Chinese semiconductor industry

tphuang said:

Please, Log in or Register to view URLs content!

more on S70
important things that Moore Threads hve done

this is pretty cool, they make it easy to port all the CUDA process to MUSA. This makes it easy going forward for applications to use Moore Threads GPUs, cause there is already a lot of libraries written for CUDA and it's well integrated with various frameworks.


Other thing is that Moore threads software is improving. Now it supports over 60 games, 50 motherboards and 30 displays. And this has been done in half a year through 5 upgrades.

It's not close to being competitive to the latest Nvidia GPUs, but it is improving very quickly and they have produced now numerous GPUs for different markets

Click to expand...

All new game were designed around CUDA at the beginning. So Moore threads and Nvidia are in totally different situation now. In Nvidia‘s case，it is the game developer that bears responsibility to optimize the game and release patchs to better suit Nvidia GPU. In Moore threads's case，it is the GPU maker bears responsibility to optimize the card to better suit games.

I don't think this mode can sustain. Because there is just too many games out there，and too many new games being released every day. GPU maker can not possibility do the optimization work for every game.

Tuojing Technology’s(Piotech) 20 million capital increase, Xinmi Technology for expansion of upstream investment layout in Fuchuang Precision.​

It is noteworthy that Tuojing Technology has jointly invested with China Micro Shanghai, a wholly subsidiary of China Micro Corporation (688012.SH), a related party, with a total investment of 30 million yuan . Roughly calculated, in this capital increase, the overall valuation of Xinmi Technology is 1.28 billion yuan. Prior to this, Xinmi Technology has introduced Shenzhen Venture Capital Group, Hushan Capital and other institutions.

Tuojing Technology said that Xinmi Technology is one of the suppliers of the company's sealing rubber rings, and the capital increase to Xinmi Technology will further promote the coordinated development of the industry, enhance the stability of the upstream supply chain, and help the implementation of the company's strategic plan.

The Changjiang Business Daily reporter noticed that in addition to this investment in Xinmi Technology, in 2022 Tuojing Technology will also increase its capital to Hengyunchang with its own funds of 20 million yuan, and subscribe for Fuchuang Precision.

According to the data, Xinmi Technology, which Tuojing Technology participated in the investment, integrates R&D, design, manufacturing, and sales capabilities. It provides high-performance perfluorinated sealing rings and sealing components for customers in the semiconductor and LCD panel industries, and occupies a leading position in the domestic market. status. According to the official website of Xinmi Technology, the company was established in January 2020, with an investment of 70 million yuan in the first phase, and it will be officially mass-produced in August 2020.

Also participating in this capital increase is AMEC Shanghai, a wholly-owned subsidiary of AMEC. China Micro Shanghai will subscribe for 10 million yuan in the new registered capital of 393,658 yuan in Xinmi Technology, and obtain 0.7813% of the equity of Xinmi Technology after this capital increase. The two will invest a total of 30 million yuan in Xinmi Technology. Roughly calculated, in this capital increase, the overall valuation of Xinmi Technology is 1.28 billion yuan.

Financial data show that in 2022 and the first quarter of 2023, Xinmi Technology will achieve operating income of 43.44 million yuan and 25.40 million yuan respectively, net profit attributable to the parent of 5.54 million yuan and 2.35 million yuan, and net profit after deducting non-recurring gains and losses of 5.48 million yuan. Yuan, 2.3 million yuan.

It is noteworthy that since China Micro Corporation is the major shareholder of Tuojing Technology with more than 5% of the shares, China Micro Shanghai is a wholly-owned subsidiary of China Micro Corporation. Therefore, Tuojing Technology and China Micro Shanghai jointly invest in Xinmi Technology, which constitutes a related transaction.

For this transaction, Tuojing Technology said that sealing rings are one of the main consumables for semiconductor wafer manufacturing plants. With the growth of the semiconductor industry, the demand for sealing rubber rings will also show an increasing trend. Xinmi Technology is one of the suppliers of the company's sealing rubber rings. This time, the company and related parties jointly increase capital to Xinmi Technology, which is in line with the company's current strategic layout and has a synergistic effect with the main business. It will further promote the coordinated development of the industry and enhance The stability of the upstream supply chain facilitates the implementation of the company's strategic planning.
----

Net profit increased by 552% in the first quarter due to high market demand With the good development momentum of the domestic semiconductor industry, Tuojing Technology actively expands the industrial chain and enhances the company's comprehensive competitiveness.

Tuojing Technology said that the company continues to expand the application field of thin film series products mainly based on PECVD, ALD, SACVD and HDPCVD, and has obtained repeat orders and new customer orders from existing customers in logic chips, memory chips and other fields. As of the end of 2022, the company's sales orders in hand amounted to 4.602 billion yuan (excluding Demo orders), and the amount of signed sales orders in 2022 was 4.362 billion yuan (excluding Demo orders). Growth provides a strong guarantee.

Since the beginning of this year, the performance growth of Tuojing Technology has accelerated. In the first quarter, the company realized operating income of 402 million yuan, a year-on-year increase of 274.24%; net profit and net profit after deducting non-existing expenses were 53.7188 million yuan and 19.6427 million yuan, a year-on-year increase of 552.25% and 190.69%.

nice round up of 3 major IGBT related projects that got announced this week

1st is the SMECS fabs that was announced earlier. 4.2B RMB for a 10k wpm line that will act as domestic verification & validation

公告显示，该项目总投资42亿元，用于建设一条集研发和月产1万片12寸集成电路特色工艺晶圆小规模工程化、国产验证及生产验证的中试实验线。

Please, Log in or Register to view URLs content!

