一个新的8英寸SiC衬底制造厂。合资公司将与湖南三安签订长期碳化硅衬底供应协议，以保证合资公司未来材料的工艺需求。

三安光电首席执行官林科闯表示，该合资厂的成立将有力推动SiC器件在中国市场的广泛采用。三安此次还将新建一个SiC衬底工厂，这是三安光电朝着成为SiC专业晶圆代工厂这一目标迈出的重要一步。

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Aside from that

三安光电还表示，公司碳化硅各环节业务顺利推进，衬底已通过几家国际大客户验证，其中一家实现批量出货，且2023年、2024年供应已基本锁定。

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Sanan already has its Sic substrate validated with several major international customers and have started delivery to 1. Has supply agreement for 2023/2024 locked down

公司的碳化硅MOSFET代工业务已与龙头新能源汽车及配套企业展开合作，并与某知名车企签署芯片战略采购意向协议总金额达38亿元。已签署的碳化硅MOSFET长期采购协议总金额超70亿元。

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for its own MOSFET foundry, it has been working with NEV companies and signed long term agreement for 3.8B RMB with an automaker & has SiC MOSFET long term purchase agreement for 7B RMB


From

碳化硅产能 15,000 片/月，硅基氮化镓产能 2,000 片/月。
湖南三安实现销售收入 5.82 亿元，同比增长 178.86%。 湖南三安作为中国本土为数不多的碳化硅产业链垂直整合制造平台，产业链包括长晶生长—衬底 制作—外延生长—芯片制备—封装测试。6 吋碳化硅衬底已通过数家国际大客户验证，并实现批 量出货，未来两年产能已基本锁定，8 吋衬底已实现小批量试制。

其中，碳化硅二极管累计出货量持续领跑 行业，650V 20A 可靠性数据已经达 6000h，已迭代推出第四代高性能产品，通过车规认证的产品 正持续出货。碳化硅 MOSFET 1200V 及 1700V 系列产品，包含 80mΩ/32mΩ/20mΩ/16mΩ/1Ω，产 品在比导通电阻特性、击穿电压特性和阈值电压稳定性上的表现行业领先;80mΩ 产品已在光伏 及车载充电机客户端导入批量订单;车规级 1200V 16mΩ 已在数家战略客户处进行模块验证，预 计于 2024 年正式上车量产。

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current production is 15k Sic wpm and 2k GaN wpm
it has full vertical supply chain from susbstrate, to epitaxy to chip production to packaging. 6-inch substrate has been validated with multiple foreign customer base with 2 years production locked down. 8-inch wafers started low rate production

1200V SiC module being tested with multiple strategic customers. Will start mass production for EVs in 2024. I wonder who the customers are. But looks like their produce has passed auto grade.

So yeah, Sanan is becoming a big player here. More importantly. it would seem like Chinese SiC substrate makers are really doing well.

From

8月10日，德龙激光在上证e互动平台表示，公司开发的碳化硅晶锭激光切片技术已完成工艺研发和测试验证，并取得头部客户批量订单。晶升股份也表示，公司未来将有新的产能释放，目前已具备年产100台及以上碳化硅设备的能力。

某市值200多亿元的半导体材料制造商表示，目前下游应用领域对碳化硅的需求保持强劲增长趋势，公司下游客户扩产规划明确，带动对公司产品需求的长期持续增长。

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Delong has developed Sic crystal laser cutting tech and has it validated with customer mass orders

Crystal growth said it can produce 100+ SiC furnaces per year

Michael90 said:

Article says Chinese firms are still buying from them though, so not sure how they are screwed?

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Because they are stockpiling Japanese tools, buying to stop buying in the near future.

Other interesting details from Sanan mid year report that I missed

砷化镓射频产能为 15,000 片/月，能够为客户提供高品质的 HBT、pHEMT 等先进工艺芯片 代工服务，可覆盖频段已延伸至 Ka 频段，客户是中国本土主要设计公司。

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so currently 15k wpm of capacity for HBT, phemt chips. HBT is used for power amplifier in RF (like phones, cell towers and such)
pHEMT is needed for LNAs in phones (low noise amplifier)
Looks like just providing this for domestic fabless

if you look at this article. Basically GaA is ideal for 5G phones at the moment. Nothing else can really replace it. GaN is deal for 5G base stations. Again, Si-LDMOS is only possible 2G-4G due to restriction of 3.5GHz

Domestic players in PA

目前国产企业中，从事手机PA的公司有唯捷创芯、昂瑞微、飞骧科技、锐石创芯、紫光展锐、芯朴科技。在基站PA领域有至晟微、安其威微、华泰、明夷、芯百特等国产企业。

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see this is what Westerners think

Harz said his Chinese suppliers were providing authorities with data needed to obtain export licences.

