Chinese semiconductor industry

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tokenanalyst

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The leader in the industrialization of domestic high-end ion implanters - Kaishitong made a wonderful appearance at the 2023 World Semiconductor Conference​


The 2023 World Semiconductor Conference was held in Nanjing International Expo Center, Jiangsu. As a leader in the industrialization of high-end domestic ion implanters, Zhang Changyong, deputy general manager of Kaishitong, delivered a keynote speech on "Industrial Development of Kaishitong Ion Implanters", focusing on the research and development model and industrialization process of Kaishitong's domestic high-end ion implanters.

Zhang Changyong introduced that the localization rate of semiconductor equipment is still in a non-linear improvement range. In addition to the natural expansion of the industry scale, the driving force for the growth of domestic semiconductor equipment manufacturers also includes domestic substitution in the domestic market. The current domestic equipment coverage of 28nm and more mature processes is improving day by day, and actively promoting new process breakthroughs. Domestic semiconductor equipment is in the growth stage of intensive verification and the start of large-scale production.

Kaishitong's domestic high-end ion implanter industrialization is in the leading position. Low-energy and high-beam ion implanters are the key core equipment for advanced logic and memory chip manufacturing, accounting for about 60% of the ion implanter market segment, and high-energy and medium-beam ion implanters each account for 20%. Kaishitong is currently the only domestic supplier that truly realizes the full coverage of the 28nm low-energy ion implantation process, and is the first to complete the verification of the high-energy ion implanter production line.

The technical team of Kaishitong adheres to the "one step ahead" research and development strategy, adheres to the concept of positive development, starts from the "first principle", closely follows the needs of customers, and improves the equipment to keep pace with the times according to the differences in different processes and applications of customers. Keystone has created a complete technical system of "general platform + key technology modularization + precise realization of product serialization" including basic technology and application technology, realizing variable speed control, isotropic scanning and other advanced control functions required by more advanced processes above 28nm.

In the future, Kaishitong will continue to take the security of the integrated circuit industry chain and supply chain as its own responsibility, practice the concept of continuous improvement of CIP, continue to expand the upper limit of technology, continue to improve industrialization capabilities, and help customers increase mass production.

The guests from the semiconductor industry chain listened carefully to Zhang Changyong’s report. The marketing staff of Kaistone had a friendly discussion with the on-site partners. They will take this opportunity to strengthen exchanges and cooperation with the industry, expand their business network, and talk about the integrated circuit industry’s “core bond, new future”.

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Chuangyao Technology: High-precision ADC chip testing has been completed and is expected to be shipped this year​


Recently, Chuangyao Technology released the investor exchange minutes to disclose that at present, more than 10 companies support customers' dual-mode chips to pass the inspection. The bidding price of State Grid's dual-mode modules is roughly the same as that of single-mode modules, but as a core IP provider, the company's single-module value will increase slightly, and the corresponding gross profit margin will increase slightly.
Chuangyao Technology said that in the first half of 2023, the inventory level of major customers of the access network is still at a high level. It is expected that this situation will improve by the second half of 2023, and the company's shipment rate will increase accordingly.
Starlight is a kind of wireless short-distance communication technology, and wireless short-distance communication technology refers to the communication technology with a communication distance within tens of meters. Compared with mainstream wireless short-distance communication technologies such as Bluetooth and WiFi, Starlight has the characteristics of low latency, high reliability, synchronization accuracy, and high security.
On July 1 this year, at the Sail Summit of the International Starlight Wireless Short-range Communication Alliance held in Shenzhen, Chuangyao Technology released two chips that support SLB technology and SLE technology and their development boards, which can be applied to intelligent applications in cockpit, home, terminal, manufacturing and other scenarios. The company hopes to enter the market from high-end wireless consumer electronics products. The company will have related IoT products in the second half of 2023.
Chuangyao Technology said that the company aims to launch an integrated 7-channel high-precision ADC chip for ultra-high-precision analog-to-digital conversion. At present, the second-generation sample of this high-speed, high-precision ADC chip has been returned to the chip, and the test of this chip has been basically completed. It is expected to achieve small batch shipment in 2023, and it will be applied in the measurement switch on the distribution network side. The launch of this chip is expected to realize domestic substitution of high-speed, high-precision ADC chips from foreign chip manufacturers in the field of power information collection. The launch of this ADC chip will enrich the company's product layout in the field of smart grids and have a positive impact on the company's subsequent development in related fields.

