Focusing on semiconductor front-end measurement equipment, URP has completed round A financing of nearly 100 million yuan
The semiconductor front-end process measurement equipment company Uruipu completed the A round of financing of nearly 100 million yuan. Honghu Capital, Hangzhou Menghe, Jingning Ling'an and others followed suit. This round of financing will be used for the development and mass production of new products. The company also announced the opening of Wuxi Technology Center and Shanghai Jinqiao R&D Center.
URP was established in 2021 and is committed to creating high-quality semiconductor front-end measurement equipment.
Semiconductor measurement equipment is mainly used for defect detection and parameter measurement in semiconductor manufacturing processes, and is widely used in silicon wafer manufacturing, chip manufacturing, and advanced packaging fields, such as critical dimension measurement equipment, film thickness measurement equipment, defect detection equipment, etc. The front-end process measurement equipment has exceeded the market size of tens of billions of dollars. The more advanced manufacturing process also expands the demand for measuring equipment, bringing more new market space for measuring equipment.
URP has independently developed Fourier transform infrared spectroscopy measurement equipment dedicated to semiconductors, which can be used to measure the thickness and uniformity of epitaxial layers, element concentrations, and silicon impurity content, etc.
In terms of products, Eos200Lite, the Europa FTIR equipment, can be used to measure the thickness and uniformity of the epitaxial layer of silicon carbide epitaxial wafers. At present, it has received orders from many leading silicon carbide-based epitaxial factories; Eos200/200, Eos300/300 are used for silicon-based epitaxial wafers Epitaxial layer thickness and element concentration measurement equipment has also received orders from a number of leading silicon-based epitaxy factories and FAB factories.
Recently, the company's silicon carbide automatic optical dislocation micropipe detection equipment SICD series was delivered to customers, which can be used for dislocation and micropipe defect detection of silicon carbide substrates. According to Dr. Tang Deming, general manager of URP, compared with domestic equipment with similar functions, the detection speed of SICD equipment has increased several times.