Chinese semiconductor industry
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The high-end process of domestic RF front-end modules is accelerating, and Huatian Technology's L-PAMiD SiP package helps domestic RF modules break through
Over the past decade or so, the communication capabilities of mobile phones have undergone tremendous changes. On the one hand, the communication standard has changed from a specific design for regions and operators to a "global communication" design, and on the other hand, communication technology has evolved from 2G to 5G. The continuous upgrading of radio frequency devices supporting communication functions such as antennas, switches and low-noise amplifiers (LNAs). With the improvement of mobile phone intelligence, the communication frequency bands, interactive channels that need to be supported increase, and the bandwidth becomes larger. The number and function requirements of RF front-end devices are greatly increased. The RF front-end solutions in mobile phones are increasingly integrated, miniaturized, and modularized. Highly integrated RF front-end modules are the general trend.
Huatian Technology DSMBGA package mass production is coming soon, helping the domestic RF front-end to go further
After the arrival of 5G, mobile terminals need to support more frequency bands. Moreover, 5G defines the ultra-high frequency (UHB) frequency band above 3GHz and below 6GHz, which puts forward higher requirements for the performance of the RF front-end. The number of RF front-end modules in a single mobile phone continues to increase. The single-sided SiP is gradually unable to meet the miniaturization requirements of limited space. DSMBGA (Double Side Molding BGA) double-sided plastic encapsulation BGA SiP process has come to the stage and has gradually become the future development direction of industry technology.
DSMBGA is mainly used in the field of RF front-end modules. After the original single-sided SiP module is made into double-sided, the overall size of the module is reduced by more than 20%, the product thickness is only increased by less than 0.2mm, and multiple frequency bands are integrated. The implementation of a module can better meet the mobile phone's requirements for a smaller module size and more comprehensive performance.
With the steady progress of domestic RF front-end modules towards the highest level of integration, the simultaneous development of advanced packaging technology that can match it in China is also imminent.
Huatian Technology has started the R&D and production of RF PA product packaging technology since 2015, and its customers cover major domestic PA design companies. From the early 2G/3G/4G PA to the 5G PA module packaging in the past two years, it has maintained the leading position and major market share of domestic packaging manufacturers.
In the field of RF front-end modules, as early as 2019, Huatian Technology cooperated with customers to carry out the packaging process research and development and engineering sample trial production of 5G L-PAMiF and L-FEM module sets. For the special material and bump structure of GaAs FC die, which are prone to high risk points of UBM crack and bump crack, Huatian Technology based on the guidance of internal simulation data and accumulated experience in packaging single discrete RF devices for many years, from substrate design, plastic packaging material selection, The continuous and stable printing of ultra-thin stencil small-particle solder paste, chemical washing process matching, and plastic sealing process optimization have made breakthroughs in many technical problems, successfully ensuring the first mass production of 5G L-PAMiF and L-FEM modules in China. At present, more than 100 million pieces have been shipped in total, and no customer complaints about abnormal product quality have occurred. The performance of the customer's products is excellent, comparable to the products of international competitors, and it is also the first to enter the supply chain of mobile phone brands such as Samsung and vivo.
Even with that, I feel like you still need to start with bauxite. It just happens that the waste from bayer process produces some waste that still contains small amount of Gallium, so you can try to extract even more. So, this really just shows China has a lot of tech/experience on mineral extraction/processing + has industrial basis for it. Replicating it anywhere is difficult.
by the way, it's encouraging to see that China actually also use other people's bauxite. If you look at this diagram
China imports a whole lot of Bauxite from Guinea. It's a really mineral rich country. Maybe that's why there is interest in a military base there. Of course, I have no idea if Guinea bauxite has the same quantity of gallium in them. Most likely they do not (based on usgs sources). But here is something natsec hawks haven't looked into. Where China is getting its gallium extracted from, because they think they will have no problem getting gallium.
The longer they stay in the dark, the better.
so over the next few months, we will see how hard this ga and ge sanction gets enforced. Both could shut down iphone production. Ga could destroy America's RF industry. Ge could stop TSMC advanced node production and research. But we probably won't know for a while.
Geocore Technology received nearly 100 million yuan in round B financing for new product research and development investment, marketing and team building
A few days ago, Dixin Technology completed the B-round financing of nearly 100 million yuan , which was jointly completed by Runcheng Capital, Zhonghai Investment, Zhongrun Investment, and Shenzhen High-tech Investment. This round of financing will be used for investment in new product research and development, marketing and team building, and will further enhance product competitiveness and brand value.
The core advantage is obvious, and it is favored by capital to complete the round B financing of nearly 100 million yuan
Geocore Technology was established in 2018 and received angel round financing in 2019. So far, Geocore Technology has always been deeply involved in technological innovation and chip research and development in the field of high-end analog and RF chips with the attitude of "down-to-earth, pioneering and innovative core", and has successively released Geocore Popular series 4G/5G communication transceiver chips, multi-frequency and multi-mode RF power amplifier GC0643 based on Geocore Yunteng technology platform, etc., have formed and completed the three major product line layouts of wireless communication transceiver chips , RF front-end chips and analog signal chain chips Shipped in batches of tens of millions, the customer base covers leading manufacturers in many fields such as wireless communications, industrial electronics, and the Internet of Things.