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Shenghejingwei J2B plant delivered and used the first batch of nationally produced equipment to help the expansion of multi-chip integrated packaging projects.​


On July 20, 2023, Shenghe Jingwei Semiconductor (Jiangyin) Co., Ltd. ("Shenghe Jingwei") held the move-in ceremony of the first batch of production equipment for the J2B plant, marking the completion of the second-phase production plant expansion project of Shenghe Jingwei's Jiangyin manufacturing base and putting it into use.
The first batch of equipment moved in covers the main process links of wafer-level advanced packaging such as exposure, development, electroplating, cleaning, plasma sputtering, thinning and polishing, and inspection and measurement. It is worth mentioning that at the beginning of Shenghejingwei’s establishment in 2015, all the production equipment for the first 12-inch mid-section bumping (Bumping) processing line came from overseas suppliers, and the first batch of equipment for this 3D multi-chip integrated packaging production line came from domestic equipment manufacturers. Adhering to the concept of adhering to high-precision technical standards, ensuring first-class production quality, and providing excellent manufacturing services, on the basis of strict process verification and quality acceptance, Shenghe Jingwei cooperates closely with supply chain partners to continuously improve the diversification level of the supply chain, thereby enhancing the resilience of the supply chain guarantee for high-performance multi-chip integrated processing business, and will better meet the long-term, stable and high-quality service requirements of high-quality customers at home and abroad.
The move-in of the first batch of equipment means that the J2B plant has been officially delivered and put into production and operation, which will timely and effectively guarantee the company's production capacity expansion and further technological innovation and development needs. "We will actively cooperate with domestic suppliers and partners, and at the same time continue to open up the procurement of overseas production equipment to ensure the safety of the supply chain, and strive to provide domestic and foreign customers with reassuring and satisfied OEM services." Mr. Cui Dong, chairman and CEO of Shenghe Jingwei, said.

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Significant progress has been made in the field of new memory where microelectronics is located​


With the rise of artificial intelligence and the Internet of Things, data is exploding. It is inevitable to develop memory with faster access speed and higher storage density. Resistive variable memory (RRAM) has attracted extensive attention due to its simple two-terminal structure, easy three-dimensional integration, excellent scalability, high speed, and low power consumption.

　　In order to realize the high-density integration of RRAM, the three-dimensional cross-array structure becomes the best choice. However, there is a crosstalk effect in the three-dimensional interleaved array, and the self-selecting resistive memory with high nonlinearity can effectively suppress the crosstalk problem. The higher the non-linearity of the self-selecting RRAM, the more conducive to suppressing crosstalk; the higher the on-state current, the more conducive to improving the access speed. However, it is difficult to simultaneously realize high on-state current and high nonlinearity in self-selectable on-resistive memory proposed at present.

　　In response to this problem, the team of Academician Liu Ming of the Institute of Microelectronics proposed a non-filament self-selectable on-resistive memory based on the structure of TiN/TiO x N y /TiO x /NbO x /Ru , and realized it on a 16 -layer three-dimensional vertical structure. The memory achieves a 50 -fold increase in on-state current density and achieves high nonlinearity (>5000) . The formation of peak-like barriers inside TiO x effectively improves the nonlinearity of the device. The first-principles calculation results show that the oxygen vacancy aggregation energy of Nb 2 O 5 is positive, which indicates that the oxygen vacancies are not easy to aggregate, and the device can work at a higher current without breakdown, thereby achieving a high current density. Due to the increased current, the read latency of the device is reduced to 18ns . This work provides a possible way to realize 3D VRRAM with high speed and high density.

　　This achievement was selected into the 2023 VLSI with the title "16-layer 3D Vertical RRAM with Low Read Latency (18ns), High Nonlinearity (>5000) and Ultra-low Leakage Current (~pA) Self-Selective Cells" . Ding Yaxin, a doctoral student at the Institute of Microelectronics, is the first author, and Researcher Luo Qing from the Institute of Microelectronics and Professor Xue Kanhao from Huazhong University of Science and Technology are the corresponding authors.

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Localization of the ETC charging field is realized, and Loongson processors can be used from the terminal to the server.​


The "Domestic Autonomous Lane Controller" was developed by Sichuan Intelligent Transportation System Management Co., Ltd., based on the Loongson 2K1000LA processor, and has been used in pilot applications at several toll stations in the expressway networked toll system in Sichuan Province. Its successful development marks a new breakthrough in the localization of my country's expressway digital construction.

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tphuang

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Nanjing Guobo electronics achieving 5G GaN chips & modules last August

It was said to build a 20 million GaN chips/modules producing per year, solving China's mobile communication chip needs

Based on first page, RF infrastructure was only a $777 million business in 2022. So if Guobo alone can produce 20 million chips a year, it would be pretty big total already. Since CETC is also producing it and quite likely other Chinese players will too. I think if they cut off these 4 large Western fabs, they can take the market
Click to expand...

btw, in case you need to know the link between 5G & military usage.

Guobo electronics is also considered China's 雷达TR组件龙头
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their stock page on xueqiu
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So yes, if Chinese gov't made the decision to hit hard with Ga & Ge sanctions, it needs to do this all the way. No end product can reach America, Japan or Netherlands. While it is probably hard to achieve 100% prevention, they can definitely make it scarce enough that the commercial business of Wolfspeed & Qorvo would be starved of resources.

