It says September and December quarter. That is Q3 and Q4. That means Huawei already stopped buying after Q2. Rather than a ban it looks like Huawei stopped buying on their own.
Chinese semiconductor industry
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It says September and December quarter. That is Q3 and Q4. That means Huawei already stopped buying after Q2. Rather than a ban it looks like Huawei stopped buying on their own.
of course. my guess is that huawei initiated this. Due to the scare earlier this year, it probably put in large QCOM orders through to be delivered by Q2. Now that it has a stash of QCOM's SoC + 4G modem and such. that's enough to last until it is able to design high end SoC
A few months ago, there was a lot of information that Huawei's 4G chips will be enough to use until the end of Q1 next year... next year, Huawei will launch their 5.5G chip...
Fuchuang Precision plans to invest overseas to set up factories to expand the scale of international business
Fuchuang Precision announced that the company intends to invest in the establishment of an overseas wholly-owned subsidiary, with a total investment of 44 million US dollars (about 316 million yuan), including the company's own or self-raised funds of no more than 25 million US dollars, and the rest Funded by the newly established subsidiary.
The announcement shows that the newly established overseas wholly-owned subsidiary intends to engage in research and development, production and sales of key parts and components of semiconductor equipment, global supply chain procurement business, and introduce high-end talents to support the development of the company and its subsidiaries.
Fuchuang Precision stated that it is conducive to further expanding the company's international business scale, broadening the company's product line, maintaining technological leadership, enhancing the company's profitability, deepening the stickiness between the company and international customers, improving the procurement capabilities of the global supply chain, and effectively improving the international market. Market share and the company's overall anti-risk ability.
Huawei announces latest chip packaging patent
It is learned from the enterprise search website that Huawei recently announced a patent titled "a chip package and a method for preparing chip package", and the application publication number is CN116547791A.It is understood that the embodiment of the application provides a chip package and a method for preparing the chip package, which is beneficial to improving the performance of the chip.
The patent abstract shows that the chip package includes a substrate, a bare chip, a first protection structure, and a barrier structure; the bare chip, the first protection structure, and the barrier structure are all disposed on the first surface of the substrate; the first protection structure Wrapping the side of the bare chip, the barrier structure wraps the surface of the first protection structure away from the bare chip, and the first surface of the bare chip, the first surface of the first protection structure and the first surface of the barrier structure are flush .
Wherein, the first surface of the bare chip is the surface of the bare chip facing away from the substrate, the first surface of the first protection structure is the surface of the first protection structure facing away from the substrate, and the first surface of the barrier structure is the surface of the barrier structure. The structure faces away from the surface of the substrate.
It is understood that as of 2022, Huawei holds more than 120,000 valid authorized patents. It is the company that ranks first in the number of patents granted by the State Intellectual Property Office of China and the European Patent Office in 2021/2022. The world's number one company.
In terms of research and development, Huawei's R&D expenditure in 2022 will exceed 160 billion, and the R&D expenditure in the past 10 years will exceed 970 billion. new technology.
Yuntu officially releases the high-end domain control chip YTM32B1H, the highest safety car-grade chip is strong
On August 8, 2023, Suzhou Yuntu Semiconductor Co., Ltd. (hereinafter referred to as "Yuntu Semiconductor") released the latest generation of domain controller chips YTM32B1H series, covering automotive power, intelligent chassis, functional safety controllers, domain controllers, etc. In the field of application, samples and development boards have been provided to target customers.
The mass production of Yuntu YTM 32 B 1 H series products marks that Yuntu Semiconductor has completed another milestone step in the development of high-safety, high-reliability, and high-consistency MCU products. The YTM32B1H series is a high-performance automotive-grade MCU with multiple Cortex-M7 cores, and supports high-bandwidth and highly reliable on-chip embedded flash memory, supports ASIL-D functional safety certification and complies with AEC-Q100 Auto-Grade 1 level.
Main technical indicators of YTM 32 B 1 H x :
The new wave of smart cars, superimposed on the rise of Chinese car companies, especially created rapid development opportunities for local car chip companies with weak foundations. China will continue to occupy a leading position in the smart electric vehicle track, and the trend of localization of chips is irreversible, while the localization rate in the field of automotive MCUs is still in single digits, and the main applications are concentrated in the field of body control, power, chassis, and auxiliary equipment. These "incremental market" applications such as driving are almost blank, and they still face the risk of being "stuck" by international giants at any time. In order to break through this situation, Yuntu Semiconductor is aiming at the mid-to-high-end market. In recent years, it has systematically improved and expanded its product matrix, vehicle specification system and ecology, and is expected to be the first to complete the full-stack layout of the domestic vehicle specification MCU / ZCU product line .