表示，项目计划于2023年完成中试线建设

Click to expand...

looks like based on the language here, this will use domestic tools and it will complete construction of this test line by the end of the year

And on top of that they are looking to build a 100k wpm phase 3 production line with 22.2B capex. With that level of capex, it would seem to be targeting dry process. They already have 2.5m 8-inch wafer production capacity per year and able to produce 6million large power modules. So, adding another 100k 12-inch wpm would double their existing capacity.

SMECS in Q1 saw revenue increase 65.79%

Silan micro's new plant in Fumen will produce 300k 12-inch wafers per year (so about 25k wpm). To start production in Dec 2024.

本次建设利用现有12英寸厂房FAB1，在厂房二层和三层预留区域新增生产设备。其中，二层为工艺技术下夹层，三层预留区域主要布置光刻（LITHO）、刻蚀（ETCH）、湿法刻蚀（WET）、扩散（DIFF）、薄膜（TFD/TFM）、离子注入（IMP）等。共计使用建筑面积17748.48平方米，工艺面积计4000平方米

Click to expand...

is wet etching only possible if they are doing immersive process? So tht means Silan is moving to the 40 to 55nm segment?

Silan had 15k wpm 12-inch igbt at end of 2022 and looking to raise that to 20k wpm by Q2

InvSemi signed agreement with Hefei gov't to build 10 IGBT + 5 SIC MOS production line for NEVs, solar energy & home electronics
When complete, it will produce 4.8 million IGBT modules & 600k SIC MOS modules per year. InvSemi has received investment from Midea, Xiaomi and others. when complete, this could generate 1.5B RMB/year

At end of March, it hd 47 IC layouts & 84 patents. Mainland used for industrial motor drives, home appliances, inverters, power systems & NEVs and such

Has anyone heard of InvSemi (芯能半导体)?

Core Technology: CAPiC platform helps the rise of domestic advanced packaging, and is committed to promoting the industrialization of CHIPLET​

At the "First Jiwei Semiconductor Manufacturing Summit and Industry Chain Breakthrough Award Ceremony" held on the first day, Zhang Zhong, the deputy general manager of Jiangsu Xinde Semiconductor Technology Co., Ltd. With the theme of "Packaging All-Aspect Solutions", he shared the basic situation of the company, the industrial chain, and the technical positioning of the company, and deeply analyzed the R&D layout and industrialization development of Chiplet in the Chiplet direction.

Committed to becoming the world's advanced packaging company is launching the last round of financing before IPO

It is well known that advanced packaging is critical to the semiconductor industry. In recent years, advanced packaging such as 2.5D/3D represents the latest packaging technology, and core design concepts such as chiplets have developed rapidly.

It is understood that Xinde Technology was established in 2020. It is a high-end semiconductor packaging and testing technology company that grew up in Nanjing. Its main business is mid-to-high-end packaging and testing of semiconductor integrated circuits. The company's core management and R&D teams have been deeply involved in the chip integrated circuit industry for more than 20 years, and are committed to providing first-class packaging technology service companies for domestic and foreign customers. , At present, the company has successfully imported more than 100 domestic and foreign customers, and has obtained the certification of many domestic first-line terminal manufacturers.

Zhang Zhong introduced that since its establishment in September 2020, Xinde Technology has quickly formulated a detailed wiring plan, and achieved mass production of QFN, CSP, and LGA/SIP products in just 9 months.

So Jen Huang is visiting China this month. Given Nvidia are 100% dependent on TSMC, while Chinese companies are willfully (and arguably negligently) fully dependent on Nvidia for AI-training hardware, I am super curious about the contents of those coming talks.

CMP said:

So Jen Huang is visiting China this month. Given Nvidia are 100% dependent on TSMC, while Chinese companies are willfully (and arguably negligently) fully dependent on Nvidia for AI-training hardware, I am super curious about the contents of those coming talks.

Click to expand...

Eh, Nvidia has heavy competition from Huawei, as seen from things like the Citic Securities report about AI datacentres. There are plenty of Chinese companies opting for Huawei's chips and systems over Nvidia's.

measuredingabens said:

Eh, Nvidia has heavy competition from Huawei, as seen from things like the Citic Securities report about AI datacentres. There are plenty of Chinese companies opting for Huawei's chips and systems over Nvidia's.

Click to expand...

Good. Looking forward to the day when Nvidia can be treated like Micron has been.

tokenanalyst said:

View attachment 113731

Click to expand...

This seems to be the first product confirmation of planar grating-based immersion measurement system by U-precision. I wonder if they’ve combined it with their maglev motor stage to test the complete workpiece table. Did you find this image from their website?

Chinese car companies are way too dependent on Western chip imports for their own good.

tokenanalyst said:

Talking of competition, interesting would be when ASICs to train large language models start to appears on the market. It could be like with bitcoin when ASICs become dominant and crashed the prices of GPUs.

View attachment 113775

Click to expand...

I think there are already ASICS for this called DLP (deep learning professors). This sort of ASIC was pioneered by Chinese researchers in 2014.

From what I understand, it's basically reduce precision from 32/64 bit to 8-16 bit and you can have way more parallelism.

Google TPU is a US example but only Google adopted it in 2017. The DianNao was the first Chinese one in 2014 and it's been improving since then.