Chinese semiconductor industry
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The latest display breakthrough! Xiamen University built the world's first G2.5 MicroLED laser mass transfer demonstration line
Reported on the 2nd that at SID Display Week 2023 a few days ago, the laser mass transfer technology achievements jointly developed by Xiamen University, Xiamen Future Display Technology Research Institute and cooperative units were exhibited. The Xiamen Future Display Technology Research Institute is presided over by the research team of Professor Zhang Rong of Xiamen University. It has now built the world's first 23.5-inch (G2.5, 370mm×470mm) Micro-LED mass transfer process demonstration line . At present, Micro-LED chip products for multi-application scenarios and high-performance display have been developed, and a high-yield, high-efficiency laser mass transfer full-chain process has been developed to realize the lighting of monochrome and full-color chip arrays.
Moiré-Based Alignment Using Centrosymmetric Grating Marks for High-Precision Wafer Bonding
School of Instrumentation Science and Engineering, Harbin Institute of Technology, Harbin 150001, China
State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China
Department of Precision Engineering, School of Engineering, The University of Tokyo, Bunkyo, Tokyo 113-8656, Japan
Abstract
High-precision aligned wafer bonding is essential to heterogeneous integration, with the device dimension reduced continuously. To get the alignment more accurately and conveniently, we propose a moiré-based alignment method using centrosymmetric grating marks. This method enables both coarse and fine alignment steps without requiring additional conventional cross-and-box alignment marks. Combined with an aligned wafer bonding system, alignment accuracy better than 300 nm (3σ) was achieved after bonding. Furthermore, the working principle of the moiré-based alignment for the backside alignment system was proposed to overcome the difficulty in bonding of opaque wafers. We believe this higher alignment accuracy is feasible to satisfy more demanding requirements in wafer-level stacking technologies.
Founded in 2015, Jiyi Technology is a semiconductor equipment company focusing on providing plasma equipment and vacuum thermal technology equipment for the integrated circuit industry. The company's main products include plasma stripping machines, plasma etching machines (for the third-generation semiconductor industry), and plasma cleaning machines. The product lines are widely used in silicon-based chip manufacturing, compound chip manufacturing, LED chip manufacturing, and semiconductor chip manufacturing. Packaging and medical electronics
Break the foreign monopoly! CMP equipment manufacturer Zhongsi Technology appeared at Jiwei Summit
According to the news from Jiwei.com, on June 2-3, 2023, the 7th Jiwei Semiconductor Summit with the theme of "Taking Potential, Knowing the Way, Going Healthy and Seeking Future" was grandly held at Xiamen International Conference Center Hotel.
At this summit, Hangzhou Zhongsi Electronic Technology Co., Ltd., which focuses on the field of high-end chemical mechanical planarization (CMP) equipment, participated in this semiconductor enterprise exhibition and demonstrated its new generation of 8-inch CMP equipment and 12-inch CMP equipment to semiconductor peers. equipment.
Hangzhou Zhongsi Electronic Technology Co., Ltd. (referred to as "Zhongsi Technology") was established in May 2018. It is mainly engaged in the R&D, manufacturing and sales of high-end chemical mechanical planarization (CMP) equipment, providing high-quality solutions for the semiconductor industry and other advanced technology fields. technology and efficient service. Zhongsi Technology has gathered high-end talents at home and abroad, has a professional technical research and development team, and has gradually developed into one of the few manufacturers in China that has the ability to develop 6-inch, 8-inch, and 12-inch full-process processes and implement CMP equipment.
The (TENMS200S) 8-inch advanced CMP equipment developed by the company has obtained the SEMI certification of the international semiconductor industry. As a new generation of 8-inch CMP equipment, Zhongsi Technology TENMS200S CMP has high reliability, advanced automatic control software, and small footprint. It can be applied to Si/STI/ILD/Poly/Si/W/Cu and other processes.
On the basis of 8-inch CMP equipment, through independent innovation, Zhongsi Technology has developed the first 12-inch CMP equipment TTAI300 CMP that can support both 3-reel and 2-reel processes. The equipment adopts a brand-new compact structure of 6x independent grinding modules and 2x independent cleaning modules, which has higher process flexibility and better process compatibility, and can be applied to all high-end processes below 90nm. In the process of chip production, it provides reliable The advantages of high maintenance, high production efficiency, and low comprehensive use cost can not only save costs but also speed up research and development.
According to the news from Jiwei.com, on June 2-3, 2023, the 7th Jiwei Semiconductor Summit with the theme of "Taking Potential, Knowing the Way, Going Healthy and Seeking Future" was grandly held at Xiamen International Conference Center Hotel.
At this summit, Hangzhou Zhongsi Electronic Technology Co., Ltd., which focuses on the field of high-end chemical mechanical planarization (CMP) equipment, participated in this semiconductor enterprise exhibition and demonstrated its new generation of 8-inch CMP equipment and 12-inch CMP equipment to semiconductor peers. equipment.
Hangzhou Zhongsi Electronic Technology Co., Ltd. (referred to as "Zhongsi Technology") was established in May 2018. It is mainly engaged in the R&D, manufacturing and sales of high-end chemical mechanical planarization (CMP) equipment, providing high-quality solutions for the semiconductor industry and other advanced technology fields. technology and efficient service. Zhongsi Technology has gathered high-end talents at home and abroad, has a professional technical research and development team, and has gradually developed into one of the few manufacturers in China that has the ability to develop 6-inch, 8-inch, and 12-inch full-process processes and implement CMP equipment.
The (TENMS200S) 8-inch advanced CMP equipment developed by the company has obtained the SEMI certification of the international semiconductor industry. As a new generation of 8-inch CMP equipment, Zhongsi Technology TENMS200S CMP has high reliability, advanced automatic control software, and small footprint. It can be applied to Si/STI/ILD/Poly/Si/W/Cu and other processes.
On the basis of 8-inch CMP equipment, through independent innovation, Zhongsi Technology has developed the first 12-inch CMP equipment TTAI300 CMP that can support both 3-reel and 2-reel processes. The equipment adopts a brand-new compact structure of 6x independent grinding modules and 2x independent cleaning modules, which has higher process flexibility and better process compatibility, and can be applied to all high-end processes below 90nm. In the process of chip production, it provides reliable The advantages of high maintenance, high production efficiency, and low comprehensive use cost can not only save costs but also speed up research and development.
On that China Telecom large data center to be built in Lingang area using domestic GPUs
Oh look, you can build a nice data center with Huawei, Enflame, Tianshu, Cambrian & MetaX GPUs. No need for Nvidia. As Nvidia continues to be restricted in what it can sell in China, Chinese data centers will just shift to domestic GPUs. I would imagine Huawei will be far and away the largest supplier here among domestic GPU makers.
Oh look, you can build a nice data center with Huawei, Enflame, Tianshu, Cambrian & MetaX GPUs. No need for Nvidia. As Nvidia continues to be restricted in what it can sell in China, Chinese data centers will just shift to domestic GPUs. I would imagine Huawei will be far and away the largest supplier here among domestic GPU makers.
TSMC is in a dilemma as it is unable to recruit qualified employees but at the same time labor laws in the US probably give it a hard time. Arizona plants would be most inefficient and not going to be profitable unless buyers are willing to pay extra.
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