The wireless communication transceiver chip product line is the core technology product line of Dixin Technology. It has a comprehensive self-developed IP technology platform. Among them, Dixin Fengxing series products are rich and scalable. The unique low-power technology is industry-leading and the power consumption is greatly reduced . while achieving cost optimization . The products are widely used. The ultra-broadband category can cover a variety of 4G/5G communication equipment, including small base stations, repeaters, digital micro-distribution, etc.; the broadband category can support high-definition image transmission, high-speed Internet of Things 5G Redcap, satellite communication, and Internet of Vehicles V2X and other new application scenarios; narrowband can be applied to private network communication equipment such as walkie-talkies, industrial Internet of Things terminals, etc. Geocore Technology has made a far-reaching layout in the field of wireless communication transceivers, which makes Geocore Technology highly resistant to risks in today's ever-changing market environment, and has gradually become the leading company in this subdivided track.
really nice, looks like they have a pretty solid list of products.
entered samsung & vivo supply chain
wow this is great story, took 5 month to reach million chip production rate w/ good packaging quality. It claims to be leader in mass produced RF packaging company
interesting, is this Huawei? No mention of name, June would work with timeline. advanced packaging.
working with this customer for China's most complicated packaged DSMBGA product (Double-sided, molded ball grid array). So it's important to know here that they do not actually design these products, they just work with them to package. So, maybe this is working with Hisilicon or maybe someone else.
see here on DSMBGA
why is this useful
so reduced power consumption. That's the key for all cell phone design. How to not have it overheat and use up battery
Look at this, Amkor does advanced packaging for Qorvo
Now, think about what happens if Chinese RF firms have Ga & these other guys do not?
Battered BUT still fighting that's the Huawei spirit, now after surviving the Long March they're on the attack, from my mentor and good friend @Oldschool
Today at 12:54 PMNew
Finally Huawei is involved in DUV development. Currently there are over 300 Huawei engineers are in SMEE site to help out. For a long time, I have campaigned Huawei to acquired SMEE but initially Huawei wanted to develope on its own. In 2021, Huawei stole 130 engineers from SMEE and caused trouble in SMEE and finally government stepped in and Huawei had to make guarantee that it will not try to steal SMEE engineers again. Huawei finally realized it 's too difficult to do DUV on its own and its better to work with SMEE. Huawei's Ren went to SMEE and apologized to its president. and they worked out the plan and Huawei would send in their engineers to help out SMEE.
Also, Richard Chang convinced SMIC's Liang to fully to support SMEE lithography equipments,
Oldschool
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Registered MemberToday at 12:54 PMNew
Finally Huawei is involved in DUV development. Currently there are over 300 Huawei engineers are in SMEE site to help out. For a long time, I have campaigned Huawei to acquired SMEE but initially Huawei wanted to develope on its own. In 2021, Huawei stole 130 engineers from SMEE and caused trouble in SMEE and finally government stepped in and Huawei had to make guarantee that it will not try to steal SMEE engineers again. Huawei finally realized it 's too difficult to do DUV on its own and its better to work with SMEE. Huawei's Ren went to SMEE and apologized to its president. and they worked out the plan and Huawei would send in their engineers to help out SMEE.
Also, Richard Chang convinced SMIC's Liang to fully to support SMEE lithography equipments,
Also, Richard Chang convinced SMIC's Liang to fully to support SMEE lithography equipments,
To follow up on my previous post, it's good that we hear nothing from Liang Mong Song, it only means that he is hard at work verifying SMEE machine and using it for his research on N+2 and N+3 chip.
To follow up on my previous post, it's good that we hear nothing from Liang Mong Song, it only means that he is hard at work verifying SMEE machine and using it for his research on N+2 and N+3 chip.
What a waste of time and resources!
Sometime (actually very often) proudness makes you blind.
I didn't know this detail, actually in 2021 things were already very bad, Huawei really should have read the times much better, and government should have stepped in much earlier.
China is now risking big with the 1/2 years of delay that SMEE has in product development and production ramp up. This will cause big trouble in case of an ASML full ban, that I think is quite realistic: US has nothing to lose from full banning ASML, and Ducth government already proved weak and caved in to pressure.
If this is really what happened, then China should have played its cards better.
So true bro, BUT not only Huawei, the blame should be shared by other semi company like Huahong and SMIC for ignoring SMEE. The gov't can only do so much and they can't control the business decision of these company. So in a way these sanction is a heaven sent and the immediate danger you mentioned may force them to adapt quickly and innovate.
good news, Loongson 3A6000 completed taping out and its performance looks to be better than what was projected last year. Last year, it anticipated 45/35 score for SpecInt 2006 (float/Int)
It actually scored 54.6/43.1 for float/int in actual testing.
Now compared to Intel 10 in performance.
This will have to be the top performing domestic CPU outside of whatever Huawei develops
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