They have estimated that deliveries will stop when the export controls take effect on Aug. 1 and resume about a month later when licence requests have been processed, though no reliable information is available.

Harz does not believe that China will disrupt gallium trade flows over the next few years because that would quickly damage its own electronics industry.

The CEO added he viewed China's move for now as "sabre rattling", because the world's leading makers of power amplifiers, which boost radio signals so that smartphones can communicate with cell towers, are based in the United States.

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so basically this is why you see all these American companies say they will find other sources or they source elsewhere. They think that because they "own monopoly" over RFFE modules, China will let it through since Chinese phones still need RF modules from America. Let's see how this goes. How much can Chinese domestic suppliers produce and how tough China is willing to get on this. Freiberger has several months of wafers in storage. American companies themselves likely to have some too. So there is enough Gallium wafers out there for a year of supply even if China exports nothing. Let's see how hard they are willing to go here. Are they willing to block export to all American, Japanese & Dutch companies?

If you do this and domestic RF companies don't gain huge market share, it's a big failed policy.

From last year with Sana

根据三安光电此前披露的问询回复，2021年前三季度，因为设备转固后未全面通过下游客户认证，其射频板块的设计产能为90000片，实际产能46065片，产能利用率仅51.18%，产能相对于2020年的28406片大幅提升，但产能利用率却大幅下滑。

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so only 51% utilization from 10k wpm production in first 3 quarters of 2021 (maybe actually higher, who knows)

截至2021年第三季度末，三安光电射频板块产能为1万片/月。在年报中，三安光电明确表示，未来2-3年的时间是公司发展至关重要的时期，公司将聚焦集成电路业务的快速拓展，预计砷化镓射频产能将扩充到3万片/月

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If they want to increase production to 30k wpm by Q3 2024, then they better ramp up that quickly to replace whatever Freiberger or other people loose out

立昂东芯方面，目前已建成7万片/年的产能并已实现批量出货。同时，公司在海宁基地有36万片/年的射频芯片产品（其中包括砷化镓射频芯片18万片/年、碳化硅基氮化镓芯片6万片/年、VCSEL芯片12万片/年）的规划布局，目前已经相关部门审批，将进入开工建设阶段。

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Another one is Hangzhou Lion electronics. They already have 70k wpy of GaA and look to add a new base with 180k wpy of GaA + 60k wpy fo GaN-on-Sic +120k wpy of VCSEL. They fab for others. I need to look into them a little more

But it looks like there are enough domestic players to ramp up production. Question is how Chinese govt wants to go here.

Back on Sanan

滤波器产能为 150KK/月，主要发展 SAW 的技术路线，产品覆盖中国本土及海外所需频段滤波器、 双工器、多工器，双工器小型化进度行业领先，Band 1+Band 3 四工器性能达行业前沿水平，为 国内首个能够提供 Phase V NR 架构所需的全套四工器和双工器产品的企业，主要客户包括闻泰、 龙旗、日海、曜佳、移远、富士康、合宙等。

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They also have capacity for 150 million SAW filters per month. Which could be use for 2G-4G, wifi, bluetooth and other things.

I've been researching into this, but curious to find out how much these foundries can fab and how much they can supply domestic RFFE companies?

who are the GaA players in China? Looks like these guys among non-CETC firms

三安集成、立昂微、福建福联、常州承

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Sanan, Lion electronics, Unicompound SemiconductCorporation, ChemSemi

ChemSemi
started production on a rf filter production line of 20k wpm earlier this year
Their GaA line produces 24k GaA wafers per year. so not a lot

These are the power amplifier suppliers

除业绩下滑外，在供应链安全及价格等因素考量下，飞骧科技、慧智微、康希通信等国产PA厂商都在积极导入国产供应链。

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Lansus, Smart Micros, KxComtech (major Wifi Fem supplier)

actually KxComtech got big fast
from the look of this, it had revenue of 420m RMB in 2022, big jump from 80 million in 2020

and

目前，国内已经在PA方面得以突破，诞生了唯捷创芯、慧智微、飞骧科技、昂瑞微等优秀的PA厂商，但国内多数PA厂商尚不具备滤波器的设计和制造能力。

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Vanchip, Onmicros also on top of those 3

没有成熟的滤波器代工厂，使得以卓胜微为代表的国内射频前端厂商却纷纷开始自建产线，中芯宁波、中芯绍兴、赛微电子等MEMS代工厂也纷纷加大对滤波器产品的研发力度，同时这一市场空白也吸引了砷化镓代工厂的目光。

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Without mature RF filter foundry before, Maxend and other RFE companies worked to build production line with SMIC Ningbo, SMIC Shaoxing & Sai Micros. Key MEMS foundries