The output value of advanced ceramics in Jingdezhen from January to May reached 6.926 billion yuan!
Xinshengwei MLCC products have realized the import substitution of domestic small-scale high-capacity car-grade MLCC products; the industrialization preparation technology of silver-iridium technology's high-purity alumina powder has reached the international advanced level; Audiway ultrasonic sensors and transducer devices And other series of products are in a leading position in the domestic market... In recent years, Jingdezhen City has aimed at the commanding heights of industrial development, made use of its own resource advantages, strongly focused on project construction, and implemented innovation-driven. The advanced ceramic industry has shown a trend of vigorous development and has become the city's new economic growth point. According to statistics, as of now, there are 158 advanced ceramic enterprises in the city; from January to May, the output value of advanced ceramics in the city reached 6.926 billion yuan, a year-on-year increase of 190.8%. The city pays attention to top-level design, carefully compiled the "Jingdezhen City Advanced Ceramics Industry Development Plan (2022-2025)", proposed to focus on the two major application fields of communication electronics and new energy, and cultivate the "2" in the four application fields of aerospace and biomedicine. +4" industrial development direction, planning to build Changnan New District International Advanced Ceramics Industry Cooperation Park, High-tech Zone Production-Education Integration Base, Fuliang County Advanced Ceramics Industrial Park and other advanced ceramics industry platforms. After more than a year of construction, a total of 1.8 million square meters of standardized workshops have been built in the city's advanced ceramics industrial park, and another 1.7 million square meters are under construction or proposed.
A 135 GBps/Gbit 0.66 pJ/bit Stacked Embedded DRAM with Multilayer Arrays by Fine Pitch Hybrid Bonding and Mini-TSV.
Xi’an UniIC Semiconductors, Xi’an, ChinaUniversity of Science and Technology of China, Hefei, China
Abstract:
For the first time, multilayer die stack using fine hybrid bonding (HB) with mini-TSV stacking technology is presented and demonstrated for stacked embedded DRAM (SeDRAM). The daisy chains in the multilayer structure with over ten thousand TSVs and bonds were tested and demonstrated the good bonding, stacking quality and reliability. We fabricated LPDD4/4X product by the SeDRAM, with 2048 I/O of 541 Mbps per Gbit, achieving a bandwidth of 135 GBps and power efficiency of 0.66 pJ/bit, exhibiting the improvement of 27.7X for bandwidth and 83% for power efficiency compared to HBM3. Besides, we also put forward the x-test to achieve normal testing and TSV quality judgment.
Interesting company entering the field of LED UV lithography, pretty high power UVLED light sources. Hopefully they could supply to SMEE in the future.
Zhangjiagang Qidian Optoelectronics Technology Co., Ltd. is a high-tech enterprise in the field of optoelectronics jointly funded by the Chongqing Institute of Green and Intelligent Technology of the Chinese Academy of Sciences, the Zhangjiagang government and the scientific research team of the Chinese Academy of Sciences. Innovative technology is applied to exposure machine equipment to produce the world's leading UVLED exposure machine module products. The application of this product in the PCB printed circuit board industry has broken the monopoly of high-end exposure equipment by Europe and Japan. The company is further expanding its business field, entering the field of LCD liquid crystal panels and even the field of semiconductor integrated circuits in five years, and
Zhangjiagang Qidian Optoelectronics Technology Co., Ltd. is a high-tech enterprise in the field of optoelectronics jointly funded by the Chongqing Institute of Green and Intelligent Technology of the Chinese Academy of Sciences, the Zhangjiagang government and the scientific research team of the Chinese Academy of Sciences. Innovative technology is applied to exposure machine equipment to produce the world's leading UVLED exposure machine module products. The application of this product in the PCB printed circuit board industry has broken the monopoly of high-end exposure equipment by Europe and Japan. The company is further expanding its business field, entering the field of LCD liquid crystal panels and even the field of semiconductor integrated circuits in five years, and
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