公司基于设计、工艺和测试三大平台，开发了 T/R 组件、射频模块等产品，其中 T/R 组件全部 为军品，射频模块主要为民品；在射频芯片领域，公司基于核心技术开发了射频放大类芯片、射频控制类芯片 等产品，射频芯片产品主要为民品。公司产品覆盖军用与民用领域，是目前国内能够批量提供有源相控阵 T/R 组 件及系列化射频集成电路相关产品的领先企业。
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So yeah, T/R modules are all for military product & RF modules are for civilian products. Looks like they are a fabless company, probably fabbing is done by a fellow CETC institute or linked company. 55th Institute controls 55% of their stocks

公司军用领域客户主要包括中国航空工业集团、中国航天科工集团、中 国
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集团、中国电子科技集团、中国电子信息产业集团，公司对第一大客户的销售占比高达 47.51%，主 要销售产品为 T/R 组件；民用领域主要客户为国内通信设备龙头，其 5G 基站水平世界领先，发货量已超过 120 万个，占全球 5G 市场份额的 50%以上，其为公司的第二大客户，销售占比高达 27.15%，公司对其销售的主要 产品为射频集成电路。
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Their top customer is for mainly supplying T/R Modules, accounting for 47.51% of sales. My guess is that's CETC itself
Second largest customer is mainly supplying RT modules, accounting for 27.15% of sales, mostly RF ICs. They already sold over 1.2million 5G base station chips, accounting for > 50% of market
my guess is T/R modules accounted for more than 50% of its sales

2021 年，公司经营状况恢复正常，实现营业收入 25.09 亿元，同比增长 13.40%， 实现归母净利润 3.68 亿元，同比增长 19.46%，随着疫情防控对公司生产影响的减小，以及下游军工通信和 5G 基站需求的持续放量，公司业绩有望进一步高速增长。
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2021 revenue was 2.5B RMB, up 13.4% YoY
To put things into perspective, Qorvo's 2021 revenue was $4.6B, but they also sold a lot of other stuffx
From
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, the entire 2022 RF GaN market was only $1.3B with military being $477m.
so if Guobo's 2022 revenue is 3.46B RMB as stated here, that's almost $500m. Not sure what % of its revenue is GaN though
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They talked extensively in there about importance of GaN to miniaturization and more power. Here is a photo of missile AESA seeker (this is not available in other countries AAMs from what I recall)
art

有源相控阵雷达导引头凭借灵敏度较高、信号处理能力较强、可靠性较高等特点，未来将逐步替代无源相 控阵雷达，成为弹载武器的倍增器。
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Goes without saying, AESA seeker with advanced signal processing + higher reliability & target discrimination leads to significantly improved capabilities

雷达在导航、通信、遥感等卫星中均发挥了重要作用。导航方面，毫米波有源相控阵天线可以使卫星具备 更强的目标搜索和定位能力，进而能为各型武器系统、特别是弹道导弹提供定位服务
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Also radar using AESA antennas have significant usage in navigation, communication & remote sensing and such
advantage of miniaturization, light weight, agile beam, wide angle scanning, low power loss makes AESA GaN seeker ideal

Back to 5G and RF
GaN（氮化镓）射频器件能够实现小尺寸大功率，是未来的发展趋势，但 GaAs 砷化镓的市场占比将在中期保持稳定。在射频前端应用中，硅基 LDMOS 器件和砷化镓(GaAs)仍是主流器件，氮化镓(GaN)的高频特性要 优于砷化镓(GaAs)和 LDMOS。LDMOS 只能用于 3.5GHz 以下的应用，砷化镓虽然可以做到 40GHz，但所能提 供的功率非常有限，需要多级放大叠加才能达到功率指标，
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LDMOS is only able to do sub 3.5GHz band and not the 6GHz band that China recently auctioned off. GaN is much better for that space

Looks like I also need to look into 国基北方, because they are another provider of T/R modules for the military
 
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Official ASML Statutory Interim Report 2023

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DUV demand still exceeds supply. While we have seen delays in DUV demand from some customers, it has been compensated by strong demand for tools at mature and mid-critical nodes, particularly in China.
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Total sales of new lithography systems (up to July) 142 -> 203 +43% YoY
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On June 30, 2023, the Dutch government has published new regulations regarding export controls of semiconductor
equipment, which will come into effect on September 1, 2023. These new export controls focus on advanced chip
manufacturing technology, including the most advanced deposition and immersion lithography systems. Due to these
export control regulations, ASML will need to apply for export licenses with the Dutch government for all shipments of
its most advanced immersion DUV lithography systems (TWINSCAN NXT:2000i and subsequent immersion systems).
The Dutch government will determine whether to grant or deny the required export licenses and provide further
details to the company on any conditions that apply
Click to expand...

For some reason in the official ASML statement still only the DUVi NXT:2000i or better machines are mentioned as object of the ban.....interesting.... For reference, these are the machines able to go down to 7nm nodes....the 28nm machines seem not affected by the ban...we will see (I have doubts).


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